HK95894A - Area-bonding tape - Google Patents

Area-bonding tape

Info

Publication number
HK95894A
HK95894A HK95894A HK95894A HK95894A HK 95894 A HK95894 A HK 95894A HK 95894 A HK95894 A HK 95894A HK 95894 A HK95894 A HK 95894A HK 95894 A HK95894 A HK 95894A
Authority
HK
Hong Kong
Prior art keywords
area
bonding tape
tape
bonding
Prior art date
Application number
HK95894A
Other languages
English (en)
Inventor
Robert R Rohloff
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of HK95894A publication Critical patent/HK95894A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
HK95894A 1984-08-09 1994-09-08 Area-bonding tape HK95894A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63949384A 1984-08-09 1984-08-09

Publications (1)

Publication Number Publication Date
HK95894A true HK95894A (en) 1994-09-16

Family

ID=24564327

Family Applications (1)

Application Number Title Priority Date Filing Date
HK95894A HK95894A (en) 1984-08-09 1994-09-08 Area-bonding tape

Country Status (7)

Country Link
EP (1) EP0171232B1 (fr)
JP (1) JPS6170743A (fr)
KR (1) KR930002909B1 (fr)
CA (1) CA1238959A (fr)
DE (1) DE3587244T2 (fr)
HK (1) HK95894A (fr)
SG (1) SG111194G (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1271819C (fr) * 1986-08-05 1990-07-17 Blindage electrique
GB8719075D0 (en) * 1987-08-12 1987-09-16 Bicc Plc Surface mounted component adaptor
GB2212343A (en) * 1987-11-12 1989-07-19 Peter Elliott Electrical junction
JP2758053B2 (ja) * 1988-02-05 1998-05-25 レイケム・リミテッド 単一軸状電気伝導部品の使用
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
ATE137064T1 (de) * 1988-02-05 1996-05-15 Raychem Ltd Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels
EP0436652A1 (fr) * 1988-09-30 1991-07-17 Raychem Limited Article pour le transfert automatique sur bande de puces hybrides
JPH0810744B2 (ja) * 1989-08-28 1996-01-31 三菱電機株式会社 半導体装置
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
US6407450B1 (en) 1999-07-15 2002-06-18 Altera Corporation Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functions
GB2356287B (en) * 1999-07-15 2004-03-24 Altera Corp Apparatus and method for packaging different sized semiconductor chips on a common substrate
EP1796443A1 (fr) * 2005-12-09 2007-06-13 Delphi Technologies, Inc. Elément de contact et système de liaison électrique

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4731066U (fr) * 1971-04-20 1972-12-08
US4048438A (en) * 1974-10-23 1977-09-13 Amp Incorporated Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
JPS55138794U (fr) * 1979-03-23 1980-10-03
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
FR2518813A1 (fr) * 1981-12-22 1983-06-24 Socapex Support d'interconnexion d'un boitier de circuit integre sur un circuit imprime et systeme d'interconnexion utilisant un tel support
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치

Also Published As

Publication number Publication date
JPH0325021B2 (fr) 1991-04-04
CA1238959A (fr) 1988-07-05
SG111194G (en) 1994-11-25
DE3587244D1 (de) 1993-05-13
EP0171232A2 (fr) 1986-02-12
KR930002909B1 (ko) 1993-04-15
DE3587244T2 (de) 1993-09-02
EP0171232A3 (en) 1987-12-02
JPS6170743A (ja) 1986-04-11
EP0171232B1 (fr) 1993-04-07
KR860002143A (ko) 1986-03-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)