HK1253047A1 - 用於借助絕緣薄層以電方式進行力測量的方法和裝置 - Google Patents

用於借助絕緣薄層以電方式進行力測量的方法和裝置

Info

Publication number
HK1253047A1
HK1253047A1 HK18112427.8A HK18112427A HK1253047A1 HK 1253047 A1 HK1253047 A1 HK 1253047A1 HK 18112427 A HK18112427 A HK 18112427A HK 1253047 A1 HK1253047 A1 HK 1253047A1
Authority
HK
Hong Kong
Prior art keywords
thin layer
force measurement
insulating thin
electrical force
electrical
Prior art date
Application number
HK18112427.8A
Other languages
English (en)
Inventor
簡‧克萊姆
Original Assignee
簡‧克萊姆
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 簡‧克萊姆 filed Critical 簡‧克萊姆
Publication of HK1253047A1 publication Critical patent/HK1253047A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • G01L1/2262—Measuring circuits therefor involving simple electrical bridges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2268—Arrangements for correcting or for compensating unwanted effects
    • G01L1/2281—Arrangements for correcting or for compensating unwanted effects for temperature variations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/26—Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Pressure Sensors (AREA)
  • Measurement Of Force In General (AREA)
  • Thermistors And Varistors (AREA)
HK18112427.8A 2014-07-18 2018-09-27 用於借助絕緣薄層以電方式進行力測量的方法和裝置 HK1253047A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014110127 2014-07-18
DE102015111425.9A DE102015111425B4 (de) 2014-07-18 2015-07-14 Verfahren und Einrichtung zur elektrischen Kraftmessung mittels Isolationsdünnschicht

Publications (1)

Publication Number Publication Date
HK1253047A1 true HK1253047A1 (zh) 2019-06-06

Family

ID=69188619

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18112427.8A HK1253047A1 (zh) 2014-07-18 2018-09-27 用於借助絕緣薄層以電方式進行力測量的方法和裝置

Country Status (12)

Country Link
US (1) US10386251B2 (zh)
EP (1) EP3298371B1 (zh)
KR (1) KR102491230B1 (zh)
CN (1) CN107873081B (zh)
BR (1) BR112017028583B1 (zh)
DE (2) DE102015111425B4 (zh)
ES (1) ES2726289T3 (zh)
HK (1) HK1253047A1 (zh)
IL (1) IL256713B (zh)
MX (1) MX2018000534A (zh)
WO (1) WO2017008784A1 (zh)
ZA (1) ZA201708347B (zh)

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US11454563B2 (en) * 2016-08-05 2022-09-27 Encite Llc Micro pressure sensor
CN108287033B (zh) 2018-01-31 2019-12-27 京东方科技集团股份有限公司 压感检测电路和方法以及显示面板、显示装置
US10926523B2 (en) * 2018-06-19 2021-02-23 Sensel, Inc. Performance enhancement of sensors through surface processing
CN109540345B (zh) * 2018-12-04 2020-09-04 北京科技大学 一种拉伸非灵敏型自驱动压力传感器制备方法
CN110779960B (zh) * 2019-11-13 2021-07-30 上海交通大学 基于电阻变化的cfrp损伤检测方法
WO2021102295A1 (en) * 2019-11-21 2021-05-27 Thomas Baer Systems and methods for detecting running and walking strides and foot strikes
CN111366275B (zh) * 2020-03-12 2022-04-15 郑州大学 一种纳米压力传感器及其制备方法
GB2594336A (en) * 2020-04-21 2021-10-27 Cirrus Logic Int Semiconductor Ltd Force sensing systems
CN111697280B (zh) * 2020-06-22 2021-07-09 清华大学 可实时监测电极应力变化的电池装置、采用该装置的电池和该装置的应用
DE102021132509A1 (de) * 2021-12-09 2023-06-15 Tacterion Gmbh Resistiver und kapazitiver Kraftsensor und Verfahren zum Betrieb desselben
US11835401B2 (en) * 2022-08-26 2023-12-05 Mike Horia Mihail Teodorescu Sensors for pressure, forces, and couples

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WO1992003740A1 (en) * 1990-08-17 1992-03-05 Analog Devices, Inc. Monolithic accelerometer
DE19716588A1 (de) * 1996-04-20 1997-11-13 Sensotronik Gmbh Kraftsensor
JP3951359B2 (ja) * 1997-05-30 2007-08-01 宇部興産株式会社 圧電結晶膜
DE19954164B4 (de) 1999-11-10 2008-08-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensor zur Zustandsbestimmung von Kenngrößen an mechanischen Komponenten unter Verwendung von amorphen Kohlenstoffschichten mit piezoresistiven Eigenschaften
CN1479964A (zh) * 2000-12-11 2004-03-03 ���¡���ɣ����� 静电设备
JP2003214962A (ja) 2002-01-18 2003-07-30 Toyoda Mach Works Ltd 荷重センサー
DE10253178B4 (de) * 2002-09-10 2004-08-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verwendung einer Schicht aus diamantartigem Kohlenstoff
JP3948452B2 (ja) * 2003-11-04 2007-07-25 松下電器産業株式会社 荷重センサ及びその製造方法
DE102005002523B4 (de) * 2005-01-19 2015-11-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zur Messung der Kraft bei Bremsaktuatoren
DE102006019942B4 (de) 2006-04-28 2016-01-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Kraftmessvorrichtung zur Messung der Kraft bei Festkörperaktoren, Verfahren zur Messung einer Kraft sowie Verwendung der Kraftmessvorrichtung
DE102007029683B4 (de) * 2007-06-27 2011-07-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 Verfahren zur Messung von Zustandsgrößen an mechanischen Komponenten
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DE102010030791A1 (de) * 2010-07-01 2012-01-05 Endress + Hauser Gmbh + Co. Kg Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße eines Mediums
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EP2725595A1 (en) * 2012-10-25 2014-04-30 Delfmems MEMS fixed capacitor comprising a gas-containing gap and process for manufacturing said capacitor
KR101583221B1 (ko) * 2015-06-17 2016-01-07 주식회사 하이딥 압력 검출을 위한 전극시트 및 이를 포함하는 압력 검출 모듈

Also Published As

Publication number Publication date
EP3298371B1 (de) 2019-02-13
MX2018000534A (es) 2018-05-07
DE102015111425B4 (de) 2016-06-30
ZA201708347B (en) 2019-06-26
IL256713A (en) 2018-02-28
DE102015111425A1 (de) 2016-01-21
CN107873081B (zh) 2020-03-27
US20190011316A1 (en) 2019-01-10
KR20180030032A (ko) 2018-03-21
KR102491230B1 (ko) 2023-01-20
IL256713B (en) 2022-03-01
US10386251B2 (en) 2019-08-20
EP3298371A1 (de) 2018-03-28
ES2726289T3 (es) 2019-10-03
CN107873081A (zh) 2018-04-03
BR112017028583A2 (pt) 2018-09-04
DE112016003177A5 (de) 2018-03-29
WO2017008784A1 (de) 2017-01-19
BR112017028583B1 (pt) 2021-06-22

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