HK1203726A1 - 彩色圖像採樣和重建 - Google Patents

彩色圖像採樣和重建

Info

Publication number
HK1203726A1
HK1203726A1 HK15104008.5A HK15104008A HK1203726A1 HK 1203726 A1 HK1203726 A1 HK 1203726A1 HK 15104008 A HK15104008 A HK 15104008A HK 1203726 A1 HK1203726 A1 HK 1203726A1
Authority
HK
Hong Kong
Prior art keywords
reconstruction
color image
image sampling
sampling
color
Prior art date
Application number
HK15104008.5A
Other languages
English (en)
Inventor
Hiok Nam Tay
Original Assignee
Hiok Nam Tay
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hiok Nam Tay filed Critical Hiok Nam Tay
Publication of HK1203726A1 publication Critical patent/HK1203726A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
    • G06T3/4015—Image demosaicing, e.g. colour filter arrays [CFA] or Bayer patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14645—Colour imagers
    • H01L27/14647—Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
    • H04N23/843—Demosaicing, e.g. interpolating colour pixel values
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2209/00—Details of colour television systems
    • H04N2209/04—Picture signal generators
    • H04N2209/041—Picture signal generators using solid-state devices
    • H04N2209/042—Picture signal generators using solid-state devices having a single pick-up sensor
    • H04N2209/047—Picture signal generators using solid-state devices having a single pick-up sensor using multispectral pick-up elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
HK15104008.5A 2010-09-26 2015-04-24 彩色圖像採樣和重建 HK1203726A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US38653310P 2010-09-26 2010-09-26
US39206910P 2010-10-12 2010-10-12
US13/244,336 US8866945B2 (en) 2010-09-26 2011-09-24 Color image sampling and reconstruction
GB1304979.6A GB2503308B (en) 2010-09-26 2011-09-25 Color image sampling and reconstruction

Publications (1)

Publication Number Publication Date
HK1203726A1 true HK1203726A1 (zh) 2015-10-30

Family

ID=45870298

Family Applications (2)

Application Number Title Priority Date Filing Date
HK14104765.9A HK1191779A1 (zh) 2010-09-26 2014-05-21 彩色圖像採樣和重建
HK15104008.5A HK1203726A1 (zh) 2010-09-26 2015-04-24 彩色圖像採樣和重建

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK14104765.9A HK1191779A1 (zh) 2010-09-26 2014-05-21 彩色圖像採樣和重建

Country Status (10)

Country Link
US (2) US8866945B2 (zh)
JP (1) JP5971530B2 (zh)
CN (1) CN103119721B (zh)
AU (1) AU2011306393A1 (zh)
BR (1) BR112013007032A2 (zh)
DE (1) DE112011103229T5 (zh)
GB (2) GB2503308B (zh)
HK (2) HK1191779A1 (zh)
SG (1) SG188640A1 (zh)
WO (1) WO2012038939A2 (zh)

