IL100978A - Thinned charge-coupled devices and method for making the same - Google Patents

Thinned charge-coupled devices and method for making the same

Info

Publication number
IL100978A
IL100978A IL10097892A IL10097892A IL100978A IL 100978 A IL100978 A IL 100978A IL 10097892 A IL10097892 A IL 10097892A IL 10097892 A IL10097892 A IL 10097892A IL 100978 A IL100978 A IL 100978A
Authority
IL
Israel
Prior art keywords
charge
coupled device
substrate
glass substrate
epoxy
Prior art date
Application number
IL10097892A
Other languages
English (en)
Other versions
IL100978A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL100978A0 publication Critical patent/IL100978A0/xx
Publication of IL100978A publication Critical patent/IL100978A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • H10F30/28—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices being characterised by field-effect operation, e.g. junction field-effect phototransistors
    • H10F30/2823—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices being characterised by field-effect operation, e.g. junction field-effect phototransistors the devices being conductor-insulator-semiconductor devices, e.g. diodes or charge-coupled devices [CCD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/012—Bonding, e.g. electrostatic for strain gauges
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/135—Removal of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
IL10097892A 1991-03-18 1992-02-17 Thinned charge-coupled devices and method for making the same IL100978A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/670,841 US5162251A (en) 1991-03-18 1991-03-18 Method for making thinned charge-coupled devices

Publications (2)

Publication Number Publication Date
IL100978A0 IL100978A0 (en) 1992-11-15
IL100978A true IL100978A (en) 1995-08-31

Family

ID=24692112

Family Applications (1)

Application Number Title Priority Date Filing Date
IL10097892A IL100978A (en) 1991-03-18 1992-02-17 Thinned charge-coupled devices and method for making the same

Country Status (5)

Country Link
US (1) US5162251A (de)
EP (1) EP0505130A3 (de)
JP (1) JPH0590303A (de)
KR (1) KR920018961A (de)
IL (1) IL100978A (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL100979A0 (en) * 1991-03-18 1992-11-15 Hughes Aircraft Co Method for establishing an electrical field at a surface of a semiconductor device
EP0568312A3 (en) * 1992-04-27 1993-12-29 Seiko Instr Inc Semiconductor device with driver chip and methods of manufacture
US5270221A (en) * 1992-11-05 1993-12-14 Hughes Aircraft Company Method of fabricating high quantum efficiency solid state sensors
US5441591A (en) * 1993-06-07 1995-08-15 The United States Of America As Represented By The Secretary Of The Navy Silicon to sapphire bond
US5600130A (en) * 1994-06-17 1997-02-04 The Regents Of The University Of Colorado Two-dimensional optoelectronic array module
WO1996003772A2 (en) * 1994-07-26 1996-02-08 Philips Electronics N.V. Method of manufacturing a semiconductor device for surface mounting, and semiconductor device for surface mounting
US5597767A (en) * 1995-01-06 1997-01-28 Texas Instruments Incorporated Separation of wafer into die with wafer-level processing
US5691248A (en) * 1995-07-26 1997-11-25 International Business Machines Corporation Methods for precise definition of integrated circuit chip edges
US5648684A (en) * 1995-07-26 1997-07-15 International Business Machines Corporation Endcap chip with conductive, monolithic L-connect for multichip stack
US5708264A (en) * 1995-11-07 1998-01-13 Eastman Kodak Company Planar color filter array for CCDs from dyed and mordant layers
US5677202A (en) * 1995-11-20 1997-10-14 Eastman Kodak Company Method for making planar color filter array for image sensors with embedded color filter arrays
US5851845A (en) * 1995-12-18 1998-12-22 Micron Technology, Inc. Process for packaging a semiconductor die using dicing and testing
US5786236A (en) * 1996-03-29 1998-07-28 Eastman Kodak Company Backside thinning using ion-beam figuring
US6551857B2 (en) 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US5904495A (en) * 1997-06-11 1999-05-18 Massachusetts Institute Of Technology Interconnection technique for hybrid integrated devices
US6984571B1 (en) 1999-10-01 2006-01-10 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6500694B1 (en) * 2000-03-22 2002-12-31 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6902987B1 (en) * 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
US6563133B1 (en) 2000-08-09 2003-05-13 Ziptronix, Inc. Method of epitaxial-like wafer bonding at low temperature and bonded structure
JP3911174B2 (ja) * 2002-03-01 2007-05-09 シャープ株式会社 半導体素子の製造方法および半導体素子
US7109092B2 (en) 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
JP6779574B2 (ja) * 2016-12-14 2020-11-04 株式会社ディスコ インターポーザの製造方法
US12424584B2 (en) 2020-10-29 2025-09-23 Adeia Semiconductor Bonding Technologies Inc. Direct bonding methods and structures

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965568A (en) * 1973-08-27 1976-06-29 Texas Instruments Incorporated Process for fabrication and assembly of semiconductor devices
US4197633A (en) * 1977-09-01 1980-04-15 Honeywell, Inc. Hybrid mosaic IR/CCD focal plane
US4321747A (en) * 1978-05-30 1982-03-30 Tokyo Shibaura Denki Kabushiki Kaisha Method of manufacturing a solid-state image sensing device
US4266334A (en) * 1979-07-25 1981-05-12 Rca Corporation Manufacture of thinned substrate imagers
GB2056172B (en) * 1979-07-25 1983-04-27 Rca Corp Manufacture of thinned substrate imagers
CA1115852A (en) * 1980-01-09 1982-01-05 Jacques R. St. Louis Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices
JPS59207639A (ja) * 1983-05-11 1984-11-24 Matsushita Electric Ind Co Ltd 固体撮像装置の検査方法
US4465549A (en) * 1984-01-26 1984-08-14 Rca Corporation Method of removing a glass backing plate from one major surface of a semiconductor wafer
JPS6211393A (ja) * 1985-07-09 1987-01-20 Toshiba Corp 固体撮像装置の試験用プロ−ブ基板
US4876222A (en) * 1987-09-25 1989-10-24 Texas Instrument Incorporated Semiconductor passivation
US4892842A (en) * 1987-10-29 1990-01-09 Tektronix, Inc. Method of treating an integrated circuit
US4814283A (en) * 1988-04-08 1989-03-21 General Electric Company Simple automated discretionary bonding of multiple parallel elements

Also Published As

Publication number Publication date
EP0505130A2 (de) 1992-09-23
KR920018961A (ko) 1992-10-22
EP0505130A3 (en) 1992-09-30
US5162251A (en) 1992-11-10
JPH0590303A (ja) 1993-04-09
IL100978A0 (en) 1992-11-15

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