HK64079A - Improvements in or relating to wire bonding - Google Patents

Improvements in or relating to wire bonding

Info

Publication number
HK64079A
HK64079A HK640/79A HK64079A HK64079A HK 64079 A HK64079 A HK 64079A HK 640/79 A HK640/79 A HK 640/79A HK 64079 A HK64079 A HK 64079A HK 64079 A HK64079 A HK 64079A
Authority
HK
Hong Kong
Prior art keywords
wire bonding
relating
capillary
engaging portion
actuating rod
Prior art date
Application number
HK640/79A
Other languages
English (en)
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK64079A publication Critical patent/HK64079A/xx

Links

Classifications

    • H10P72/0444—
    • H10W72/0711—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
HK640/79A 1973-09-12 1979-09-06 Improvements in or relating to wire bonding HK64079A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10203973A JPS5329475B2 (en:Method) 1973-09-12 1973-09-12

Publications (1)

Publication Number Publication Date
HK64079A true HK64079A (en) 1979-09-14

Family

ID=14316615

Family Applications (1)

Application Number Title Priority Date Filing Date
HK640/79A HK64079A (en) 1973-09-12 1979-09-06 Improvements in or relating to wire bonding

Country Status (6)

Country Link
US (1) US3894672A (en:Method)
JP (1) JPS5329475B2 (en:Method)
DE (1) DE2420980A1 (en:Method)
GB (1) GB1465956A (en:Method)
HK (1) HK64079A (en:Method)
MY (1) MY8000122A (en:Method)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121241A (en) * 1981-01-21 1982-07-28 Shinkawa Ltd Capillary up-and-down motion mechanism
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary
DD258193A1 (de) * 1987-03-02 1988-07-13 Elektromat Veb Antrieb fuer eine hochgeschwindigkeitsdrahtkontaktiereinrichtung
US4826069A (en) * 1988-03-21 1989-05-02 Asm Assembly Automation, Ltd. Work chuck for wire bonder and method
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3313464A (en) * 1963-11-07 1967-04-11 Western Electric Co Thermocompression bonding apparatus
US3430835A (en) * 1966-06-07 1969-03-04 Westinghouse Electric Corp Wire bonding apparatus for microelectronic components
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3819102A (en) * 1971-05-07 1974-06-25 Tokyo Sokuhan Kk Loop height adjusting device for a supersonic wire bonder

Also Published As

Publication number Publication date
US3894672A (en) 1975-07-15
MY8000122A (en) 1980-12-31
JPS5055263A (en:Method) 1975-05-15
DE2420980A1 (de) 1975-03-13
GB1465956A (en) 1977-03-02
JPS5329475B2 (en:Method) 1978-08-21

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