CN113692215A - System, method and device for adjusting position of patch element - Google Patents
System, method and device for adjusting position of patch element Download PDFInfo
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- CN113692215A CN113692215A CN202110876257.3A CN202110876257A CN113692215A CN 113692215 A CN113692215 A CN 113692215A CN 202110876257 A CN202110876257 A CN 202110876257A CN 113692215 A CN113692215 A CN 113692215A
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- 239000000463 material Substances 0.000 claims abstract description 100
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000007599 discharging Methods 0.000 abstract description 6
- 238000004364 calculation method Methods 0.000 abstract description 3
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
Abstract
The embodiment of the application discloses a system, a method and a device for adjusting the position of a patch element. According to the technical scheme provided by the embodiment of the application, the image collector, the processor, the first material taking device and the second material taking device are arranged, any one of the patch elements on the discharging table is clamped by the first material taking device and placed in the adjusting area, the image collector collects image signals of the patch elements on the adjusting area and sends the image signals to the processor, the processor processes the image signals to obtain an image contour, the image contour is compared with a prestored reference image, the coincidence degree between the image contour and the reference image is obtained through calculation, when the coincidence degree is lower than a threshold value, the first material taking device is controlled to adjust the position of the patch element in the adjusting area, when the coincidence degree is larger than the threshold value, the patch element on the adjusting area of the second material taking device is controlled to be conveyed to the patch machine, and automatic azimuth adjustment of the patch element on the discharging table is realized, the manufacture of the printed circuit board is more reliable.
Description
Technical Field
The embodiment of the application relates to the technical field of printed circuit board manufacturing, in particular to a system, a method and a device for adjusting the position of a patch element.
Background
A mounter or a surface mounting system is a device that accurately places a surface mounted component on a PCB pad by moving a mounting head after the mounter is disposed behind a dispenser or a screen printer in a production line.
In the process before the chip mounting of the chip mounter, a material feeding link for a chip mounting element is involved. In traditional technique, often supply the paster component by the manual work, because the number of paster component numbers is numerous on the feeding platform, by workman manual input, the paster component on the feeding platform often puts in disorder. The printed circuit board needs to integrate various components, the placement position of each component is required, and if the angle and the direction of the component picked up in the feeding platform are not controlled, the printed circuit board is affected.
Disclosure of Invention
The embodiment of the application provides a system, a method and a device for adjusting the position of a patch element, so as to automatically adjust the angle and the direction of the patch element.
In a first aspect, an embodiment of the present application provides a system for adjusting a position of a patch element, including an image collector, a processor, a first material extractor and a second material extractor, where the first material extractor and the second material extractor are installed on a material placing table, the material placing table is used for bearing the patch element to be conveyed to a patch machine, the material placing table is further provided with an adjusting area, the image collector, the first material extractor and the second material extractor are all connected to the processor, and the first material extractor is used for clamping any one of the patch elements on the material placing table to be placed in the adjusting area; the image collector is used for collecting image signals of the patch elements on the adjusting area and sending the image signals to the processor; the processor is used for processing the image signal to obtain an image outline, comparing the image outline with a prestored reference image, calculating to obtain the contact ratio between the image outline and the reference image, and controlling the first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, so that the second material taking device is controlled to clamp the patch element in the adjusting area and convey the patch element to the patch machine when the contact ratio is higher than the threshold value.
Furthermore, a pressure sensor is arranged on the adjusting area and connected with the processor, the pressure sensor is used for detecting in-place signals of the patch elements on the adjusting area and sending the in-place signals to the processor, and the processor is used for controlling the image collector to collect image signals of the patch elements when receiving the in-place signals.
The system further comprises an upper computer, wherein the upper computer is connected with the processor and is used for outputting a processing instruction to the processor so that the processor outputs a first material taking instruction to the first material taking device.
In a second aspect, an embodiment of the present application provides a patch element position adjustable method, including:
outputting a first clamping signal to enable the first material taking device to take any one of the patch elements from the material placing table to be placed in the adjusting area;
acquiring an image signal of a patch element in an adjusting area, and processing the image signal to obtain an image contour corresponding to the image signal;
and comparing the image outline with a pre-stored reference image, calculating to obtain the contact ratio between the image outline and the reference image, and controlling the first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, so that the second material taking device is controlled to clamp the patch element in the adjusting area and convey the patch element to a chip mounter when the contact ratio is greater than the threshold value.
