HK1204158A1 - Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same - Google Patents

Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Info

Publication number
HK1204158A1
HK1204158A1 HK15104312.6A HK15104312A HK1204158A1 HK 1204158 A1 HK1204158 A1 HK 1204158A1 HK 15104312 A HK15104312 A HK 15104312A HK 1204158 A1 HK1204158 A1 HK 1204158A1
Authority
HK
Hong Kong
Prior art keywords
substrate
semiconductor laser
chip package
laser chip
forming same
Prior art date
Application number
HK15104312.6A
Other languages
English (en)
Chinese (zh)
Inventor
Jin Han Ju
Robert Burman
Jerry Deleon
Original Assignee
Excelitas Canada Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/411,275 external-priority patent/US8791492B2/en
Application filed by Excelitas Canada Inc filed Critical Excelitas Canada Inc
Publication of HK1204158A1 publication Critical patent/HK1204158A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK15104312.6A 2012-03-02 2015-05-06 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same HK1204158A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/411,275 US8791492B2 (en) 2009-10-01 2012-03-02 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
PCT/US2013/027987 WO2013130580A2 (en) 2012-03-02 2013-02-27 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Publications (1)

Publication Number Publication Date
HK1204158A1 true HK1204158A1 (en) 2015-11-06

Family

ID=47846203

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104312.6A HK1204158A1 (en) 2012-03-02 2015-05-06 Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same

Country Status (6)

Country Link
EP (1) EP2820726B1 (uk)
JP (1) JP2015510277A (uk)
KR (1) KR20140131974A (uk)
HK (1) HK1204158A1 (uk)
TW (1) TW201344994A (uk)
WO (1) WO2013130580A2 (uk)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114292A1 (de) 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
WO2019190676A1 (en) * 2018-03-30 2019-10-03 Applied Materials, Inc. Integrating 3d printing into multi-process fabrication schemes
CN113972554A (zh) * 2020-07-24 2022-01-25 上海禾赛科技有限公司 激光器封装结构、激光器芯片的封装方法及激光雷达
CN116458021A (zh) 2020-11-13 2023-07-18 罗姆股份有限公司 半导体发光装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193083A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd フアイバ装着用半導体レ−ザ装置
JPS61272987A (ja) * 1985-05-29 1986-12-03 Hitachi Ltd 半導体レ−ザ素子
JPS62120372U (uk) * 1986-01-23 1987-07-30
US5852696A (en) * 1994-06-29 1998-12-22 British Telecommunications Public Limited Company Packaged optical device
US5627851A (en) * 1995-02-10 1997-05-06 Ricoh Company, Ltd. Semiconductor light emitting device
JP2002042365A (ja) * 2000-07-21 2002-02-08 Sankyo Seiki Mfg Co Ltd 光ヘッド装置の光源装置
JP2002217479A (ja) * 2001-01-17 2002-08-02 Sankyo Seiki Mfg Co Ltd レーザ光源装置、レーザ光源装置の製造方法、および光ヘッド装置
WO2002103866A1 (en) * 2001-06-15 2002-12-27 Nichia Corporation Semiconductor laser element, and its manufacturing method
US8791492B2 (en) * 2009-10-01 2014-07-29 Excelitas Canada, Inc. Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
US8431951B2 (en) * 2009-10-01 2013-04-30 Excelitas Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation

Also Published As

Publication number Publication date
EP2820726A2 (en) 2015-01-07
JP2015510277A (ja) 2015-04-02
WO2013130580A3 (en) 2013-11-14
WO2013130580A2 (en) 2013-09-06
WO2013130580A8 (en) 2014-01-03
TW201344994A (zh) 2013-11-01
KR20140131974A (ko) 2014-11-14
EP2820726B1 (en) 2018-05-02

Similar Documents

Publication Publication Date Title
TWI562295B (en) Semiconductor package and method for fabricating base for semiconductor package
SG11201602233PA (en) Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package
GB2520149B (en) Die package with superposer substrate for passive components
EP2936558A4 (en) SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING THE BASE FOR THE SEMICONDUCTOR PACKAGE
EP2940739A4 (en) HYBRID, INTEGRATED OPTOELECTRONIC SILICA-ON-SILICON CHIP AND METHOD OF MANUFACTURING THEREOF
EP2908353A4 (en) OPTICAL SUBSTRATE, LIGHT-EMITTING SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR
EP3058586A4 (en) Integrated circuit package substrate
EP2835836A4 (en) OPTICAL SUBSTRATE, SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT
SG2013088984A (en) Thermocompression bonding method and apparatus for the mounting of semiconductor chips on a substrate
EP2682985A4 (en) SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
EP2581937A4 (en) SEMICONDUCTOR DEVICE SEALED WITH THE RESIN AND METHOD OF MANUFACTURING THE SAME
SG11201406941TA (en) Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package
EP2822029A4 (en) SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND CONNECTING CABLE
EP2677538A4 (en) WAFER-LEVEL ENCLOSURE, SIZE-SIZE ENCAPSULATION DEVICE, AND WAFER-SIZE ENCLOSURE MANUFACTURING METHOD
EP2688115A4 (en) OPTICAL SEMICONDUCTOR HOUSING, OPTICAL SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF
SG11201505630WA (en) Substrate for semiconductor packaging and method of forming same
EP2584621A4 (en) PCB FOR AN OPTICAL SEMICONDUCTOR COMPONENT, METHOD FOR PRODUCING THE PCB FOR AN OPTICAL SEMICONDUCTOR COMPONENT AND OPTICAL SEMICONDUCTOR COMPONENT
EP2858109A4 (en) SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
EP2738798A4 (en) HOUSING FOR RECEIVING A SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE HAVING THE SAME, AND ELECTRONIC DEVICE
EP2881979A4 (en) METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR RETURN CHIP MOUNTING
EP2631940A4 (en) Semiconductor chip package, semiconductor module, and method for manufacturing same
SG11201507246VA (en) Flip chip bonder and flip chip bonding method
HK1180110A1 (zh) 包括集成波導的半導體封裝件
HK1204158A1 (en) Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
EP2688100A4 (en) SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME