BR112013007032A2 - matriz de pixels de sensor de imagem, método para formar uma imagem de cor a partir de uma imagem em mosaico, processador de câmara, meio de armazenamento não volátil de dados de computador e aparelho de captura de imagem. - Google Patents

matriz de pixels de sensor de imagem, método para formar uma imagem de cor a partir de uma imagem em mosaico, processador de câmara, meio de armazenamento não volátil de dados de computador e aparelho de captura de imagem.

Info

Publication number
BR112013007032A2
BR112013007032A2 BR112013007032A BR112013007032A BR112013007032A2 BR 112013007032 A2 BR112013007032 A2 BR 112013007032A2 BR 112013007032 A BR112013007032 A BR 112013007032A BR 112013007032 A BR112013007032 A BR 112013007032A BR 112013007032 A2 BR112013007032 A2 BR 112013007032A2
Authority
BR
Brazil
Prior art keywords
image
storage medium
data storage
forming
computer data
Prior art date
Application number
BR112013007032A
Other languages
English (en)
Inventor
Nam Tay Hiok
Original Assignee
Nam Tay Hiok
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nam Tay Hiok filed Critical Nam Tay Hiok
Publication of BR112013007032A2 publication Critical patent/BR112013007032A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
    • G06T3/4015—Image demosaicing, e.g. colour filter arrays [CFA] or Bayer patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14645—Colour imagers
    • H01L27/14647—Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
    • H04N23/843—Demosaicing, e.g. interpolating colour pixel values
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/17—Colour separation based on photon absorption depth, e.g. full colour resolution obtained simultaneously at each pixel location
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2209/00—Details of colour television systems
    • H04N2209/04—Picture signal generators
    • H04N2209/041—Picture signal generators using solid-state devices
    • H04N2209/042—Picture signal generators using solid-state devices having a single pick-up sensor
    • H04N2209/047—Picture signal generators using solid-state devices having a single pick-up sensor using multispectral pick-up elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
BR112013007032A 2010-09-26 2011-09-25 matriz de pixels de sensor de imagem, método para formar uma imagem de cor a partir de uma imagem em mosaico, processador de câmara, meio de armazenamento não volátil de dados de computador e aparelho de captura de imagem. BR112013007032A2 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US38653310P 2010-09-26 2010-09-26
US39206910P 2010-10-12 2010-10-12
US13/244,336 US8866945B2 (en) 2010-09-26 2011-09-24 Color image sampling and reconstruction
PCT/IB2011/054213 WO2012038939A2 (en) 2010-09-26 2011-09-25 Color image sampling and reconstruction

Publications (1)

Publication Number Publication Date
BR112013007032A2 true BR112013007032A2 (pt) 2019-09-24

Family

ID=45870298

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013007032A BR112013007032A2 (pt) 2010-09-26 2011-09-25 matriz de pixels de sensor de imagem, método para formar uma imagem de cor a partir de uma imagem em mosaico, processador de câmara, meio de armazenamento não volátil de dados de computador e aparelho de captura de imagem.

Country Status (10)