Further, the comparing the image profile with a pre-stored reference image to calculate and obtain the coincidence degree between the image profile and the reference image includes:
overlapping the image contour with a pre-stored reference image, and comparing whether the image contour is completely overlapped with the reference image;
when the image contour and the reference image are not completely overlapped, the coincidence degree between the image contour and the reference image is calculated.
Further, after the step of overlaying the image contour with a pre-stored reference image and comparing whether the image contour and the reference image are completely overlapped, the method further includes:
when the image contour is completely overlapped with the reference image, selecting two positions from the reference image as a first comparison point and a second comparison point respectively, selecting a position overlapped with the first comparison point from the image signal as a first comparison position, and selecting a position overlapped with the second comparison point from the image signal as a second comparison position;
and respectively comparing the first comparison position with the first comparison point, comparing the second comparison position with the second comparison point, and controlling the first material taking device to take the patch elements in the adjustment area to challenge the placing angle and position of the patch elements in the modulation area when the first comparison position is inconsistent with the first comparison point and/or the second comparison position is inconsistent with the second comparison point.
Further, the method also comprises the following steps:
receiving a processing instruction from an upper computer;
the processing instruction of the upper computer is generated by inputting an instant processing signal by a user or automatically generated when a pre-stored processing signal meets a trigger condition.
In a third aspect, embodiments of the present application provide a patch element position adjustable device, including:
a signal output module: the first clamping device is used for outputting a first clamping signal so that the first material taking device can clamp any one patch element from the material placing table and place the patch element in the adjusting area;
an image acquisition module: the image signal processing device is used for acquiring an image signal of a patch element in an adjusting area and processing the image signal to obtain an image outline corresponding to the image signal;
an image comparison module: and the position adjusting device is used for comparing the image outline with a pre-stored reference image, calculating and obtaining the contact ratio between the image outline and the reference image, controlling the first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, and controlling the second material taking device to clamp the patch element in the adjusting area and convey the patch element to the chip mounter when the contact ratio is greater than the threshold value.
Further, the comparing the image profile with a pre-stored reference image to calculate and obtain the coincidence degree between the image profile and the reference image includes:
overlapping the image contour with a pre-stored reference image, and comparing whether the image contour is completely overlapped with the reference image;
when the image contour and the reference image are not completely overlapped, the coincidence degree between the image contour and the reference image is calculated.
Further, after the step of overlaying the image contour with a pre-stored reference image and comparing whether the image contour and the reference image are completely overlapped, the method further includes:
when the image contour is completely overlapped with the reference image, selecting two positions from the reference image as a first comparison point and a second comparison point respectively, selecting a position overlapped with the first comparison point from the image signal as a first comparison position, and selecting a position overlapped with the second comparison point from the image signal as a second comparison position;
and respectively comparing the first comparison position with the first comparison point, comparing the second comparison position with the second comparison point, and controlling the first material taking device to take the patch elements in the adjustment area to challenge the placing angle and position of the patch elements in the modulation area when the first comparison position is inconsistent with the first comparison point and/or the second comparison position is inconsistent with the second comparison point.
Further, the method also comprises the following steps:
receiving a processing instruction from an upper computer;
the processing instruction of the upper computer is generated by inputting an instant processing signal by a user or automatically generated when a pre-stored processing signal meets a trigger condition.
In a fourth aspect, embodiments of the present application provide a patch element position adjustable device, including: a memory and one or more processors;
the memory for storing one or more programs;
when executed by the one or more processors, cause the one or more processors to implement a patch element position adjustment method as described in the second aspect.
In a fifth aspect, the present application provides a storage medium containing computer-executable instructions for performing the patch element position adjustment method according to the second aspect when executed by a computer processor.
According to the embodiment of the application, the image collector, the processor, the first material taking device and the second material taking device are arranged, any one of the patch elements on the discharging table is clamped through the first material taking device and placed to the adjusting area, the image collector collects image signals of the patch elements on the adjusting area, the image signals are sent to the processor, the processor processes the image signals to obtain an image outline, the image outline is compared with a pre-stored reference image, the coincidence degree between the image outline and the reference image is obtained through calculation, the first material taking device is controlled to carry out position adjustment on the patch elements in the adjusting area when the coincidence degree is lower than a threshold value, so that when the coincidence degree is greater than the threshold value, the second material taking device is controlled to automatically clamp the patch elements on the adjusting area and convey the patch elements to the patch machine, and automatic grabbing and clamping of the patch elements on the discharging table are realized, The automatic orientation adjustment further makes the manufacture of the printed circuit board more stable and reliable.
