HK99693A - Conductive paste composition - Google Patents

Conductive paste composition

Info

Publication number
HK99693A
HK99693A HK996/93A HK99693A HK99693A HK 99693 A HK99693 A HK 99693A HK 996/93 A HK996/93 A HK 996/93A HK 99693 A HK99693 A HK 99693A HK 99693 A HK99693 A HK 99693A
Authority
HK
Hong Kong
Prior art keywords
paste composition
conductive paste
particles
admixture
particle size
Prior art date
Application number
HK996/93A
Other languages
English (en)
Inventor
Yasuo Yamamoto
Akira Inaba
Takashi Kitagaki
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of HK99693A publication Critical patent/HK99693A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
HK996/93A 1987-05-15 1993-09-23 Conductive paste composition HK99693A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62117075A JPS63301274A (ja) 1987-05-15 1987-05-15 導電性ペ−スト組成物

Publications (1)

Publication Number Publication Date
HK99693A true HK99693A (en) 1993-09-30

Family

ID=14702787

Family Applications (1)

Application Number Title Priority Date Filing Date
HK996/93A HK99693A (en) 1987-05-15 1993-09-23 Conductive paste composition

Country Status (5)

Country Link
EP (1) EP0291064B1 (de)
JP (1) JPS63301274A (de)
AT (1) ATE89430T1 (de)
DE (1) DE3880884T2 (de)
HK (1) HK99693A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110711A (ja) * 1989-09-22 1991-05-10 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
GB9211500D0 (en) * 1992-05-30 1992-07-15 First Class Securities Pastes
JPH07211132A (ja) * 1994-01-10 1995-08-11 Murata Mfg Co Ltd 導電性ペーストおよびこれを用いた積層セラミックコンデンサの製造方法
JP2002270189A (ja) * 2001-03-07 2002-09-20 Matsushita Electric Ind Co Ltd 高分子電解質型燃料電池の製造方法とこれを用いた高分子電解質型燃料電池
JP4541789B2 (ja) * 2003-07-14 2010-09-08 日本特殊陶業株式会社 導体用ペースト並びにそれを用いた積層セラミックコンデンサ及び配線基板
JP4914769B2 (ja) * 2007-05-31 2012-04-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
JP2011218268A (ja) * 2010-04-07 2011-11-04 Murata Mfg Co Ltd 塗膜形成方法および電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58163102A (ja) * 1982-03-20 1983-09-27 ティーディーケイ株式会社 磁器コンデンサの内部電極用導電性ペ−スト
JPS58178903A (ja) * 1982-04-13 1983-10-20 ティーディーケイ株式会社 導電性ペ−スト
DE3443789A1 (de) * 1983-12-02 1985-06-27 Osaka Soda Co. Ltd., Osaka Elektrische leitende klebstoffmasse

Also Published As

Publication number Publication date
ATE89430T1 (de) 1993-05-15
EP0291064A3 (en) 1988-12-28
DE3880884D1 (de) 1993-06-17
DE3880884T2 (de) 1993-08-26
EP0291064B1 (de) 1993-05-12
EP0291064A2 (de) 1988-11-17
JPS63301274A (ja) 1988-12-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)