IE34925B1 - Semiconductor module - Google Patents

Semiconductor module

Info

Publication number
IE34925B1
IE34925B1 IE123/71A IE12371A IE34925B1 IE 34925 B1 IE34925 B1 IE 34925B1 IE 123/71 A IE123/71 A IE 123/71A IE 12371 A IE12371 A IE 12371A IE 34925 B1 IE34925 B1 IE 34925B1
Authority
IE
Ireland
Prior art keywords
semiconductor module
semiconductor
module
Prior art date
Application number
IE123/71A
Other languages
English (en)
Other versions
IE34925L (en
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IE34925L publication Critical patent/IE34925L/xx
Publication of IE34925B1 publication Critical patent/IE34925B1/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074Stacked arrangements of non-apertured devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thyristors (AREA)
IE123/71A 1970-02-02 1971-02-02 Semiconductor module IE34925B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US745370A 1970-02-02 1970-02-02

Publications (2)

Publication Number Publication Date
IE34925L IE34925L (en) 1971-08-02
IE34925B1 true IE34925B1 (en) 1975-09-17

Family

ID=21726248

Family Applications (1)

Application Number Title Priority Date Filing Date
IE123/71A IE34925B1 (en) 1970-02-02 1971-02-02 Semiconductor module

Country Status (5)

Country Link
DE (2) DE7103749U (enExample)
FR (1) FR2079196A1 (enExample)
GB (1) GB1349478A (enExample)
IE (1) IE34925B1 (enExample)
SE (1) SE372847B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
FR2412168A1 (fr) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc Diodes ecreteuses de surtension
US4335392A (en) * 1978-03-23 1982-06-15 Brown, Boveri & Cie Aktiengesellschaft Semiconductor device with at least two semiconductor elements
DE2812700A1 (de) * 1978-03-23 1979-12-06 Bbc Brown Boveri & Cie Halbleiteranordnung mit zwei halbleiterelementen
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
JP2845739B2 (ja) * 1993-11-29 1999-01-13 三菱電機株式会社 圧接型半導体装置及びその製造方法
DE102004058946B4 (de) * 2004-12-08 2009-06-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Hilfsanschluss
DE102009034138B4 (de) * 2009-07-22 2011-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Also Published As

Publication number Publication date
DE2104726A1 (de) 1972-08-10
IE34925L (en) 1971-08-02
DE7103749U (de) 1971-10-28
GB1349478A (en) 1974-04-03
SE372847B (enExample) 1975-01-13
FR2079196A1 (enExample) 1971-11-12

Similar Documents

Publication Publication Date Title
YU20671A (en) Semiconductor device
GB1343174A (en) Semiconductor devices
MY7400218A (en) Semiconductor device fabrication
HK59376A (en) Semiconductor integrated device
ZA714756B (en) Semiconductor memory device
AU463404B2 (en) Semiconductor device
GB1348697A (en) Semiconductors
IE34925B1 (en) Semiconductor module
CA937336A (en) Semiconductor components
GB1349276A (en) Semiconductor device
GB1345800A (en) Making semi-conductor devices
GB1345231A (en) Semiconductor doping
HK58776A (en) Semiconductor devices
CA938737A (en) Semiconductor arrangements
JPS5456387A (en) Semiconductor
HK58676A (en) Semiconductor devices
ZA715975B (en) Semiconductor device
AU444064B2 (en) Semiconductor arrangement
AU453823B2 (en) Semiconductor arrangement
AU446253B2 (en) Semiconductor arrangement
ZA708005B (en) Semiconductor device
CA845890A (en) Semiconductor components
CA832692A (en) Semiconductor
CA834990A (en) Semiconductor device
AU461330B2 (en) Semiconductor device