Drawings
Fig. 1 is a schematic structural diagram of a patch element position adjustment system according to an embodiment of the present disclosure;
fig. 2 is a flowchart of a method for adjusting a position of a patch element according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a patch element position adjustment device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a patch element position adjustable device according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, specific embodiments of the present application will be described in detail with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some but not all of the relevant portions of the present application are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
The embodiment of the application provides a system, a method, a device, equipment and a storage medium for adjusting the position of a patch element. According to the embodiment of the application, the image collector, the processor, the first material taking device and the second material taking device are arranged, any one of the patch elements on the discharging table is clamped through the first material taking device and placed to the adjusting area, the image collector collects image signals of the patch elements on the adjusting area, the image signals are sent to the processor, the processor processes the image signals to obtain an image outline, the image outline is compared with a pre-stored reference image, the coincidence degree between the image outline and the reference image is obtained through calculation, the first material taking device is controlled to carry out position adjustment on the patch elements in the adjusting area when the coincidence degree is lower than a threshold value, so that when the coincidence degree is greater than the threshold value, the second material taking device is controlled to automatically clamp the patch elements on the adjusting area and convey the patch elements to the patch machine, and automatic grabbing and clamping of the patch elements on the discharging table are realized, The automatic orientation adjustment further makes the manufacture of the printed circuit board more stable and reliable.
The following are detailed below.
Fig. 1 shows a schematic structural diagram of a system for adjusting a position of a chip component according to an embodiment of the present disclosure, and as shown in fig. 1, the system for adjusting a position of a chip component includes an image collector 101, a processor 102, a first material extractor 103 and a second material extractor 104, where the first material extractor 103 and the second material extractor 104 are mounted on a material placing table, the material placing table is used for holding a chip component to be conveyed to a chip mounter, the material placing table is further provided with an adjusting area, the image collector 101, the first material extractor 103, and the second material extractor 104 are all connected to the processor 102, and the first material extractor 103 is used for picking up any one of the chip components on the material placing table and placing the chip component in the adjusting area; the image collector 101 is configured to collect an image signal of the patch element on the adjustment area, and send the image signal to the processor 102; the processor 102 is configured to process the image signal to obtain an image profile, compare the image profile with a pre-stored reference image, calculate an overlap ratio between the image profile and the reference image, and control the first material taking device 103 to perform position adjustment on the patch element in the adjustment area when the overlap ratio is lower than a threshold value, so that the second material taking device 104 is controlled to take in and pick up the patch element in the adjustment area and convey the patch element to the chip mounter when the overlap ratio is higher than the threshold value.
In the above, the first and second dispensers 103 and 104 may be the same apparatus, and may be generally configured by a robot arm, a gripping member, and the gripping of the gripping member, the movement of the robot arm, the rotation, and the like may be controlled by the processor 102 of the embodiment. The image collector 101 is used for collecting images of patch elements in the embodiment, and the image collector 101 starts image collection operation when receiving processing instructions of the processor 102.
The placement station is in an embodiment a table, or feeder, for receiving a plurality of chip elements. Usually, patch elements of the same type are installed in a production line node, so that patch elements on the same discharge table are always of the same type. When the system starts to work, the processor 102 sends a first material taking command to the first material taking device 103, and the first material taking device 103 picks up any one of the patch elements from the material placing table to a specified position, which is the adjustment area of the embodiment. The adjusting area is used for bearing a patch element, and image acquisition and position adjustment of the patch element are carried out in the adjusting area. The processor 102 sends an acquisition instruction to the image acquirer 101, and at this time, the image acquirer 101 starts to acquire images after receiving the acquisition instruction. The image collector 101 is typically mounted in the upper region of the adjustment region to facilitate the collection of the overall view of the patch element over the adjustment region. After the image signal is collected by the image collector 101, the image signal is transmitted to the processor 102, and the processor 102 further processes the image signal by an algorithm.
Specifically, a reference image is prestored in the internal memory of the processor 102, and the reference image is a standard image of the same model as the patch element on the current placement area, which means that the position, the direction and the angle of the reference image are standard and meet the manufacturing requirements of the printed circuit board. Therefore, the reference image is used as a standard for reference, and image signals of patch elements subsequently placed in the adjusting area and subjected to image acquisition are compared, so that the position of the patch elements with deviation in position is adjusted. In the processor 102, the reference image and the image contour are overlapped, whether the image contour is consistent with the reference image or not is compared, and when the image contour is not completely overlapped with the reference image, the overlapping degree between the image contour and the reference image is calculated.
