HK1215877A1 - Portable rotary apparatus and film formation apparatus - Google Patents

Portable rotary apparatus and film formation apparatus

Info

Publication number
HK1215877A1
HK1215877A1 HK16103857.8A HK16103857A HK1215877A1 HK 1215877 A1 HK1215877 A1 HK 1215877A1 HK 16103857 A HK16103857 A HK 16103857A HK 1215877 A1 HK1215877 A1 HK 1215877A1
Authority
HK
Hong Kong
Prior art keywords
film formation
portable rotary
formation apparatus
rotary apparatus
portable
Prior art date
Application number
HK16103857.8A
Other languages
Chinese (zh)
Inventor
石井孝宣
千葉幸喜
佐藤康弘
Original Assignee
Shincron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shincron Co Ltd filed Critical Shincron Co Ltd
Publication of HK1215877A1 publication Critical patent/HK1215877A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
HK16103857.8A 2014-06-03 2016-04-05 Portable rotary apparatus and film formation apparatus HK1215877A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014115098A JP5727073B1 (en) 2014-06-03 2014-06-03 Portable rotating apparatus and film forming apparatus
PCT/JP2015/065900 WO2015186702A1 (en) 2014-06-03 2015-06-02 Portable rotary apparatus and film formation apparatus

Publications (1)

Publication Number Publication Date
HK1215877A1 true HK1215877A1 (en) 2016-09-23

Family

ID=53437866

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16103857.8A HK1215877A1 (en) 2014-06-03 2016-04-05 Portable rotary apparatus and film formation apparatus

Country Status (6)

Country Link
JP (1) JP5727073B1 (en)
CN (1) CN105324513B (en)
HK (1) HK1215877A1 (en)
MY (1) MY181764A (en)
TW (1) TWI586906B (en)
WO (1) WO2015186702A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11358168B2 (en) 2019-06-18 2022-06-14 Visera Technologies Company Limited Coating apparatus
DE102020118367A1 (en) * 2020-07-13 2022-01-13 Carl Zeiss Vision International Gmbh Device for picking up an object in a vacuum coating system
CN114807865A (en) * 2022-04-18 2022-07-29 兰州交通大学 Vacuum evaporation equipment capable of coating films on two sides
CN114752911B (en) * 2022-04-22 2024-04-05 捷捷微电(南通)科技有限公司 Planet type dome mounting frame and vacuum coating machine

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0689442B2 (en) * 1987-06-05 1994-11-09 新明和工業株式会社 Vacuum deposition equipment
US5124013A (en) * 1988-02-08 1992-06-23 Optical Coating Laboratory, Inc. High ratio planetary drive system and method for vacuum chamber
JP2981682B2 (en) * 1990-11-30 1999-11-22 新明和工業株式会社 Vacuum evaporation system of continuous film formation method
JP3579074B2 (en) * 1993-11-16 2004-10-20 オリンパス株式会社 Thin film deposition apparatus and thin film deposition method
JPH07228974A (en) * 1994-02-17 1995-08-29 Asahi Optical Co Ltd Vapor deposition device
TW200712238A (en) * 2005-09-07 2007-04-01 Bohhen Optronics Co Ltd Fixture for large-sized sheet of film-deposition
JP5034578B2 (en) * 2007-03-15 2012-09-26 パナソニック株式会社 Thin film processing equipment
EP2302092B1 (en) * 2008-06-17 2015-12-23 Shincron Co., Ltd. Bias sputtering apparatus
CN101407906B (en) * 2008-10-20 2011-04-27 舟山市汉邦机械科技有限公司 Vacuum film plating apparatus
JP2012227231A (en) * 2011-04-15 2012-11-15 Japan Pionics Co Ltd Vapor-phase growth device of group iii nitride semiconductor

Also Published As

Publication number Publication date
WO2015186702A1 (en) 2015-12-10
CN105324513A (en) 2016-02-10
JP2015229779A (en) 2015-12-21
TW201546386A (en) 2015-12-16
MY181764A (en) 2021-01-06
CN105324513B (en) 2017-03-15
JP5727073B1 (en) 2015-06-03
TWI586906B (en) 2017-06-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210527