IL137778A0 - Automatic inspection system with stereovision - Google Patents

Automatic inspection system with stereovision

Info

Publication number
IL137778A0
IL137778A0 IL13777899A IL13777899A IL137778A0 IL 137778 A0 IL137778 A0 IL 137778A0 IL 13777899 A IL13777899 A IL 13777899A IL 13777899 A IL13777899 A IL 13777899A IL 137778 A0 IL137778 A0 IL 137778A0
Authority
IL
Israel
Prior art keywords
stereovision
inspection system
automatic inspection
automatic
inspection
Prior art date
Application number
IL13777899A
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Publication of IL137778A0 publication Critical patent/IL137778A0/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/239—Image signal generators using stereoscopic image cameras using two 2D image sensors having a relative position equal to or related to the interocular distance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G06T2207/10012—Stereo images
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20076—Probabilistic image processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/246—Calibration of cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N2013/0074—Stereoscopic image analysis
    • H04N2013/0081—Depth or disparity estimation from stereoscopic image signals

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
IL13777899A 1998-12-19 1999-12-17 Automatic inspection system with stereovision IL137778A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9828109.0A GB9828109D0 (en) 1998-12-19 1998-12-19 Inspection equipment and methods of inspection
PCT/US1999/030206 WO2000038494A2 (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision

Publications (1)

Publication Number Publication Date
IL137778A0 true IL137778A0 (en) 2001-10-31

Family

ID=10844634

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13777899A IL137778A0 (en) 1998-12-19 1999-12-17 Automatic inspection system with stereovision

Country Status (8)

Country Link
EP (1) EP1057390A2 (en)
JP (1) JP2003522347A (en)
KR (1) KR20010040998A (en)
AU (1) AU3342500A (en)
CA (1) CA2321096A1 (en)
GB (1) GB9828109D0 (en)
IL (1) IL137778A0 (en)
WO (1) WO2000038494A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1220596A1 (en) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
WO2003005793A2 (en) * 2001-07-04 2003-01-16 Koninklijke Philips Electronics N.V. Choice of reference markings for enabling fast estimating of the position of an imaging device
JP4596422B2 (en) * 2005-05-20 2010-12-08 キヤノンマシナリー株式会社 Imaging device for die bonder
KR101155816B1 (en) 2005-06-17 2012-06-12 오므론 가부시키가이샤 Image processing device and image processing method for performing three dimensional measurements
JP2009514234A (en) * 2005-10-31 2009-04-02 サイバーオプティクス コーポレーション Electronic assembly machine with built-in solder paste inspection
WO2009094489A1 (en) * 2008-01-23 2009-07-30 Cyberoptics Corporation High speed optical inspection system with multiple illumination imagery
CN101614679B (en) * 2008-06-27 2011-06-22 上海纺印印刷包装有限公司 Quality detection device for concave-convex printed product
JP5809628B2 (en) * 2009-09-22 2015-11-11 サイバーオプティクス コーポレーション High speed optical inspection system with camera array and compact built-in illuminator
US8670031B2 (en) 2009-09-22 2014-03-11 Cyberoptics Corporation High speed optical inspection system with camera array and compact, integrated illuminator
US8872912B2 (en) * 2009-09-22 2014-10-28 Cyberoptics Corporation High speed distributed optical sensor inspection system
US8894259B2 (en) 2009-09-22 2014-11-25 Cyberoptics Corporation Dark field illuminator with large working area
US8388204B2 (en) 2009-09-22 2013-03-05 Cyberoptics Corporation High speed, high resolution, three dimensional solar cell inspection system
US8681211B2 (en) 2009-09-22 2014-03-25 Cyberoptics Corporation High speed optical inspection system with adaptive focusing
JP5465062B2 (en) * 2010-03-31 2014-04-09 名古屋電機工業株式会社 Substrate appearance inspection apparatus and substrate appearance inspection method
KR101160663B1 (en) * 2010-10-21 2012-06-28 한국원자력연구원 Three Dimensional Visualization of Stereo X-ray Images based on Volume Reconstruction
US9595094B2 (en) * 2011-11-14 2017-03-14 Ev Group E. Thallner Gmbh Measuring form changes of a substrate
US20140198185A1 (en) * 2013-01-17 2014-07-17 Cyberoptics Corporation Multi-camera sensor for three-dimensional imaging of a circuit board
US11176635B2 (en) * 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
US10126252B2 (en) * 2013-04-29 2018-11-13 Cyberoptics Corporation Enhanced illumination control for three-dimensional imaging
US9743527B2 (en) 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9707584B2 (en) 2014-07-09 2017-07-18 Nordson Corporation Dual applicator fluid dispensing methods and systems
CN106290423B (en) * 2016-10-18 2024-04-05 同方威视技术股份有限公司 Method, device and system for scanning imaging
JP6831478B2 (en) * 2017-12-07 2021-02-24 ヤマハ発動機株式会社 Work device to be mounted
CN113692215A (en) * 2021-07-30 2021-11-23 广州佳帆计算机有限公司 System, method and device for adjusting position of patch element

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978224A (en) * 1987-07-14 1990-12-18 Sharp Kabushiki Kaisha Method of and apparatus for inspecting mounting of chip components
EP0301255A1 (en) * 1987-07-30 1989-02-01 Siemens Aktiengesellschaft Three-dimensional position recognition of component pins for automatic insertion
JP2714277B2 (en) * 1991-07-25 1998-02-16 株式会社東芝 Lead shape measuring device

Also Published As

Publication number Publication date
EP1057390A2 (en) 2000-12-06
WO2000038494A3 (en) 2000-09-14
AU3342500A (en) 2000-07-12
GB9828109D0 (en) 1999-02-17
CA2321096A1 (en) 2000-06-29
WO2000038494A8 (en) 2000-10-26
WO2000038494A2 (en) 2000-06-29
KR20010040998A (en) 2001-05-15
JP2003522347A (en) 2003-07-22

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