Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
  • C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
  • C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
  • C22C32/0031—Matrix based on refractory metals, W, Mo, Nb, Hf, Ta, Zr, Ti, V or alloys thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/492—Bases or plates or solder therefor
  • H01L23/4924—Bases or plates or solder therefor characterised by the materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Materials Engineering (AREA)
• Powder Metallurgy (AREA)
• Electrodes Of Semiconductors (AREA)
• Superconductors And Manufacturing Methods Therefor (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=19846808

Family Applications (1)

Country Status (7)

Families Citing this family (2)

Family Cites Families (7)

• 1985
  • 1985-11-05 NL NL8503023A patent/NL8503023A/nl not_active Application Discontinuation
• 1986
  • 1986-03-13 US US06/839,249 patent/US4758874A/en not_active Expired - Lifetime
  • 1986-11-03 KR KR1019860009237A patent/KR950000206B1/ko not_active IP Right Cessation
  • 1986-11-03 DE DE8686201914T patent/DE3677570D1/de not_active Expired - Lifetime
  • 1986-11-03 EP EP86201914A patent/EP0223286B1/en not_active Expired - Lifetime
  • 1986-11-04 JP JP61260825A patent/JPH0744248B2/ja not_active Expired - Fee Related
  • 1986-12-18 US US06/944,292 patent/US4748493A/en not_active Expired - Lifetime
• 1993
  • 1993-02-25 HK HK157/93A patent/HK15793A/xx not_active IP Right Cessation

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