HK32086A - Corrosion inhibition of copper containing articles - Google Patents

Corrosion inhibition of copper containing articles

Info

Publication number
HK32086A
HK32086A HK32086A HK32086A HK32086A HK 32086 A HK32086 A HK 32086A HK 32086 A HK32086 A HK 32086A HK 32086 A HK32086 A HK 32086A HK 32086 A HK32086 A HK 32086A
Authority
HK
Hong Kong
Prior art keywords
corrosion inhibition
copper containing
containing articles
articles
copper
Prior art date
Application number
HK32086A
Other languages
English (en)
Inventor
Norris Dale Hobbins
Ronald Frederick Roberts
Original Assignee
At & T Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Technologies Inc filed Critical At & T Technologies Inc
Publication of HK32086A publication Critical patent/HK32086A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
HK32086A 1981-08-17 1986-05-08 Corrosion inhibition of copper containing articles HK32086A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/293,446 US4395294A (en) 1981-08-17 1981-08-17 Copper corrosion inhibitor

Publications (1)

Publication Number Publication Date
HK32086A true HK32086A (en) 1986-05-16

Family

ID=23129116

Family Applications (1)

Application Number Title Priority Date Filing Date
HK32086A HK32086A (en) 1981-08-17 1986-05-08 Corrosion inhibition of copper containing articles

Country Status (9)

Country Link
US (1) US4395294A (xx)
EP (1) EP0085701B1 (xx)
JP (1) JPS58501281A (xx)
CA (1) CA1172525A (xx)
DE (1) DE3273639D1 (xx)
GB (1) GB2104107B (xx)
HK (1) HK32086A (xx)
IT (1) IT1153170B (xx)
WO (1) WO1983000704A1 (xx)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6190492A (ja) * 1984-10-11 1986-05-08 四国化成工業株式会社 銅スル−ホ−ルプリント配線板の製造方法
US5098010A (en) * 1987-01-30 1992-03-24 Carmichael Arthur O Process using protective flux coatings for delaying joining and soldering operations
US4731128A (en) * 1987-05-21 1988-03-15 International Business Machines Corporation Protection of copper from corrosion
US5243047A (en) * 1988-02-15 1993-09-07 Imperial Chemical Industries Plc Triazole/thiazole amino-s-triazine bonding agents
KR960008153B1 (ko) * 1989-10-03 1996-06-20 다찌바나 다이끼찌 금속 공작용 표면 처리제
EP0428383A1 (en) * 1989-11-13 1991-05-22 Shikoku Chemicals Corporation Process for surface treatment of copper and copper alloy
JPH04206681A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 印刷配線板の表面処理方法及び印刷配線板
US5478607A (en) * 1991-05-17 1995-12-26 Hitachi Telecon Technologies Ltd. Method for use of preflux, printed wiring board, and method for production thereof
AU2927392A (en) * 1991-11-01 1993-06-07 National-Standard Company Age resistant solder coatings
US5316573A (en) * 1992-03-12 1994-05-31 International Business Machines Corporation Corrosion inhibition with CU-BTA
US5376189A (en) * 1993-11-08 1994-12-27 Macdermid, Incorporated Composition and process for treatment of metallic surfaces
US5362334A (en) * 1993-12-23 1994-11-08 Macdermid, Incorporated Composition and process for treatment of metallic surfaces
JP2550915B2 (ja) * 1994-06-21 1996-11-06 日本電気株式会社 印刷配線板の表面保護剤および表面保護膜の形成方法
DE4444388A1 (de) * 1994-11-28 1996-05-30 Atotech Deutschland Gmbh Verfahren zum Bonden von Drähten auf oxidationsempfindlichen, lötbaren Metallsubstraten
WO1997039610A1 (en) * 1996-04-18 1997-10-23 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
US5686676A (en) * 1996-05-07 1997-11-11 Brush Wellman Inc. Process for making improved copper/tungsten composites
US6265667B1 (en) 1998-01-14 2001-07-24 Belden Wire & Cable Company Coaxial cable
US6150269A (en) * 1998-09-11 2000-11-21 Chartered Semiconductor Manufacturing Company, Ltd. Copper interconnect patterning
EP1008675B1 (en) * 1998-12-10 2004-10-27 International Business Machines Corporation Copper pretreatment for tin solder alloy deposition
US6524644B1 (en) * 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
JP2002070867A (ja) * 2000-09-01 2002-03-08 Sankyo Seiki Mfg Co Ltd 軸受部材及びその製造方法、並びに動圧軸受装置
US7794531B2 (en) * 2007-01-08 2010-09-14 Enthone Inc. Organic solderability preservative comprising high boiling temperature alcohol
US7883738B2 (en) * 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
US10017863B2 (en) * 2007-06-21 2018-07-10 Joseph A. Abys Corrosion protection of bronzes
TWI453301B (zh) 2007-11-08 2014-09-21 Enthone 浸鍍銀塗層上的自組分子
US7972655B2 (en) * 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
EP2445322B1 (en) * 2009-06-01 2013-07-10 Sumitomo Electric Industries, Ltd. Connection method
DE102009047043A1 (de) * 2009-10-19 2011-04-21 Robert Bosch Gmbh Lötfreie elektrische Verbindung
CN104060277A (zh) * 2013-03-20 2014-09-24 江苏核电有限公司 一种核电机组核岛设备冷却水系统加缓蚀剂的防腐蚀工艺
MX2017015290A (es) 2015-05-28 2018-02-19 Ecolab Usa Inc Derivados de pirazol solubles en agua como inhibidores de corrosion.
EP3314038B1 (en) 2015-05-28 2021-12-29 Ecolab Usa Inc. Purine-based corrosion inhibitors
EP4234760A1 (en) 2015-05-28 2023-08-30 Ecolab USA Inc. Formulation comprising 2-substituted benzimidazole or 2-substituted imidazole corrosion inhibitors
ES2899038T3 (es) 2015-05-28 2022-03-09 Ecolab Usa Inc Nuevos inhibidores de la corrosión
JP7337807B2 (ja) * 2018-01-03 2023-09-04 エコラボ ユーエスエー インコーポレイティド 水中での金属腐食を低減するためのプロセスおよび方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3645772A (en) * 1970-06-30 1972-02-29 Du Pont Process for improving bonding of a photoresist to copper
US3716421A (en) * 1971-03-19 1973-02-13 Gte Sylvania Inc Compositions for improved solderability of copper
US3933531A (en) * 1972-04-11 1976-01-20 Natsuo Sawa Method of rust-preventing for copper and copper alloy
CA1083335A (en) * 1976-05-10 1980-08-12 Chemed Corporation Composition and method of inhibiting corrosion
JPS5677383A (en) * 1979-11-30 1981-06-25 Japan Organo Co Ltd Preventing method for corrosion of aluminum, copper, or copper alloy

Also Published As

Publication number Publication date
IT8222863A0 (it) 1982-08-13
JPS58501281A (ja) 1983-08-04
GB2104107A (en) 1983-03-02
CA1172525A (en) 1984-08-14
DE3273639D1 (en) 1986-11-13
EP0085701A4 (en) 1983-12-23
US4395294A (en) 1983-07-26
EP0085701A1 (en) 1983-08-17
GB2104107B (en) 1985-07-24
IT1153170B (it) 1987-01-14
WO1983000704A1 (en) 1983-03-03
EP0085701B1 (en) 1986-10-08

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Legal Events

Date Code Title Description
PE Patent expired