ID17727A - Peralatan dan metode untuk menangani lapisan-lapisan bawah dalam tangki cairan - Google Patents
Peralatan dan metode untuk menangani lapisan-lapisan bawah dalam tangki cairanInfo
- Publication number
- ID17727A ID17727A IDP971343A ID971343A ID17727A ID 17727 A ID17727 A ID 17727A ID P971343 A IDP971343 A ID P971343A ID 971343 A ID971343 A ID 971343A ID 17727 A ID17727 A ID 17727A
- Authority
- ID
- Indonesia
- Prior art keywords
- equipment
- methods
- liquid tank
- down layers
- handling down
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19615970 | 1996-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ID17727A true ID17727A (id) | 1998-01-22 |
Family
ID=7792063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IDP971343A ID17727A (id) | 1996-04-22 | 1997-04-22 | Peralatan dan metode untuk menangani lapisan-lapisan bawah dalam tangki cairan |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE19703646C2 (id) |
| ID (1) | ID17727A (id) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19655219C2 (de) * | 1996-04-24 | 2003-11-06 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
| DE19859468C2 (de) * | 1998-12-22 | 2002-01-17 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln und Handhaben von Substraten |
| DE10127042A1 (de) * | 2001-06-02 | 2002-12-12 | Astec Halbleitertechnologie Gm | Verfahren und Vorrichtung zum Behandeln von Substraten |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
| US5265184A (en) * | 1992-05-28 | 1993-11-23 | Motorola, Inc. | Molded waveguide and method for making same |
| DE4413077C2 (de) * | 1994-04-15 | 1997-02-06 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
-
1997
- 1997-01-31 DE DE19703646A patent/DE19703646C2/de not_active Expired - Fee Related
- 1997-04-22 ID IDP971343A patent/ID17727A/id unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE19703646A1 (de) | 1997-10-23 |
| DE19703646C2 (de) | 1998-04-09 |
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