HK93097A - Aligning a substrate with orifices in an ink jet printhead - Google Patents

Aligning a substrate with orifices in an ink jet printhead

Info

Publication number
HK93097A
HK93097A HK93097A HK93097A HK93097A HK 93097 A HK93097 A HK 93097A HK 93097 A HK93097 A HK 93097A HK 93097 A HK93097 A HK 93097A HK 93097 A HK93097 A HK 93097A
Authority
HK
Hong Kong
Prior art keywords
orifices
aligning
substrate
ink jet
jet printhead
Prior art date
Application number
HK93097A
Other languages
English (en)
Inventor
Winthrop D Childers
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of HK93097A publication Critical patent/HK93097A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14362—Assembling elements of heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
HK93097A 1992-04-03 1997-06-26 Aligning a substrate with orifices in an ink jet printhead HK93097A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/864,930 US5297331A (en) 1992-04-03 1992-04-03 Method for aligning a substrate with respect to orifices in an inkjet printhead

Publications (1)

Publication Number Publication Date
HK93097A true HK93097A (en) 1997-08-01

Family

ID=25344352

Family Applications (1)

Application Number Title Priority Date Filing Date
HK93097A HK93097A (en) 1992-04-03 1997-06-26 Aligning a substrate with orifices in an ink jet printhead

Country Status (8)

Country Link
US (1) US5297331A (xx)
EP (1) EP0564080B1 (xx)
JP (1) JP3294896B2 (xx)
KR (1) KR100225706B1 (xx)
CA (1) CA2084344C (xx)
DE (1) DE69305402T2 (xx)
ES (1) ES2093360T3 (xx)
HK (1) HK93097A (xx)

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US5648804A (en) 1992-04-02 1997-07-15 Hewlett-Packard Company Compact inkjet substrate with centrally located circuitry and edge feed ink channels
US5434607A (en) * 1992-04-02 1995-07-18 Hewlett-Packard Company Attachment of nozzle plate to flexible circuit for facilitating assembly of printhead
US5648805A (en) * 1992-04-02 1997-07-15 Hewlett-Packard Company Inkjet printhead architecture for high speed and high resolution printing
US5563642A (en) * 1992-04-02 1996-10-08 Hewlett-Packard Company Inkjet printhead architecture for high speed ink firing chamber refill
US5467115A (en) * 1992-04-02 1995-11-14 Hewlett-Packard Company Inkjet printhead formed to eliminate ink trajectory errors
JPH0883866A (ja) * 1994-07-15 1996-03-26 Shinko Electric Ind Co Ltd 片面樹脂封止型半導体装置の製造方法及びこれに用いるキャリアフレーム
US5538586A (en) * 1994-10-04 1996-07-23 Hewlett-Packard Company Adhesiveless encapsulation of tab circuit traces for ink-jet pen
US5686949A (en) * 1994-10-04 1997-11-11 Hewlett-Packard Company Compliant headland design for thermal ink-jet pen
US5896153A (en) * 1994-10-04 1999-04-20 Hewlett-Packard Company Leak resistant two-material frame for ink-jet print cartridge
US5751323A (en) * 1994-10-04 1998-05-12 Hewlett-Packard Company Adhesiveless printhead attachment for ink-jet pen
US5637166A (en) * 1994-10-04 1997-06-10 Hewlett-Packard Company Similar material thermal tab attachment process for ink-jet pen
TW309483B (xx) * 1995-10-31 1997-07-01 Hewlett Packard Co
JP3503677B2 (ja) * 1997-02-19 2004-03-08 キヤノン株式会社 配線基板の接続方法および配線基板の接続装置
US6102516A (en) * 1997-03-17 2000-08-15 Lexmark International, Inc. Fiducial system and method for conducting an inspection to determine if a second element is properly aligned relative to a first element
US5907333A (en) * 1997-03-28 1999-05-25 Lexmark International, Inc. Ink jet print head containing a radiation curable resin layer
US6339881B1 (en) * 1997-11-17 2002-01-22 Xerox Corporation Ink jet printhead and method for its manufacture
US5950309A (en) * 1998-01-08 1999-09-14 Xerox Corporation Method for bonding a nozzle plate to an ink jet printhead
US6170931B1 (en) 1998-06-19 2001-01-09 Lemark International, Inc. Ink jet heater chip module including a nozzle plate coupling a heater chip to a carrier
US6227651B1 (en) 1998-09-25 2001-05-08 Hewlett-Packard Company Lead frame-mounted ink jet print head module
CA2251293C (en) * 1998-10-22 2003-05-20 Microjet Technology Co., Ltd. Inkjet nozzle aligning apparatus
US6402299B1 (en) 1999-10-22 2002-06-11 Lexmark International, Inc. Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer
US6357864B1 (en) * 1999-12-16 2002-03-19 Lexmark International, Inc. Tab circuit design for simplified use with hot bar soldering technique
US6971170B2 (en) * 2000-03-28 2005-12-06 Microjet Technology Co., Ltd Method of manufacturing printhead
US6619786B2 (en) 2001-06-08 2003-09-16 Lexmark International, Inc. Tab circuit for ink jet printer cartridges
US7357486B2 (en) * 2001-12-20 2008-04-15 Hewlett-Packard Development Company, L.P. Method of laser machining a fluid slot
US6951778B2 (en) * 2002-10-31 2005-10-04 Hewlett-Packard Development Company, L.P. Edge-sealed substrates and methods for effecting the same
KR100656513B1 (ko) * 2004-07-12 2006-12-13 삼성전자주식회사 잉크젯 카트리지의 노즐테이프
JP4630719B2 (ja) * 2005-04-14 2011-02-09 キヤノン株式会社 インクジェット記録ヘッド
US8205966B2 (en) * 2008-12-18 2012-06-26 Canon Kabushiki Kaisha Inkjet print head and print element substrate for the same
US20100154190A1 (en) * 2008-12-19 2010-06-24 Sanger Kurt M Method of making a composite device
JP5843444B2 (ja) * 2011-01-07 2016-01-13 キヤノン株式会社 液体吐出ヘッドの製造方法および液体吐出ヘッド
JP6207205B2 (ja) * 2013-04-04 2017-10-04 キヤノン株式会社 液体吐出ヘッド、ならびに記録素子基板およびその製造方法

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US4450455A (en) * 1981-06-18 1984-05-22 Canon Kabushiki Kaisha Ink jet head
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Also Published As

Publication number Publication date
KR930021393A (ko) 1993-11-22
US5297331A (en) 1994-03-29
DE69305402T2 (de) 1997-03-06
CA2084344A1 (en) 1993-10-03
ES2093360T3 (es) 1996-12-16
JPH0623997A (ja) 1994-02-01
DE69305402D1 (de) 1996-11-21
JP3294896B2 (ja) 2002-06-24
CA2084344C (en) 2002-05-28
EP0564080A2 (en) 1993-10-06
EP0564080B1 (en) 1996-10-16
KR100225706B1 (ko) 1999-10-15
EP0564080A3 (xx) 1994-03-30

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20060211