Country Link
US (2) US8866945B2 (pt)
JP (1) JP5971530B2 (pt)
CN (1) CN103119721B (pt)
AU (1) AU2011306393A1 (pt)
BR (1) BR112013007032A2 (pt)
DE (1) DE112011103229T5 (pt)
GB (2) GB2518561B (pt)
HK (2) HK1191779A1 (pt)
SG (1) SG188640A1 (pt)
WO (1) WO2012038939A2 (pt)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8866945B2 (en) 2010-09-26 2014-10-21 Hiok Nam Tay Color image sampling and reconstruction
US9629308B2 (en) 2011-03-11 2017-04-25 Intelligent Agricultural Solutions, Llc Harvesting machine capable of automatic adjustment
US10321624B2 (en) 2011-03-11 2019-06-18 Intelligent Agriculture Solutions LLC Air seeder manifold system
US10318138B2 (en) 2011-03-11 2019-06-11 Intelligent Agricultural Solutions Llc Harvesting machine capable of automatic adjustment
US9631964B2 (en) 2011-03-11 2017-04-25 Intelligent Agricultural Solutions, Llc Acoustic material flow sensor
US20130300902A1 (en) * 2012-03-29 2013-11-14 Hiok Nam Tay Color image sensor pixel array
CN103067708B (zh) * 2012-12-25 2015-06-17 太原理工大学 基于w-z结构的贝尔模板数字图像编解码方法
TWI617198B (zh) * 2013-03-15 2018-03-01 開曼群島商普廷數碼影像控股公司 具有透明濾波器像素之成像系統
US9894336B2 (en) * 2013-08-03 2018-02-13 Ramot At Tel-Aviv University Ltd Color imaging using a monochromatic digital camera
US9337223B2 (en) * 2013-11-25 2016-05-10 Semiconductor Components Industriess, Llc Imaging systems with image pixels having adjustable responsivity
CN104934491B (zh) * 2014-03-19 2017-06-06 中芯国际集成电路制造(上海)有限公司 光电二极管、其制作方法及图像传感器件
US9756785B2 (en) 2014-09-12 2017-09-12 Appareo Systems, Llc Grain quality sensor
US10085379B2 (en) 2014-09-12 2018-10-02 Appareo Systems, Llc Grain quality sensor
CN104241311B (zh) * 2014-10-14 2017-02-15 中国电子科技集团公司第四十四研究所 可用于多种工作模式的cmos图像传感器
JP2018512788A (ja) * 2015-03-10 2018-05-17 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． トラフィックフロー分割方法およびトラフィックフロー分割装置
US9793306B2 (en) * 2015-04-08 2017-10-17 Semiconductor Components Industries, Llc Imaging systems with stacked photodiodes and chroma-luma de-noising
US10321496B2 (en) * 2015-06-03 2019-06-11 Parallel Wireless, Inc. Inter-PGW handover architecture
CN108289599B (zh) 2015-11-25 2020-08-11 奥林巴斯株式会社 内窥镜系统和拍摄方法
US10690495B2 (en) * 2016-03-14 2020-06-23 Canon Kabushiki Kaisha Ranging apparatus and moving object capable of high-accuracy ranging
US11393867B2 (en) * 2017-12-06 2022-07-19 Facebook Technologies, Llc Multi-photodiode pixel cell
US11233085B2 (en) 2018-05-09 2022-01-25 Facebook Technologies, Llc Multi-photo pixel cell having vertical gate structure
US11463636B2 (en) 2018-06-27 2022-10-04 Facebook Technologies, Llc Pixel sensor having multiple photodiodes
US10931884B2 (en) 2018-08-20 2021-02-23 Facebook Technologies, Llc Pixel sensor having adaptive exposure time
US11956413B2 (en) 2018-08-27 2024-04-09 Meta Platforms Technologies, Llc Pixel sensor having multiple photodiodes and shared comparator
US11595602B2 (en) 2018-11-05 2023-02-28 Meta Platforms Technologies, Llc Image sensor post processing
CN109598686B (zh) * 2018-11-28 2020-07-10 珠海欧比特宇航科技股份有限公司 一种基于bayer模板的卫星影像重建方法
US11218660B1 (en) 2019-03-26 2022-01-04 Facebook Technologies, Llc Pixel sensor having shared readout structure
US11910114B2 (en) 2020-07-17 2024-02-20 Meta Platforms Technologies, Llc Multi-mode image sensor
CN112490258B (zh) * 2020-12-25 2022-09-16 联合微电子中心有限责任公司 彩色cmos图像传感器像素阵列、传感器以及制备工艺

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115085A (en) * 1980-02-15 1981-09-10 Canon Inc Color solid state pickup device
US4437112A (en) * 1980-02-15 1984-03-13 Canon Kabushiki Kaisha Solid-state color imaging apparatus
US6482669B1 (en) * 2001-05-30 2002-11-19 Taiwan Semiconductor Manufacturing Company Colors only process to reduce package yield loss
JP4641675B2 (ja) 2001-07-18 2011-03-02 三洋電機株式会社 画像信号処理装置
US6534759B1 (en) 2001-09-10 2003-03-18 National Semiconductor Corporation Vertical photodetector with improved photocarrier separation and low capacitance
US7233350B2 (en) 2002-01-05 2007-06-19 Candela Microsystems, Inc. Image sensor with interleaved image output
JP4154165B2 (ja) * 2002-04-05 2008-09-24 キヤノン株式会社 光電変換素子及びそれを用いた固体撮像装置、カメラ及び画像読み取り装置
US7283164B2 (en) * 2002-09-18 2007-10-16 Micron Technology, Inc. Method for detecting and correcting defective pixels in a digital image sensor
JP4404561B2 (ja) * 2003-03-17 2010-01-27 富士フイルム株式会社 Ｍｏｓ型カラー固体撮像装置
US7554587B2 (en) * 2003-03-11 2009-06-30 Fujifilm Corporation Color solid-state image pickup device
US7929798B2 (en) * 2005-12-07 2011-04-19 Micron Technology, Inc. Method and apparatus providing noise reduction while preserving edges for imagers
US7419844B2 (en) * 2006-03-17 2008-09-02 Sharp Laboratories Of America, Inc. Real-time CMOS imager having stacked photodiodes fabricated on SOI wafer
JP2008072098A (ja) * 2006-08-17 2008-03-27 Sony Corp 半導体イメージセンサ
CN101459184B (zh) 2007-12-13 2011-03-23 中芯国际集成电路制造(上海)有限公司 在cmos上感测图像的系统和方法
US20090160981A1 (en) 2007-12-20 2009-06-25 Micron Technology, Inc. Apparatus including green and magenta pixels and method thereof
US8106426B2 (en) 2008-02-04 2012-01-31 Sharp Laboratories Of America, Inc. Full color CMOS imager filter
JP5320989B2 (ja) * 2008-11-07 2013-10-23 ソニー株式会社 固体撮像装置、及び電子機器
US8274587B2 (en) * 2010-04-13 2012-09-25 Aptina Imaging Corporation Image sensor pixels with vertical charge transfer
US8866945B2 (en) 2010-09-26 2014-10-21 Hiok Nam Tay Color image sampling and reconstruction