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US8866945B2 (en) 2010-09-26 2014-10-21 Hiok Nam Tay Color image sampling and reconstruction
US9631964B2 (en) 2011-03-11 2017-04-25 Intelligent Agricultural Solutions, Llc Acoustic material flow sensor
US10318138B2 (en) 2011-03-11 2019-06-11 Intelligent Agricultural Solutions Llc Harvesting machine capable of automatic adjustment
US9629308B2 (en) 2011-03-11 2017-04-25 Intelligent Agricultural Solutions, Llc Harvesting machine capable of automatic adjustment
US10321624B2 (en) 2011-03-11 2019-06-18 Intelligent Agriculture Solutions LLC Air seeder manifold system
US20130300902A1 (en) * 2012-03-29 2013-11-14 Hiok Nam Tay Color image sensor pixel array
CN103067708B (zh) * 2012-12-25 2015-06-17 太原理工大学 基于w-z结构的贝尔模板数字图像编解码方法
TWI617198B (zh) * 2013-03-15 2018-03-01 開曼群島商普廷數碼影像控股公司 具有透明濾波器像素之成像系統
CN105531823B (zh) * 2013-08-03 2018-06-12 拉莫特艾特特拉维夫大学有限公司 利用单色数字摄影机的彩色成像
US9337223B2 (en) * 2013-11-25 2016-05-10 Semiconductor Components Industriess, Llc Imaging systems with image pixels having adjustable responsivity
CN104934491B (zh) * 2014-03-19 2017-06-06 中芯国际集成电路制造(上海)有限公司 光电二极管、其制作方法及图像传感器件
US10085379B2 (en) 2014-09-12 2018-10-02 Appareo Systems, Llc Grain quality sensor
EP3485717A1 (en) * 2014-09-12 2019-05-22 Intelligent Agricultural Solutions, LLC Acoustic material flow sensor
CN104241311B (zh) * 2014-10-14 2017-02-15 中国电子科技集团公司第四十四研究所 可用于多种工作模式的cmos图像传感器
CN107431953B (zh) * 2015-03-10 2020-12-15 华为技术有限公司 业务流分流的方法和装置
US9793306B2 (en) * 2015-04-08 2017-10-17 Semiconductor Components Industries, Llc Imaging systems with stacked photodiodes and chroma-luma de-noising
US10321496B2 (en) * 2015-06-03 2019-06-11 Parallel Wireless, Inc. Inter-PGW handover architecture
WO2017090366A1 (ja) 2015-11-25 2017-06-01 オリンパス株式会社 内視鏡システムおよび撮影方法
US10690495B2 (en) * 2016-03-14 2020-06-23 Canon Kabushiki Kaisha Ranging apparatus and moving object capable of high-accuracy ranging
US11393867B2 (en) 2017-12-06 2022-07-19 Facebook Technologies, Llc Multi-photodiode pixel cell
US11233085B2 (en) 2018-05-09 2022-01-25 Facebook Technologies, Llc Multi-photo pixel cell having vertical gate structure
US11463636B2 (en) 2018-06-27 2022-10-04 Facebook Technologies, Llc Pixel sensor having multiple photodiodes
US10931884B2 (en) 2018-08-20 2021-02-23 Facebook Technologies, Llc Pixel sensor having adaptive exposure time
US11956413B2 (en) 2018-08-27 2024-04-09 Meta Platforms Technologies, Llc Pixel sensor having multiple photodiodes and shared comparator
US11595602B2 (en) 2018-11-05 2023-02-28 Meta Platforms Technologies, Llc Image sensor post processing
CN109598686B (zh) * 2018-11-28 2020-07-10 珠海欧比特宇航科技股份有限公司 一种基于bayer模板的卫星影像重建方法
US11218660B1 (en) 2019-03-26 2022-01-04 Facebook Technologies, Llc Pixel sensor having shared readout structure
US11910114B2 (en) 2020-07-17 2024-02-20 Meta Platforms Technologies, Llc Multi-mode image sensor
CN112490258B (zh) * 2020-12-25 2022-09-16 联合微电子中心有限责任公司 彩色cmos图像传感器像素阵列、传感器以及制备工艺

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Also Published As

Publication number Publication date
US9136299B2 (en) 2015-09-15
JP5971530B2 (ja) 2016-08-17
WO2012038939A2 (en) 2012-03-29
HK1191779A1 (zh) 2014-08-01
US20120075511A1 (en) 2012-03-29
GB2503308B (en) 2015-03-11
CN103119721A (zh) 2013-05-22
US20150035107A1 (en) 2015-02-05
WO2012038939A3 (en) 2012-06-14
GB2518561A (en) 2015-03-25
GB201304979D0 (en) 2013-05-01
AU2011306393A1 (en) 2013-04-11
SG188640A1 (en) 2013-04-30
BR112013007032A2 (pt) 2019-09-24
GB2503308A (en) 2013-12-25
DE112011103229T5 (de) 2013-07-04
JP2013539294A (ja) 2013-10-17
CN103119721B (zh) 2015-12-16
US8866945B2 (en) 2014-10-21
GB2518561B (en) 2015-04-29

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190923