IE34925B1 - Semiconductor module - Google Patents
Semiconductor moduleInfo
- Publication number
- IE34925B1 IE34925B1 IE123/71A IE12371A IE34925B1 IE 34925 B1 IE34925 B1 IE 34925B1 IE 123/71 A IE123/71 A IE 123/71A IE 12371 A IE12371 A IE 12371A IE 34925 B1 IE34925 B1 IE 34925B1
- Authority
- IE
- Ireland
- Prior art keywords
- semiconductor module
- semiconductor
- module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US745370A | 1970-02-02 | 1970-02-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE34925L IE34925L (en) | 1971-08-02 |
| IE34925B1 true IE34925B1 (en) | 1975-09-17 |
Family
ID=21726248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE123/71A IE34925B1 (en) | 1970-02-02 | 1971-02-02 | Semiconductor module |
Country Status (5)
| Country | Link |
|---|---|
| DE (2) | DE7103749U (enExample) |
| FR (1) | FR2079196A1 (enExample) |
| GB (1) | GB1349478A (enExample) |
| IE (1) | IE34925B1 (enExample) |
| SE (1) | SE372847B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2728313A1 (de) * | 1977-06-23 | 1979-01-04 | Siemens Ag | Halbleiterbauelement |
| US4274106A (en) * | 1977-11-07 | 1981-06-16 | Mitsubishi Denki Kabushiki Kaisha | Explosion proof vibration resistant flat package semiconductor device |
| FR2412168A1 (fr) * | 1977-12-15 | 1979-07-13 | Silicium Semiconducteur Ssc | Diodes ecreteuses de surtension |
| US4335392A (en) * | 1978-03-23 | 1982-06-15 | Brown, Boveri & Cie Aktiengesellschaft | Semiconductor device with at least two semiconductor elements |
| DE2812700A1 (de) * | 1978-03-23 | 1979-12-06 | Bbc Brown Boveri & Cie | Halbleiteranordnung mit zwei halbleiterelementen |
| US5229915A (en) * | 1990-02-07 | 1993-07-20 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
| JPH0714029B2 (ja) * | 1990-02-07 | 1995-02-15 | 日本碍子株式会社 | 電力用半導体素子 |
| JP2845739B2 (ja) * | 1993-11-29 | 1999-01-13 | 三菱電機株式会社 | 圧接型半導体装置及びその製造方法 |
| DE102004058946B4 (de) * | 2004-12-08 | 2009-06-18 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Hilfsanschluss |
| DE102009034138B4 (de) * | 2009-07-22 | 2011-06-01 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement |
-
1971
- 1971-02-02 SE SE7101263A patent/SE372847B/xx unknown
- 1971-02-02 DE DE19717103749U patent/DE7103749U/de not_active Expired
- 1971-02-02 FR FR7103493A patent/FR2079196A1/fr not_active Withdrawn
- 1971-02-02 DE DE19712104726 patent/DE2104726A1/de active Pending
- 1971-02-02 IE IE123/71A patent/IE34925B1/xx unknown
- 1971-04-19 GB GB2082671A patent/GB1349478A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2104726A1 (de) | 1972-08-10 |
| IE34925L (en) | 1971-08-02 |
| DE7103749U (de) | 1971-10-28 |
| GB1349478A (en) | 1974-04-03 |
| SE372847B (enExample) | 1975-01-13 |
| FR2079196A1 (enExample) | 1971-11-12 |
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