HK1218349A1 - 具有具備中心接觸件的溝道區域的光傳感器 - Google Patents
具有具備中心接觸件的溝道區域的光傳感器Info
- Publication number
- HK1218349A1 HK1218349A1 HK16106307.7A HK16106307A HK1218349A1 HK 1218349 A1 HK1218349 A1 HK 1218349A1 HK 16106307 A HK16106307 A HK 16106307A HK 1218349 A1 HK1218349 A1 HK 1218349A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- photosensor
- channel region
- center contact
- center
- contact
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14679—Junction field effect transistor [JFET] imagers; static induction transistor [SIT] imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/506,399 US20160099283A1 (en) | 2014-10-03 | 2014-10-03 | Photosensor with channel region having center contact |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1218349A1 true HK1218349A1 (zh) | 2017-02-10 |
Family
ID=55633366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16106307.7A HK1218349A1 (zh) | 2014-10-03 | 2016-06-02 | 具有具備中心接觸件的溝道區域的光傳感器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160099283A1 (zh) |
CN (1) | CN105489622B (zh) |
HK (1) | HK1218349A1 (zh) |
TW (1) | TWI577004B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11398519B2 (en) * | 2017-12-09 | 2022-07-26 | National University Corporation Shizuoka University | Charge modulation element and solid-state imaging device |
US10580820B2 (en) | 2018-07-16 | 2020-03-03 | Gigajot Technology Inc. | High-sensitivity depth sensor with non-avalanche photodetector |
US11061119B2 (en) * | 2018-10-10 | 2021-07-13 | Sensors Unlimited, Inc. | Pixels for time of flight (TOF) imaging |
JP2022108157A (ja) * | 2021-01-12 | 2022-07-25 | キオクシア株式会社 | 半導体装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6188093B1 (en) * | 1997-09-02 | 2001-02-13 | Nikon Corporation | Photoelectric conversion devices and photoelectric conversion apparatus employing the same |
JP3783360B2 (ja) * | 1997-09-02 | 2006-06-07 | 株式会社ニコン | 光電変換素子及び光電変換装置 |
JP2005197350A (ja) * | 2004-01-05 | 2005-07-21 | Seiko Epson Corp | 固体撮像装置 |
US7153719B2 (en) * | 2004-08-24 | 2006-12-26 | Micron Technology, Inc. | Method of fabricating a storage gate pixel design |
US7442970B2 (en) * | 2004-08-30 | 2008-10-28 | Micron Technology, Inc. | Active photosensitive structure with buried depletion layer |
US7692220B2 (en) * | 2007-05-01 | 2010-04-06 | Suvolta, Inc. | Semiconductor device storage cell structure, method of operation, and method of manufacture |
KR101344441B1 (ko) * | 2007-07-16 | 2013-12-23 | 삼성전자 주식회사 | 이미지 센서 및 그 제조 방법 |
US8698061B2 (en) * | 2009-12-10 | 2014-04-15 | Luxima Technology LLC | Image sensors, methods, and pixels with storage and transfer gates |
KR20130085228A (ko) * | 2012-01-19 | 2013-07-29 | 삼성전자주식회사 | 이미지 센서, 이의 동작 방법, 및 이를 포함하는 휴대용 장치 |
US8933494B1 (en) * | 2013-09-26 | 2015-01-13 | Omnivision Technologies, Inc. | Image sensor pixel cell having dual self-aligned implants next to storage gate |
-
2014
- 2014-10-03 US US14/506,399 patent/US20160099283A1/en not_active Abandoned
-
2015
- 2015-09-30 CN CN201510642365.9A patent/CN105489622B/zh active Active
- 2015-10-02 TW TW104132613A patent/TWI577004B/zh active
-
2016
- 2016-06-02 HK HK16106307.7A patent/HK1218349A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN105489622B (zh) | 2018-10-16 |
TW201618293A (zh) | 2016-05-16 |
US20160099283A1 (en) | 2016-04-07 |
TWI577004B (zh) | 2017-04-01 |
CN105489622A (zh) | 2016-04-13 |
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