IL102936A - Flow-soaking surfaces for non-electrical copper plating of complex systems - Google Patents
Flow-soaking surfaces for non-electrical copper plating of complex systemsInfo
- Publication number
- IL102936A IL102936A IL10293692A IL10293692A IL102936A IL 102936 A IL102936 A IL 102936A IL 10293692 A IL10293692 A IL 10293692A IL 10293692 A IL10293692 A IL 10293692A IL 102936 A IL102936 A IL 102936A
- Authority
- IL
- Israel
- Prior art keywords
- panel
- flow
- panels
- assemblies
- channels
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75013791A | 1991-08-26 | 1991-08-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
IL102936A0 IL102936A0 (en) | 1993-02-21 |
IL102936A true IL102936A (en) | 1996-03-31 |
Family
ID=25016660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL10293692A IL102936A (en) | 1991-08-26 | 1992-08-25 | Flow-soaking surfaces for non-electrical copper plating of complex systems |
Country Status (9)
Country | Link |
---|---|
US (1) | US5603768A (fr) |
EP (1) | EP0530665B1 (fr) |
JP (1) | JPH05209281A (fr) |
KR (1) | KR960015096B1 (fr) |
AU (1) | AU647658B2 (fr) |
CA (1) | CA2076701C (fr) |
DE (1) | DE69228783T2 (fr) |
ES (1) | ES2129419T3 (fr) |
IL (1) | IL102936A (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6225223B1 (en) | 1999-08-16 | 2001-05-01 | Taiwan Semiconductor Manufacturing Company | Method to eliminate dishing of copper interconnects |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2073679A (en) * | 1935-02-05 | 1937-03-16 | Western Electric Co | Electroplating apparatus |
US2691144A (en) * | 1952-07-12 | 1954-10-05 | Fansteel Metallurgical Corp | Electroforming apparatus for rectifier disks |
US3257308A (en) * | 1961-07-11 | 1966-06-21 | Western Electric Co | Article holder for electroplating articles |
DE1239160B (de) * | 1963-05-04 | 1967-04-20 | Karl Schmidt Ges Mit Beschraen | Vorrichtung zum Galvanisieren ringfoermiger Koerper |
US3648653A (en) * | 1970-06-01 | 1972-03-14 | Bell Telephone Labor Inc | Liquid phase crystal growth apparatus |
US3972785A (en) * | 1974-06-17 | 1976-08-03 | The Empire Plating Company | Electroplating rack |
FR2316761A1 (fr) * | 1975-07-04 | 1977-01-28 | Olivier Jean | Procede et reacteur pour soumettre une matiere a des ondes electromagnetiques |
US4322592A (en) * | 1980-08-22 | 1982-03-30 | Rca Corporation | Susceptor for heating semiconductor substrates |
US4312716A (en) * | 1980-11-21 | 1982-01-26 | Western Electric Co., Inc. | Supporting an array of elongate articles |
CA1219179A (fr) * | 1982-09-27 | 1987-03-17 | Etd Technology, Inc. | Methode et dispositif de plaquate non electrolytique |
DE3305564C1 (de) * | 1983-02-15 | 1984-03-22 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Aufbau von metallisierten Leiterbahnen und Durchkontaktierungen an gelochten Leiterplatten |
SU1167663A1 (ru) * | 1984-01-10 | 1985-07-15 | Предприятие П/Я Х-5618 | Кассета дл групповой обработки радиодеталей |
DE3411208C2 (de) * | 1984-03-27 | 1987-01-29 | Leybold-Heraeus GmbH, 5000 Köln | Haltevorrichtung für Substrate, insbesondere in Vakuum-Beschichtungsanlagen |
US4634512A (en) * | 1984-08-21 | 1987-01-06 | Komag, Inc. | Disk and plug |
-
1992
- 1992-08-24 CA CA002076701A patent/CA2076701C/fr not_active Expired - Fee Related
- 1992-08-25 IL IL10293692A patent/IL102936A/en not_active IP Right Cessation
- 1992-08-26 KR KR1019920015373A patent/KR960015096B1/ko not_active IP Right Cessation
- 1992-08-26 AU AU21313/92A patent/AU647658B2/en not_active Ceased
- 1992-08-26 EP EP92114558A patent/EP0530665B1/fr not_active Expired - Lifetime
- 1992-08-26 JP JP4227549A patent/JPH05209281A/ja active Pending
- 1992-08-26 ES ES92114558T patent/ES2129419T3/es not_active Expired - Lifetime
- 1992-08-26 DE DE69228783T patent/DE69228783T2/de not_active Expired - Fee Related
-
1994
- 1994-07-21 US US08/278,682 patent/US5603768A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0530665A1 (fr) | 1993-03-10 |
KR960015096B1 (ko) | 1996-10-24 |
CA2076701A1 (fr) | 1993-02-27 |
EP0530665B1 (fr) | 1999-03-31 |
DE69228783T2 (de) | 1999-12-02 |
AU2131392A (en) | 1993-03-11 |
AU647658B2 (en) | 1994-03-24 |
US5603768A (en) | 1997-02-18 |
DE69228783D1 (de) | 1999-05-06 |
JPH05209281A (ja) | 1993-08-20 |
ES2129419T3 (es) | 1999-06-16 |
CA2076701C (fr) | 1997-12-23 |
IL102936A0 (en) | 1993-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6123554A (en) | Connector cover with board stiffener | |
US4030792A (en) | Tuning fork connector | |
US6780058B2 (en) | Shielded backplane connector | |
US7402065B1 (en) | Socket connector for carrying integrated circuit package | |
US5931686A (en) | Backplane connector and method of assembly thereof to a backplane | |
DE69901084T2 (de) | Multikoaxialer Steckverbinder bestehend aus einem metallischen Block, der mit den Aussenleitern von verschiedenen koaxialen Kabeln verbunden ist | |
EP0911912A2 (fr) | Connecteur coudé à fiches coaxial à haute fréquence | |
DE4232048A1 (de) | Elektronisches Steuergerät | |
DE68914855T2 (de) | Steckervorrichtung für Koaxialkabel hoher Dichte. | |
DE69606067T2 (de) | Elektrische steckvorrichtung | |
US5951306A (en) | Modular connector assembly | |
JPH0378983A (ja) | 多極の差し込み装置のシールドを配線盤のアース電位層に電気的に接読するための装置 | |
EP0153632B1 (fr) | Montage d'un connecteur électrique à un appareil de mesure | |
KR920003698Y1 (ko) | 컴퓨터 옵션 보드(option board)고정용 가이드 홀더 고정장치 | |
US5603768A (en) | Flow-inducing panels for electroless copper plating of complex assemblies | |
CA2015258C (fr) | Bati pour four a micro-ondes et appareils analogues | |
JPS60158577A (ja) | 電気コネクタ部材 | |
US2783443A (en) | Connector plug assembly | |
US4750088A (en) | Card cage | |
US5407364A (en) | Retention and coupling assembly of connector | |
EP0872913B1 (fr) | Connecteur coaxial multiple | |
EP1045661B1 (fr) | Aspirateur | |
DE3785358T2 (de) | Vorrichtung und verfahren zur herstellung eines gestempelten substrats. | |
CN218242360U (zh) | 机柜用电源分配插座 | |
CN209806337U (zh) | 应用于贴片机的输料快拆结构与外设输料装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
HC | Change of name of proprietor(s) | ||
KB | Patent renewed | ||
MM9K | Patent not in force due to non-payment of renewal fees |