IL122493A0 - Method for laminating a shaped metal foil - Google Patents

Method for laminating a shaped metal foil

Info

Publication number
IL122493A0
IL122493A0 IL12249397A IL12249397A IL122493A0 IL 122493 A0 IL122493 A0 IL 122493A0 IL 12249397 A IL12249397 A IL 12249397A IL 12249397 A IL12249397 A IL 12249397A IL 122493 A0 IL122493 A0 IL 122493A0
Authority
IL
Israel
Prior art keywords
laminating
metal foil
shaped metal
shaped
foil
Prior art date
Application number
IL12249397A
Other languages
English (en)
Original Assignee
Dexter Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexter Corp filed Critical Dexter Corp
Publication of IL122493A0 publication Critical patent/IL122493A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IL12249397A 1995-06-07 1997-12-07 Method for laminating a shaped metal foil IL122493A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/483,342 US5718789A (en) 1995-06-07 1995-06-07 Method for making a debossed conductive film composite

Publications (1)

Publication Number Publication Date
IL122493A0 true IL122493A0 (en) 1998-10-30

Family

ID=23919674

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12249397A IL122493A0 (en) 1995-06-07 1997-12-07 Method for laminating a shaped metal foil

Country Status (10)

Country Link
US (1) US5718789A (zh)
EP (1) EP0836795A4 (zh)
JP (1) JPH11507472A (zh)
KR (1) KR19990022581A (zh)
CN (1) CN1193452A (zh)
AU (1) AU6381096A (zh)
CA (1) CA2223304A1 (zh)
IL (1) IL122493A0 (zh)
MX (1) MX9709927A (zh)
WO (1) WO1996041509A1 (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780581A (en) * 1995-10-27 1998-07-14 Hughes Aircraft Company Plateable structural adhesive for cyanate ester composites
JP2000332369A (ja) * 1999-05-25 2000-11-30 Mitsui Mining & Smelting Co Ltd プリント回路板及びその製造方法
US6524675B1 (en) * 1999-05-13 2003-02-25 3M Innovative Properties Company Adhesive-back articles
EP1381503B1 (en) * 2001-04-19 2004-10-20 General Electric Company Methods for embossing
ITVE20010026A1 (it) * 2001-05-18 2002-11-18 Giorgio Trani Film flessibile strutturalmente modificabile, per realizzare oggetti dimensionalmente e strutturalmente stabili, in particolare contenitori
US6692816B2 (en) 2001-11-28 2004-02-17 3M Innovative Properties Company Abrasion resistant electrode and device
EP1661053A4 (en) * 2003-08-08 2012-06-13 Shmuel Shapira SYSTEM AND METHOD FOR CIRCUIT FORMATION
KR100741677B1 (ko) 2006-03-06 2007-07-23 삼성전기주식회사 임프린팅에 의한 기판의 제조방법
CN101421886B (zh) * 2006-04-12 2010-12-15 日立化成工业株式会社 电路连接用粘接膜、电路部件的连接结构以及电路部件的连接方法
EP1855511A1 (en) * 2006-05-12 2007-11-14 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO A process for preparing a heatsink system and heatsink system obtainable by said process
JP4912290B2 (ja) * 2006-12-28 2012-04-11 信越ポリマー株式会社 選択透過材料及び空調システム
DE102008041538A1 (de) * 2008-08-26 2010-03-04 Robert Bosch Gmbh Verfahren zum Heißprägen mindestens einer Leiterbahn auf ein Substrat sowie Substrat mit mindestens einer Leiterbahn
KR101045882B1 (ko) * 2009-01-16 2011-07-01 한국과학기술원 금속 테이프 및 금속 박지를 이용한 직물형 회로기판 및 그제조방법
JP6033734B2 (ja) * 2013-04-30 2016-11-30 日東電工株式会社 フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法
TWI468482B (zh) * 2013-06-19 2015-01-11 Polytronics Technology Corp 黏合材料
KR101891397B1 (ko) * 2015-08-13 2018-08-23 성균관대학교산학협력단 미세 채널을 포함하는 점착성 패치
CN107204451A (zh) * 2016-03-17 2017-09-26 中国科学院苏州纳米技术与纳米仿生研究所 金属表面微结构、其制备方法及应用
JP2018078272A (ja) * 2016-10-31 2018-05-17 スリーエム イノベイティブ プロパティズ カンパニー 三次元形状熱伝導性成形体、及びその製造方法
KR102172070B1 (ko) * 2017-01-09 2020-10-30 주식회사 엘지화학 리튬 메탈 패터닝 및 이를 이용한 전기화학 소자
US10583644B2 (en) 2017-08-16 2020-03-10 Corkart SA Process for manufacturing cork tile
CN112739031B (zh) * 2021-03-30 2021-06-08 四川英创力电子科技股份有限公司 一种具有侧面金属化凹槽的印制电路板及其加工工艺
CN113260162B (zh) * 2021-04-29 2023-11-03 邹文华 一种组合印制电路板导电膏隔离薄膜剥离装置

