HK1212398A1 - Lead-free solder alloys and solder joints thereof with improved drop impact resistance - Google Patents

Lead-free solder alloys and solder joints thereof with improved drop impact resistance

Info

Publication number
HK1212398A1
HK1212398A1 HK16100180.2A HK16100180A HK1212398A1 HK 1212398 A1 HK1212398 A1 HK 1212398A1 HK 16100180 A HK16100180 A HK 16100180A HK 1212398 A1 HK1212398 A1 HK 1212398A1
Authority
HK
Hong Kong
Prior art keywords
lead
impact resistance
drop impact
improved drop
solder
Prior art date
Application number
HK16100180.2A
Other languages
English (en)
Chinese (zh)
Inventor
．劉
．李
Original Assignee
Indium Corp America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indium Corp America filed Critical Indium Corp America
Publication of HK1212398A1 publication Critical patent/HK1212398A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
HK16100180.2A 2005-12-13 2016-01-08 Lead-free solder alloys and solder joints thereof with improved drop impact resistance HK1212398A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74961505P 2005-12-13 2005-12-13
US11/567,525 US9260768B2 (en) 2005-12-13 2006-12-06 Lead-free solder alloys and solder joints thereof with improved drop impact resistance

Publications (1)

Publication Number Publication Date
HK1212398A1 true HK1212398A1 (en) 2016-06-10

Family

ID=38139571

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16100180.2A HK1212398A1 (en) 2005-12-13 2016-01-08 Lead-free solder alloys and solder joints thereof with improved drop impact resistance

Country Status (5)

Country Link
US (1) US9260768B2 (xx)
EP (1) EP1977022A4 (xx)
CN (1) CN105063419A (xx)
HK (1) HK1212398A1 (xx)
WO (1) WO2007070548A2 (xx)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
US9260768B2 (en) 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
US9175368B2 (en) 2005-12-13 2015-11-03 Indium Corporation MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
US20090127695A1 (en) * 2007-11-19 2009-05-21 Patrick Kim Surface mount package with enhanced strength solder joint
US20100203353A1 (en) * 2009-02-06 2010-08-12 Iowa State University Research Foundation, Inc. Pb-Free Sn-Ag-Cu-Mn Solder
US8530058B1 (en) * 2009-03-06 2013-09-10 Arizona Board Of Regents, For And On Behalf Of Arizona State University Oxidation resistant Pb-free solder alloys
TWI384925B (zh) * 2009-03-17 2013-02-01 Advanced Semiconductor Eng 內埋式線路基板之結構及其製造方法
KR20210008568A (ko) * 2011-08-02 2021-01-22 알파 어셈블리 솔루션스 인크. 고 충격 인성 땜납 합금
CN103906596B (zh) * 2011-10-04 2017-03-01 铟泰公司 具有优越的降落冲击可靠性的Mn掺杂的Sn基焊料合金及其焊缝
JP6395713B2 (ja) * 2012-10-09 2018-09-26 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 鉛フリーかつアンチモンフリーの高温信頼性錫はんだ
US10180035B2 (en) * 2013-04-01 2019-01-15 Schlumberger Technology Corporation Soldered components for downhole use
US10322471B2 (en) * 2014-07-21 2019-06-18 Alpha Assembly Solutions Inc. Low temperature high reliability alloy for solder hierarchy
JP5880766B1 (ja) * 2015-05-26 2016-03-09 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手
US10195698B2 (en) 2015-09-03 2019-02-05 AIM Metals & Alloys Inc. Lead-free high reliability solder alloys
CN105479026B (zh) * 2015-12-09 2018-01-23 天津大学 一种提高纳米银浆与化学镀镍金基板连接强度的方法
DE102016112390B4 (de) 2016-07-06 2021-08-12 Infineon Technologies Ag Lötpad und Verfahren zum Verbessern der Lötpadoberfläche
CN108080810A (zh) * 2017-12-13 2018-05-29 柳州智臻智能机械有限公司 一种电子封装用焊料合金及其制备方法
KR20210138614A (ko) 2019-02-26 2021-11-19 인듐 코포레이션 가혹한 서비스 조건을 위한 고 신뢰성의 무연 땜납 합금

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JP2891432B2 (ja) 1989-12-27 1999-05-17 田中電子工業株式会社 半導体材料の接続方法，それに用いる接続材料及び半導体装置
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JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
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WO2004113013A1 (ja) 2003-06-24 2004-12-29 Kabushiki Kaisha Toshiba はんだ部材、はんだ材料、はんだ付け方法、はんだ材料の製造方法およびはんだ接合部材
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JP4305751B2 (ja) 2003-10-15 2009-07-29 千住金属工業株式会社 ランプ用高温鉛フリーはんだ
US20050100474A1 (en) 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
JP4391276B2 (ja) * 2004-03-12 2009-12-24 新日鉄マテリアルズ株式会社 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材
CN1269613C (zh) 2004-08-24 2006-08-16 陈明汉 一种改进型Sn－0.7wt%Cu无铅焊料
CN1302891C (zh) 2004-12-17 2007-03-07 北京工业大学 含稀土的SnAgCuY锡基无铅钎料
US9260768B2 (en) 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
CN1887500A (zh) 2006-06-20 2007-01-03 包德为 一种无铅焊锡膏
JP4847898B2 (ja) 2007-03-07 2011-12-28 日立電線株式会社 配線用導体およびその製造方法

Also Published As

Publication number Publication date
WO2007070548A3 (en) 2007-11-22
CN105063419A (zh) 2015-11-18
EP1977022A4 (en) 2008-12-31
WO2007070548A2 (en) 2007-06-21
EP1977022A2 (en) 2008-10-08
US9260768B2 (en) 2016-02-16
US20070134125A1 (en) 2007-06-14

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