ID19925A - Larutan-larutan nikel hipofosfit yang memiliki konsentrasi, nikel yang lebih besar - Google Patents

Larutan-larutan nikel hipofosfit yang memiliki konsentrasi, nikel yang lebih besar

Info

Publication number
ID19925A
ID19925A IDP980233A ID980233A ID19925A ID 19925 A ID19925 A ID 19925A ID P980233 A IDP980233 A ID P980233A ID 980233 A ID980233 A ID 980233A ID 19925 A ID19925 A ID 19925A
Authority
ID
Indonesia
Prior art keywords
nickels
hyipophyptic
solutions
concentration
larger
Prior art date
Application number
IDP980233A
Other languages
English (en)
Inventor
Nicholas M Martyak
Original Assignee
Atochem North America Elf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atochem North America Elf filed Critical Atochem North America Elf
Publication of ID19925A publication Critical patent/ID19925A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B25/00—Phosphorus; Compounds thereof
    • C01B25/16—Oxyacids of phosphorus; Salts thereof
    • C01B25/165—Hypophosphorous acid; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G53/00—Compounds of nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
IDP980233A 1997-02-19 1998-02-19 Larutan-larutan nikel hipofosfit yang memiliki konsentrasi, nikel yang lebih besar ID19925A (id)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3862797P 1997-02-19 1997-02-19
US09/003,275 US5944879A (en) 1997-02-19 1998-01-06 Nickel hypophosphite solutions containing increased nickel concentration

Publications (1)

Publication Number Publication Date
ID19925A true ID19925A (id) 1998-08-20

Family

ID=26671569

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP980233A ID19925A (id) 1997-02-19 1998-02-19 Larutan-larutan nikel hipofosfit yang memiliki konsentrasi, nikel yang lebih besar

Country Status (6)

Country Link
US (1) US5944879A (id)
EP (1) EP0861924A1 (id)
JP (1) JPH1112752A (id)
KR (1) KR19980071493A (id)
CA (1) CA2226744A1 (id)
ID (1) ID19925A (id)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1208442A (zh) * 1996-11-14 1999-02-17 阿托泰克德国有限公司 从无电镀镍浴中去除亚磷酸根离子
US6099624A (en) * 1997-07-09 2000-08-08 Elf Atochem North America, Inc. Nickel-phosphorus alloy coatings
SG86346A1 (en) * 1999-05-06 2002-02-19 Inst Materials Research & Eng Method and composition for bright electroless nickel deposition
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions
US8177956B2 (en) * 2008-03-12 2012-05-15 Micyus Nicole J Method of electrolytically dissolving nickel into electroless nickel plating solutions
CN101845625B (zh) * 2010-06-01 2012-03-21 无锡阿尔法电子科技有限公司 一种在电容式触摸屏表面进行化学镀金的方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1696114A1 (de) * 1968-01-24 1971-07-15 Klingspor Carl Verfahren zur chemischen Vernickelung durch Tauchen
US3658569A (en) * 1969-11-13 1972-04-25 Nasa Selective nickel deposition
US3876434A (en) * 1972-12-07 1975-04-08 Shipley Co Replenishment of electroless nickel solutions
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4299888A (en) * 1980-04-23 1981-11-10 Ibm Corporation Method for forming in situ magnetic media in the form of discrete particles and article
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US4840820A (en) * 1983-08-22 1989-06-20 Enthone, Incorporated Electroless nickel plating of aluminum
US4892776A (en) * 1987-09-02 1990-01-09 Ohmega Electronics, Inc. Circuit board material and electroplating bath for the production thereof
JP3115095B2 (ja) * 1992-04-20 2000-12-04 ディップソール株式会社 無電解メッキ液及びそれを使用するメッキ方法
US5258061A (en) * 1992-11-20 1993-11-02 Monsanto Company Electroless nickel plating baths
US5419821A (en) * 1993-06-04 1995-05-30 Vaughan; Daniel J. Process and equipment for reforming and maintaining electroless metal baths
US5522972A (en) * 1994-07-19 1996-06-04 Learonal, Inc. Nickel hypophosphite manufacture
JP2901523B2 (ja) * 1995-08-09 1999-06-07 日本カニゼン株式会社 無電解黒色めっき浴組成と皮膜の形成方法

Also Published As

Publication number Publication date
US5944879A (en) 1999-08-31
KR19980071493A (ko) 1998-10-26
CA2226744A1 (en) 1998-08-19
JPH1112752A (ja) 1999-01-19
EP0861924A1 (en) 1998-09-02

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