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2772501A (en) * 1956-05-31 1956-12-04 Robert J Malcolm Method of manufacturing electrical circuit components
US2955351A (en) * 1954-12-28 1960-10-11 Plast O Fab Circuits Inc Method of making a printed circuit
US2986804A (en) * 1957-02-06 1961-06-06 Rogers Corp Method of making a printed circuit
US3037265A (en) * 1957-12-30 1962-06-05 Ibm Method for making printed circuits
US3201238A (en) * 1958-08-29 1965-08-17 Walter J Dwyer Method of making odd shaped printed circuits
NL275995A (zh) * 1961-08-28
BE623296A (zh) * 1961-10-23
US3303254A (en) * 1963-06-27 1967-02-07 C B Messenger Method for preparing a membrane
DE1665944A1 (de) * 1967-05-13 1971-04-08 Siemens Ag Verfahren zum Herstellen elektrischer Schaltkreise
US3660088A (en) * 1970-09-16 1972-05-02 Grace W R & Co Photo-resist process
US4059479A (en) * 1973-08-10 1977-11-22 Hisaji Tanazawa Method of forming an embossed pattern
US3990142A (en) * 1973-10-02 1976-11-09 Jerobee Industries, Inc. Circuit board, method of making the circuit board and improved die for making said board
US4323421A (en) * 1978-04-28 1982-04-06 Bell Telephone Laboratories, Incorporated Fabrication of conductor-clad composites using molding compounds and techniques
JPS55126418A (en) * 1979-03-26 1980-09-30 Kanegafuchi Chem Ind Co Ltd Method and apparatus for continuous preparation of laminated material
US4363930A (en) * 1980-02-04 1982-12-14 Amp Incorporated Circuit path conductors in plural planes
US4374457A (en) * 1980-08-04 1983-02-22 Wiech Raymond E Jr Method of fabricating complex micro-circuit boards and substrates
DE3316362C2 (de) * 1983-05-05 1985-03-07 Dynamit Nobel Ag, 5210 Troisdorf Schichtpreßstoff auf Epoxydharzbasis für gedruckte Schaltungen
EP0163856B1 (en) * 1984-05-02 1989-08-23 GTE Products Corporation Method of making lead frame support for ic chip
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
US4812421A (en) * 1987-10-26 1989-03-14 Motorola, Inc. Tab-type semiconductor process
US4614837A (en) * 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US5206074A (en) * 1987-04-03 1993-04-27 International Business Machines Corporation Adhesives on polymide films and methods of preparing them
US4969257A (en) * 1987-09-04 1990-11-13 Shinko Electric Industries, Co., Ltd. Transfer sheet and process for making a circuit substrate
DE3737889A1 (de) * 1987-11-07 1989-05-18 Basf Ag Leiterplattensubstrate mit verbesserter waermeleitfaehigkeit
US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
US4831723A (en) * 1988-04-12 1989-05-23 Kaufman Lance R Direct bond circuit assembly with crimped lead frame
US5153987A (en) * 1988-07-15 1992-10-13 Hitachi Chemical Company, Ltd. Process for producing printed wiring boards
US4912844A (en) * 1988-08-10 1990-04-03 Dimensional Circuits Corporation Methods of producing printed circuit boards
US4944087A (en) * 1988-10-05 1990-07-31 Rogers Corporation Method of making a curved plastic body with circuit pattern
US4944908A (en) * 1988-10-28 1990-07-31 Eaton Corporation Method for forming a molded plastic article
US4997702A (en) * 1989-03-06 1991-03-05 Rogers Corporation Shape retaining flexible electrical circuit
US4994316A (en) * 1989-07-18 1991-02-19 The Dexter Corporation Circuit boards
JPH07114216B2 (ja) * 1989-07-31 1995-12-06 日本電気株式会社 フィルムキャリヤ型半導体装置の実装方法
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive
US5260130A (en) * 1989-09-29 1993-11-09 Shin-Etsu Chemical Co., Ltd. Adhesive composition and coverlay film therewith
US5174847A (en) * 1989-10-20 1992-12-29 Fritz Pichl Process for the production of a circuit arrangement on a support film
US5108825A (en) * 1989-12-21 1992-04-28 General Electric Company Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
US5030144A (en) * 1990-04-13 1991-07-09 North American Specialties Corporation Solder-bearing lead
JPH0476985A (ja) * 1990-07-18 1992-03-11 Cmk Corp プリント配線板の製造法
JP2747096B2 (ja) * 1990-07-24 1998-05-06 北川工業株式会社 ３次元回路基板の製造方法
US5351393A (en) * 1991-05-28 1994-10-04 Dimensonal Circuits Corporation Method of mounting a surface-mountable IC to a converter board
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5288542A (en) * 1992-07-14 1994-02-22 International Business Machines Corporation Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
US5346747A (en) * 1992-12-24 1994-09-13 Granmont, Inc. Composite printed circuit board substrate and process for its manufacture
US5390412A (en) * 1993-04-08 1995-02-21 Gregoire; George D. Method for making printed circuit boards