Also Published As

Publication number Publication date
HK1203726A1 (en) 2015-10-30
WO2012038939A3 (en) 2012-06-14
HK1191779A1 (en) 2014-08-01
US9136299B2 (en) 2015-09-15
GB201304979D0 (en) 2013-05-01
DE112011103229T5 (de) 2013-07-04
WO2012038939A2 (en) 2012-03-29
GB2503308B (en) 2015-03-11
US20120075511A1 (en) 2012-03-29
US8866945B2 (en) 2014-10-21
AU2011306393A1 (en) 2013-04-11
CN103119721B (zh) 2015-12-16
JP2013539294A (ja) 2013-10-17
CN103119721A (zh) 2013-05-22
US20150035107A1 (en) 2015-02-05
GB2503308A (en) 2013-12-25
SG188640A1 (en) 2013-04-30
GB2518561B (en) 2015-04-29
JP5971530B2 (ja) 2016-08-17
GB2518561A (en) 2015-03-25

Similar Documents

Publication Publication Date Title
BR112013007032A2 (pt) matriz de pixels de sensor de imagem, método para formar uma imagem de cor a partir de uma imagem em mosaico, processador de câmara, meio de armazenamento não volátil de dados de computador e aparelho de captura de imagem.
BRPI0918172A2 (pt) método para extrair características de dados de imagem, sistema e método para analisar uma cena capturada por câmera de vídeo
WO2014070927A3 (en) Expanded-field-of-view image and video capture
EP2320460A4 (en) PIXEL, PIXEL FORMING METHOD, IMAGE PRODUCTION DEVICE, AND IMAGE FORMING METHOD
BRPI0911687A2 (pt) aparelhos e método de gravação de informação, aparelhos de captura de imagem, e, programa
BRPI0920719A2 (pt) aparelho de processamento de imagem, método de processamento de cor, e, meio de armazenamento legível por computador.
WO2010122894A3 (en) Imaging apparatus and imaging system, method thereof and program for the same
HK1141652A1 (en) Image capture device and method
BRPI0910207A2 (pt) dispositivo de geração de imagens, sistema de geração de imagens, método de geração de imagens, programa de computador para gerar uma imagem a partir de dados medidos e programa de computador para a formação de imagens
WO2008066699A3 (en) Processing images having color and panchromatic pixels
BRPI1003628A2 (pt) dispositivo e método de processamento de imagem digital, e, meio de armazenamento legível por computador codificado
BRPI1008574A2 (pt) método de processar imagens de vídeo, aparelho de processamento de imagem de vídeo, e meio de gravação legível por computador
BRPI0920930A2 (pt) circuito de pixel, dispositivo de captura de imagem, e, sistema de câmera.
EP2571261A4 (en) METHOD AND DEVICE FOR CALIBRATING MULTI-CAMERA IMAGES
EP2461287A4 (en) IMAGE PROCESSING DEVICE AND METHOD, DATA PROCESSING DEVICE AND METHOD, PROGRAM, AND RECORDING MEDIUM
EP2461288A4 (en) Image processing apparatus and method, data processing apparatus and method, program and recording medium
WO2009063256A3 (en) Re-sizing image sequences
WO2009100058A3 (en) Object detection and recognition system
BRPI0820949A2 (pt) Método para extração das características de baixa intensidade de um conjunto de dados de imagens, produtos de programa de computador, sistema para a exibição das características de baixa intensidade de um conjunto de dados de imagem
BRPI0905360A2 (pt) Aparelho e método de processamento de imagem, programa, e, aparelo de captura de imagem
EP2271499A4 (en) IMAGE PROCESSING, COMPUTER PROGRAM, RECORDING MEDIUM, IMAGE PROCESSING DEVICE AND IMAGE GENERATING DEVICE
EP2321957A4 (en) IMAGE PROCESSING DEVICE, PICTURE PROCESSING, PROGRAM, RECORDING MEDIUM, PRINTING SYSTEM AND PICTURE GENERATING DEVICE
BR112012016067A2 (pt) "método de exibição de imagem, aparelho de exibição de imagem, e meio de gravação por computador".
EP2161939A4 (en) IMAGE PROCESSING APPARATUS AND METHOD FOR PIXEL DATA IMPLEMENTATION
EP2741496A4 (en) VIDEO DATA GENERATION DEVICE, VIDEO DATA DISPLAYING DEVICE, VIDEO DATA GENERATION PROCESS, VIDEO DATA DISPLAYING AND VIDEO IMAGE FILING DATA STRUCTURE

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.