It is further preferable that a pressure sensor 105 is disposed on the adjustment area, the pressure sensor 105 is connected to the processor 102, the pressure sensor 105 is configured to detect an in-position signal of the patch element on the adjustment area, when the first picker 103 picks up the patch element and places the patch element on the adjustment area, the pressure sensor 105 can detect that the patch element is in the in-position on the adjustment area and send the in-position signal to the processor 102, and the processor 102 is configured to control the image picker 101 to pick up an image signal of the patch element when receiving the in-position signal.
Preferably, the embodiment further includes an upper computer 106, the upper computer 106 is connected to the processor 102, and the upper computer 106 is configured to output a processing instruction to the processor 102, so that the processor 102 outputs a first material taking instruction to the first material taking device 103. The upper computer is, for example, a computer, a server, an intelligent terminal, or other intelligent devices that can generate processing instructions and can output the processing instructions.
Fig. 2 is a flowchart of a method for adjusting a position of a patch element according to an embodiment of the present disclosure, where the method for adjusting a position of a patch element according to an embodiment of the present disclosure may be performed by a patch element position adjusting device, and the patch element position adjusting device may be implemented by hardware and/or software and integrated in a patch element position adjusting apparatus.
The following description will be given taking an example in which the patch element position adjusting device performs the patch element position adjusting method. Referring to fig. 2, the patch element position adjustable method includes:
201: and outputting a first clamping signal to enable the first material taking device to take any one of the patch elements from the material placing table to be placed in the adjusting area.
The first clamping signal is generated by the processor, and when the first material taking device receives the first clamping signal, the first material taking device starts to work, and a patch element is taken from the material placing table and placed in the adjusting area. Similarly, the placement table is a table top, or a feeder, for receiving a plurality of chip components.
202: and acquiring an image signal of the patch element in the adjusting area, and processing the image signal to obtain an image contour corresponding to the image signal.
For example, a pressure sensor may be disposed in the adjustment area, and when the first picker grips the patch element and is disposed in the adjustment area, the pressure sensor may detect that the patch element is disposed above, generate a bit signal, and send the bit signal to the processor, thereby triggering the next operation of the processor. And the processor controls the image collector to work according to the in-place signal, collects the image signal of the patch element in the adjusting area, and performs algorithm processing on the collected image signal to obtain an image outline.
203: and comparing the image outline with a pre-stored reference image, calculating to obtain the contact ratio between the image outline and the reference image, and controlling the first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, so that the second material taking device is controlled to clamp the patch element in the adjusting area and convey the patch element to a chip mounter when the contact ratio is greater than the threshold value.
The threshold value is a value set according to historical data or experience, and when the coincidence degree is greater than the value, the arrangement position of the patch element in the adjusting area is basically consistent with the reference image, namely, the requirement of manufacturing the printed circuit board is met.
Preferably, the step of calculating and obtaining the coincidence degree between the image contour and the reference image based on the comparison between the image contour and a pre-stored reference image comprises: overlapping the image contour with a pre-stored reference image, and comparing whether the image contour is completely overlapped with the reference image; when the image contour and the reference image are not completely overlapped, the coincidence degree between the image contour and the reference image is calculated.
Further, after the image contour and a pre-stored reference image are stacked and compared to determine whether the image contour and the reference image are completely overlapped, the method further includes:
when the image contour is completely overlapped with the reference image, selecting two positions from the reference image as a first comparison point and a second comparison point respectively, selecting a position overlapped with the first comparison point from the image signal as a first comparison position, and selecting a position overlapped with the second comparison point from the image signal as a second comparison position; and respectively comparing the first comparison position with the first comparison point, comparing the second comparison position with the second comparison point, and controlling the first material taking device to take the patch elements in the adjustment area to challenge the placing angle and position of the patch elements in the modulation area when the first comparison position is inconsistent with the first comparison point and/or the second comparison position is inconsistent with the second comparison point.
And respectively finding two position points from the reference image and the image outline as comparison points, determining whether a difference exists between the reference image and the image outline by comparing the two comparison points under the condition that the outlines of the outer frames are consistent, and indicating that the direction of the patch element needs to be adjusted when one of the comparison points is inconsistent.
Embodiments may further include the steps of:
and receiving a processing instruction from the upper computer. The processing instruction of the upper computer is generated by inputting an instant processing signal by a user or automatically generated when a pre-stored processing signal meets a trigger condition. And when the processor receives the processing instruction, the processor controls the first material taking device to take the patch element.
Fig. 3 illustrates a patch element position adjustable device provided in an embodiment of the present application, which includes a signal output module 301, an image acquisition module 302, and an image comparison module 303. The signal output module 301 is configured to output a first clamping signal, so that the first material taking device clamps any one of the patch elements from the material placing table and places the patch element in the adjusting area; an image acquisition module 302, configured to acquire an image signal of a patch element in an adjustment area, and process the image signal to obtain an image contour corresponding to the image signal; and the image comparison module 303 is configured to compare the image contour with a pre-stored reference image, calculate to obtain a contact ratio between the image contour and the reference image, and control the first material taking device to adjust the position of the patch element in the adjustment area when the contact ratio is lower than a threshold value, so that when the contact ratio is greater than the threshold value, the second material taking device is controlled to clamp the patch element in the adjustment area and convey the patch element to the patch machine.
As a preferred embodiment, the image comparison module 303 compares the image contour with a pre-stored reference image, and calculates and obtains a coincidence ratio between the image contour and the reference image, including: overlapping the image contour with a pre-stored reference image, and comparing whether the image contour is completely overlapped with the reference image; when the image contour and the reference image are not completely overlapped, the coincidence degree between the image contour and the reference image is calculated.
Further, the method also comprises the following steps:
when the image contour is completely overlapped with the reference image, selecting two positions from the reference image as a first comparison point and a second comparison point respectively, selecting a position overlapped with the first comparison point from the image signal as a first comparison position, and selecting a position overlapped with the second comparison point from the image signal as a second comparison position; and respectively comparing the first comparison position with the first comparison point, comparing the second comparison position with the second comparison point, and controlling the first material taking device to take the patch elements in the adjustment area to challenge the placing angle and position of the patch elements in the modulation area when the first comparison position is inconsistent with the first comparison point and/or the second comparison position is inconsistent with the second comparison point.
As shown in fig. 4, an embodiment of the present application further provides a patch element position adjustable device, including: a memory 401 and one or more processors 402; the memory 401 is used for storing one or more programs; when executed by the one or more processors 402, cause the one or more processors to implement a patch element position adjustment method as described herein.
Embodiments of the present application also provide a storage medium containing computer-executable instructions, which when executed by a computer processor, are configured to perform the patch element position adjusting method provided in the above embodiments, the patch element position adjusting method including: outputting a first clamping signal to enable the first material taking device to take any one of the patch elements from the material placing table to be placed in the adjusting area; acquiring an image signal of a patch element in an adjusting area, and processing the image signal to obtain an image contour corresponding to the image signal; comparing the image outline with a pre-stored reference image, calculating to obtain the contact ratio between the image outline and the reference image, controlling a first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, and controlling a second material taking device to clamp the patch element in the adjusting area and convey the patch element to a chip mounter when the contact ratio is higher than the threshold value
Storage medium-any of various types of memory devices or storage devices. The term "storage medium" is intended to include: mounting media such as CD-ROM, floppy disk, or tape devices; computer system memory or random access memory such as DRAM, DDR RAM, SRAM, EDO RAM, Lanbas (Rambus) RAM, etc.; non-volatile memory such as flash memory, magnetic media (e.g., hard disk or optical storage); registers or other similar types of memory elements, etc. The storage medium may also include other types of memory or combinations thereof. In addition, the storage medium may be located in a first computer system in which the program is executed, or may be located in a different second computer system connected to the first computer system through a network (such as the internet). The second computer system may provide program instructions to the first computer for execution. The term "storage medium" may include two or more storage media that may reside in different locations, such as in different computer systems that are connected by a network. The storage medium may store program instructions (e.g., embodied as a computer program) that are executable by one or more processors.
Of course, the storage medium provided in this embodiment of the present application contains computer-executable instructions, and the computer-executable instructions are not limited to the patch element position adjustment method described above, and may also perform related operations in the patch element position adjustment method provided in any embodiment of the present application.
The patch element position adjusting device, the apparatus and the storage medium provided in the above embodiments may perform the patch element position adjusting method provided in any embodiments of the present application, and reference may be made to the patch element position adjusting method provided in any embodiments of the present application without detailed technical details described in the above embodiments.
The foregoing is considered as illustrative of the preferred embodiments of the invention and the technical principles employed. The present application is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present application has been described in more detail with reference to the above embodiments, the present application is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present application, and the scope of the present application is determined by the scope of the claims.
