ID28439A - THIN THEME WHICH IS BINDED TO RIGIDS - Google Patents

THIN THEME WHICH IS BINDED TO RIGIDS

Info

Publication number
ID28439A
ID28439A IDW20010888A ID20010888A ID28439A ID 28439 A ID28439 A ID 28439A ID W20010888 A IDW20010888 A ID W20010888A ID 20010888 A ID20010888 A ID 20010888A ID 28439 A ID28439 A ID 28439A
Authority
ID
Indonesia
Prior art keywords
bond
abrasive
stiffness
wheel
metal
Prior art date
Application number
IDW20010888A
Other languages
Indonesian (id)
Inventor
Srinivasan Ramanath
Richard M Andrews
Original Assignee
Norton Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Norton Co filed Critical Norton Co
Publication of ID28439A publication Critical patent/ID28439A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Insulators (AREA)

Abstract

A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered metal bond including a stiffness enhancing metal component exhibits superior stiffness. The metals can be selected from among many sinterable metal compositions. Blends of nickel and tin are preferred. The stiffness enhancing metal is a metal capable of providing substantially increased rigidity to the bond without significantly increasing bond hardness. Molybdenum, rhenium, tungsten and blends of these are favored. The sintered bond is generally formed from powders. A diamond abrasive, nickel/tin/molybdenum sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.
IDW20010888A 1998-10-23 1999-07-08 THIN THEME WHICH IS BINDED TO RIGIDS ID28439A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/177,770 US6056795A (en) 1998-10-23 1998-10-23 Stiffly bonded thin abrasive wheel

Publications (1)

Publication Number Publication Date
ID28439A true ID28439A (en) 2001-05-24

Family

ID=22649925

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20010888A ID28439A (en) 1998-10-23 1999-07-08 THIN THEME WHICH IS BINDED TO RIGIDS

Country Status (20)

Country Link
US (1) US6056795A (en)
EP (1) EP1144158B1 (en)
JP (2) JP3623740B2 (en)
KR (1) KR100419103B1 (en)
AT (1) ATE242084T1 (en)
AU (1) AU738846B2 (en)
CA (1) CA2346660A1 (en)
CZ (1) CZ20011432A3 (en)
DE (1) DE69908651T2 (en)
DK (1) DK1144158T3 (en)
ES (1) ES2201735T3 (en)
HU (1) HUP0204197A2 (en)
ID (1) ID28439A (en)
IL (1) IL142735A0 (en)
MY (1) MY129264A (en)
NZ (1) NZ510229A (en)
PL (1) PL353279A1 (en)
SK (1) SK5332001A3 (en)
TW (1) TW396090B (en)
WO (1) WO2000024549A2 (en)

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US6800018B2 (en) * 2002-02-12 2004-10-05 Saint-Gobain Abrasives Technology Company Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device
US8894731B2 (en) * 2007-10-01 2014-11-25 Saint-Gobain Abrasives, Inc. Abrasive processing of hard and /or brittle materials
MY151755A (en) * 2007-12-28 2014-06-30 Shinetsu Chemical Co Outer blade cutting wheel and making method
KR101269498B1 (en) * 2008-07-02 2013-06-07 생-고벵 아브라시프 Abrasive slicing tool for electronics industry
US20100126877A1 (en) * 2008-11-24 2010-05-27 General Electric Company Electrochemical grinding electrode, and apparatus and method using the same
CN101879597B (en) * 2010-06-11 2011-12-07 西安交通大学 Preparation method of metal sintering-type diamond saw cutter for cutting QFN (Quad Flat Non-Leaded Package) packaging device
TWI613285B (en) 2010-09-03 2018-02-01 聖高拜磨料有限公司 Bonded abrasive article and method of forming
JP5520771B2 (en) * 2010-10-01 2014-06-11 本田技研工業株式会社 Manufacturing method of metal bond grindstone
JP5514689B2 (en) * 2010-09-30 2014-06-04 本田技研工業株式会社 Manufacturing method of metal bond grindstone
WO2012043660A1 (en) * 2010-09-30 2012-04-05 本田技研工業株式会社 Method for producing metal-bonded grindstone
FR2979845B1 (en) * 2011-09-09 2015-02-13 Saint Gobain FLAT GLASS FILLING WHEEL
KR20150014458A (en) * 2012-04-24 2015-02-06 가부시키가이샤 토쿄 세이미쯔 Dicing blade
TWI535535B (en) * 2012-07-06 2016-06-01 聖高拜磨料有限公司 Abrasive article for lower speed grinding operations
JP6064058B2 (en) 2012-12-31 2017-01-18 サンーゴバン アブレイシブズ，インコーポレイティド Bonded abrasive article and grinding method
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
WO2014106156A1 (en) 2012-12-31 2014-07-03 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
DE112014001102T5 (en) 2013-03-31 2015-11-19 Saint-Gobain Abrasifs Bound abrasive article and grinding process
CN105328592A (en) * 2015-11-09 2016-02-17 无锡市锡山区仁景模具厂 Durable grinding wheel of cutting machine
CN112355921B (en) * 2020-09-28 2022-10-21 惠安宇信金刚石工具有限公司 Diamond metal bonding agent composite material part and manufacturing method and application thereof
CN114472894B (en) * 2021-12-31 2024-09-20 苏州赛尔科技有限公司 Metal sintering ultrathin cutting knife for cutting silicon wafer and preparation method
CN114473888A (en) * 2022-01-26 2022-05-13 郑州市钻石精密制造有限公司 Honing strip metal bonding agent composed of pre-alloyed powder

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JP2990579B2 (en) * 1995-02-24 1999-12-13 大阪ダイヤモンド工業株式会社 Superabrasive grindstone and method of manufacturing the same
JP2987485B2 (en) * 1995-02-24 1999-12-06 大阪ダイヤモンド工業株式会社 Superabrasive grindstone and method of manufacturing the same
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US5832360A (en) * 1997-08-28 1998-11-03 Norton Company Bond for abrasive tool

Also Published As

Publication number Publication date
DE69908651T2 (en) 2004-04-29
EP1144158B1 (en) 2003-06-04
JP2005040945A (en) 2005-02-17
KR100419103B1 (en) 2004-02-18
CZ20011432A3 (en) 2002-04-17
TW396090B (en) 2000-07-01
PL353279A1 (en) 2003-11-03
JP2003512937A (en) 2003-04-08
US6056795A (en) 2000-05-02
AU4864699A (en) 2000-05-15
WO2000024549A2 (en) 2000-05-04
CA2346660A1 (en) 2000-05-04
SK5332001A3 (en) 2001-10-08
DE69908651D1 (en) 2003-07-10
JP4157082B2 (en) 2008-09-24
ES2201735T3 (en) 2004-03-16
NZ510229A (en) 2003-12-19
EP1144158A2 (en) 2001-10-17
EP1144158A3 (en) 2002-11-20
DK1144158T3 (en) 2003-09-29
HUP0204197A2 (en) 2003-04-28
MY129264A (en) 2007-03-30
AU738846B2 (en) 2001-09-27
ATE242084T1 (en) 2003-06-15
WO2000024549A3 (en) 2002-10-03
JP3623740B2 (en) 2005-02-23
KR20010080305A (en) 2001-08-22
IL142735A0 (en) 2002-03-10

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