IL135565A0 - Compositions for the stripping of photoresists in the fabrication of integrated circuits - Google Patents
Compositions for the stripping of photoresists in the fabrication of integrated circuitsInfo
- Publication number
- IL135565A0 IL135565A0 IL13556500A IL13556500A IL135565A0 IL 135565 A0 IL135565 A0 IL 135565A0 IL 13556500 A IL13556500 A IL 13556500A IL 13556500 A IL13556500 A IL 13556500A IL 135565 A0 IL135565 A0 IL 135565A0
- Authority
- IL
- Israel
- Prior art keywords
- photoresists
- stripping
- fabrication
- compositions
- integrated circuits
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 abstract 6
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 abstract 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9905237A FR2792737B1 (fr) | 1999-04-26 | 1999-04-26 | Compositions pour le decapage de photoresists dans la fabrication de circuits integres |
Publications (1)
Publication Number | Publication Date |
---|---|
IL135565A0 true IL135565A0 (en) | 2001-05-20 |
Family
ID=9544843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL13556500A IL135565A0 (en) | 1999-04-26 | 2000-04-10 | Compositions for the stripping of photoresists in the fabrication of integrated circuits |
Country Status (14)
Country | Link |
---|---|
US (1) | US6291410B1 (zh) |
EP (1) | EP1048986B1 (zh) |
JP (1) | JP2000347423A (zh) |
KR (1) | KR20000077072A (zh) |
CN (1) | CN1130454C (zh) |
AT (1) | ATE230126T1 (zh) |
CA (1) | CA2306673A1 (zh) |
DE (1) | DE60001008T2 (zh) |
FR (1) | FR2792737B1 (zh) |
IL (1) | IL135565A0 (zh) |
MY (1) | MY135996A (zh) |
PL (1) | PL339886A1 (zh) |
SG (1) | SG90132A1 (zh) |
TW (1) | TW576952B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6276548B1 (en) * | 2000-10-05 | 2001-08-21 | David Mitchell | Collapsible basket |
FR2815359B1 (fr) * | 2000-10-17 | 2003-05-16 | Atofina | Nettoyage apres gravure d'un dielectrique associe au cuivre |
JP4532039B2 (ja) * | 2001-09-28 | 2010-08-25 | シャープ株式会社 | レジスト剥離方法及び薄膜回路素子の形成方法 |
JP3833650B2 (ja) * | 2003-12-04 | 2006-10-18 | 関東化学株式会社 | 低分子型有機el素子製造の真空蒸着工程において使用するマスクの洗浄液組成物および洗浄方法 |
JP6126551B2 (ja) * | 2013-05-20 | 2017-05-10 | 富士フイルム株式会社 | パターン剥離方法、電子デバイスの製造方法 |
EP4022395A4 (en) * | 2019-08-30 | 2023-05-31 | Dow Global Technologies LLC | PHOTOSENSITIVE RESIN STRIPPING COMPOSITION |
CN114879457A (zh) * | 2022-05-26 | 2022-08-09 | 诺而曼环保科技(江苏)有限公司 | 一种用于去除半导体生产用光刻胶的清洗剂及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5556482A (en) * | 1991-01-25 | 1996-09-17 | Ashland, Inc. | Method of stripping photoresist with composition containing inhibitor |
JP3160344B2 (ja) * | 1991-01-25 | 2001-04-25 | アシュランド インコーポレーテッド | 有機ストリッピング組成物 |
US5496491A (en) * | 1991-01-25 | 1996-03-05 | Ashland Oil Company | Organic stripping composition |
JP3048207B2 (ja) * | 1992-07-09 | 2000-06-05 | イー.ケー.シー.テクノロジー.インコーポレイテッド | 還元及び酸化電位を有する求核アミン化合物を含む洗浄剤組成物およびこれを使用した基板の洗浄方法 |
US5308745A (en) * | 1992-11-06 | 1994-05-03 | J. T. Baker Inc. | Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins |
US5407788A (en) * | 1993-06-24 | 1995-04-18 | At&T Corp. | Photoresist stripping method |
EP0782610A4 (en) * | 1994-09-23 | 1999-07-28 | Church & Dwight Co Inc | AQUEOUS CLEANER FOR METALS |
US5709756A (en) * | 1996-11-05 | 1998-01-20 | Ashland Inc. | Basic stripping and cleaning composition |
FR2764278B1 (fr) | 1997-06-09 | 1999-07-30 | Maurice Granger | Appareil distributeur de materiaux d'essuyage pouvant etre distribues sous forme non pliee |
-
1999
- 1999-04-26 FR FR9905237A patent/FR2792737B1/fr not_active Expired - Fee Related
-
2000
- 2000-04-10 IL IL13556500A patent/IL135565A0/xx unknown
- 2000-04-12 JP JP2000110636A patent/JP2000347423A/ja not_active Withdrawn
- 2000-04-20 AT AT00401105T patent/ATE230126T1/de not_active IP Right Cessation
- 2000-04-20 EP EP00401105A patent/EP1048986B1/fr not_active Expired - Lifetime
- 2000-04-20 DE DE60001008T patent/DE60001008T2/de not_active Expired - Fee Related
- 2000-04-24 KR KR1020000021574A patent/KR20000077072A/ko not_active Application Discontinuation
- 2000-04-24 US US09/556,316 patent/US6291410B1/en not_active Expired - Fee Related
- 2000-04-25 SG SG200002277A patent/SG90132A1/en unknown
- 2000-04-25 CA CA002306673A patent/CA2306673A1/fr not_active Abandoned
- 2000-04-25 PL PL00339886A patent/PL339886A1/xx unknown
- 2000-04-25 MY MYPI20001768A patent/MY135996A/en unknown
- 2000-04-26 CN CN00121756A patent/CN1130454C/zh not_active Expired - Fee Related
- 2000-04-26 TW TW089107880A patent/TW576952B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1130454C (zh) | 2003-12-10 |
US6291410B1 (en) | 2001-09-18 |
ATE230126T1 (de) | 2003-01-15 |
JP2000347423A (ja) | 2000-12-15 |
MY135996A (en) | 2008-07-31 |
SG90132A1 (en) | 2002-07-23 |
EP1048986B1 (fr) | 2002-12-18 |
KR20000077072A (ko) | 2000-12-26 |
CN1280172A (zh) | 2001-01-17 |
EP1048986A1 (fr) | 2000-11-02 |
FR2792737B1 (fr) | 2001-05-18 |
FR2792737A1 (fr) | 2000-10-27 |
PL339886A1 (en) | 2000-11-06 |
CA2306673A1 (fr) | 2000-10-26 |
DE60001008D1 (de) | 2003-01-30 |
TW576952B (en) | 2004-02-21 |
DE60001008T2 (de) | 2003-07-24 |
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