Claims (10)
1. A system capable of adjusting the position of a patch element is characterized by comprising an image collector, a processor, a first material taking device and a second material taking device, wherein the first material taking device and the second material taking device are arranged on a material placing table, the material placing table is used for bearing the patch element to be conveyed to a patch machine, an adjusting area is further arranged on the material placing table, the image collector, the first material taking device and the second material taking device are all connected with the processor, and the first material taking device is used for clamping any one patch element on the material placing table to be placed in the adjusting area; the image collector is used for collecting image signals of the patch elements on the adjusting area and sending the image signals to the processor; the processor is used for processing the image signal to obtain an image outline, comparing the image outline with a prestored reference image, calculating to obtain the contact ratio between the image outline and the reference image, and controlling the first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, so that the second material taking device is controlled to clamp the patch element in the adjusting area and convey the patch element to the patch machine when the contact ratio is higher than the threshold value.
2. A patch element position adjustable system according to claim 1, wherein the adjustment area is provided with a pressure sensor, the pressure sensor is connected to the processor, the pressure sensor is configured to detect an in-place signal of the patch element on the adjustment area and send the in-place signal to the processor, and the processor is configured to control the image collector to collect an image signal of the patch element when receiving the in-place signal.
3. A patch element position adjustment system according to claim 2, further comprising a host computer connected to the processor, the host computer being configured to output a processing command to the processor, so that the processor outputs a first picking command to the first picker.
4. A method of adjusting the position of a patch element, comprising:
outputting a first clamping signal to enable the first material taking device to take any one of the patch elements from the material placing table to be placed in the adjusting area;
acquiring an image signal of a patch element in an adjusting area, and processing the image signal to obtain an image contour corresponding to the image signal;
and comparing the image outline with a pre-stored reference image, calculating to obtain the contact ratio between the image outline and the reference image, and controlling the first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, so that the second material taking device is controlled to clamp the patch element in the adjusting area and convey the patch element to a chip mounter when the contact ratio is greater than the threshold value.
5. A patch element position adjustment method according to claim 4, wherein said calculating a degree of coincidence between the image profile and the reference image based on the comparison of the image profile with a pre-stored reference image comprises:
overlapping the image contour with a pre-stored reference image, and comparing whether the image contour is completely overlapped with the reference image;
when the image contour and the reference image are not completely overlapped, the coincidence degree between the image contour and the reference image is calculated.
6. A patch element position adjustment method according to claim 5, wherein said overlaying of the image profile with a pre-stored reference image, comparing whether the image profile and the reference image are completely overlapped, further comprises:
when the image contour is completely overlapped with the reference image, selecting two positions from the reference image as a first comparison point and a second comparison point respectively, selecting a position overlapped with the first comparison point from the image signal as a first comparison position, and selecting a position overlapped with the second comparison point from the image signal as a second comparison position;
and respectively comparing the first comparison position with the first comparison point, comparing the second comparison position with the second comparison point, and controlling the first material taking device to take the patch elements in the adjustment area to challenge the placing angle and position of the patch elements in the modulation area when the first comparison position is inconsistent with the first comparison point and/or the second comparison position is inconsistent with the second comparison point.
7. A patch element position adjustment method according to claim 4, further comprising:
receiving a processing instruction from an upper computer;
the processing instruction of the upper computer is generated by inputting an instant processing signal by a user or automatically generated when a pre-stored processing signal meets a trigger condition.
8. A patch element position adjustable device, comprising:
a signal output module: the first clamping device is used for outputting a first clamping signal so that the first material taking device can clamp any one patch element from the material placing table and place the patch element in the adjusting area;
an image acquisition module: the image signal processing device is used for acquiring an image signal of a patch element in an adjusting area and processing the image signal to obtain an image outline corresponding to the image signal;
an image comparison module: and the position adjusting device is used for comparing the image outline with a pre-stored reference image, calculating and obtaining the contact ratio between the image outline and the reference image, controlling the first material taking device to adjust the position of the patch element in the adjusting area when the contact ratio is lower than a threshold value, and controlling the second material taking device to clamp the patch element in the adjusting area and convey the patch element to the chip mounter when the contact ratio is greater than the threshold value.
9. A patch element position adjustable device, comprising: a memory and one or more processors;
the memory for storing one or more programs;
when executed by the one or more processors, cause the one or more processors to implement the patch element position adjustment method of any one of claims 4-7.
10. A storage medium containing computer-executable instructions for performing the patch element position adjustment method of any one of claims 4-7 when executed by a computer processor.
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