Also Published As

Publication number Publication date
CN1193452A (zh) 1998-09-16
MX9709927A (es) 1998-08-30
CA2223304A1 (en) 1996-12-19
KR19990022581A (ko) 1999-03-25
WO1996041509A1 (en) 1996-12-19
AU6381096A (en) 1996-12-30
US5718789A (en) 1998-02-17
EP0836795A1 (en) 1998-04-22
JPH11507472A (ja) 1999-06-29
EP0836795A4 (en) 2000-05-10

Similar Documents

Publication Publication Date Title
IL122493A0 (en) Method for laminating a shaped metal foil
EP0741447A3 (en) Method and device for controlling a synchronous rectifier converter circuit
ZA989992B (en) Multilayer cover systems and method for producing same
GB2318312B (en) Method for forming a multi-layer metallic coating film
ZA962442B (en) An assembly process for a laminated tape
ZA978610B (en) Method of manufacturing a photovoltaic foil.
EP1105289A4 (en) METHOD FOR LAMINATING A COMPOSITE EQUIPMENT
HUP0004103A1 (en) Method for producing a shielding case
GB9622538D0 (en) Method for forming a metal wire
GB9727198D0 (en) Method for producing metal foil
GB9522860D0 (en) Method for a steerable antenna
GB2308562B (en) Welding method
AU127459S (en) A metal cutting insert
EP0744232A3 (en) Tin packaging and its manufacturing process
AU4945497A (en) Method for producing a soldered metal honeycomb body
AU6766394A (en) Apparatus for making metal foil
GB9727476D0 (en) Method and apparatus for producing a composite laminate
GB2292941B (en) Method for making a 4-hydroxy-tetraorganopiperidinyloxy
AU3808199A (en) Method for forming a sheet metal assembly and corresponding device and sheet metal set
AU132297S (en) A metal cutting insert
EP0589673A3 (en) Method and tool for coating a wall.
KR100217023B1 (en) A lamination color-glass and process for preparing them
GB2300548B (en) Method for a communications system
GB2308093B (en) Method and apparatus for laminating foils
GB9507049D0 (en) Method of making a laminate