HK1200799A1 - Method of fabricating a single-piece micromechanical component including at least two distinct functional levels - Google Patents

Method of fabricating a single-piece micromechanical component including at least two distinct functional levels

Info

Publication number
HK1200799A1
HK1200799A1 HK15101179.4A HK15101179A HK1200799A1 HK 1200799 A1 HK1200799 A1 HK 1200799A1 HK 15101179 A HK15101179 A HK 15101179A HK 1200799 A1 HK1200799 A1 HK 1200799A1
Authority
HK
Hong Kong
Prior art keywords
fabricating
component including
micromechanical component
distinct functional
functional levels
Prior art date
Application number
HK15101179.4A
Other languages
English (en)
Chinese (zh)
Inventor
Alexandre Fussinger
Marc Stranczl
Original Assignee
Nivarox Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nivarox Sa filed Critical Nivarox Sa
Publication of HK1200799A1 publication Critical patent/HK1200799A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/008—Manufacture of substrate-free structures separating the processed structure from a mother substrate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B15/00—Escapements
    • G04B15/14—Component parts or constructional details, e.g. construction of the lever or the escape wheel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/035—Microgears
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
HK15101179.4A 2013-02-13 2015-02-04 Method of fabricating a single-piece micromechanical component including at least two distinct functional levels HK1200799A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20130155068 EP2767869A1 (fr) 2013-02-13 2013-02-13 Procédé de fabrication d'une pièce de micromécanique monobloc comportant au moins deux niveaux distincts

Publications (1)

Publication Number Publication Date
HK1200799A1 true HK1200799A1 (en) 2015-08-14

Family

ID=47877759

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15101179.4A HK1200799A1 (en) 2013-02-13 2015-02-04 Method of fabricating a single-piece micromechanical component including at least two distinct functional levels

Country Status (6)

Country Link
US (1) US9197183B2 (xx)
EP (2) EP2767869A1 (xx)
JP (1) JP5899252B2 (xx)
CN (1) CN103979483B (xx)
HK (1) HK1200799A1 (xx)
IN (1) IN2014CH00562A (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107003641B (zh) * 2014-12-12 2021-02-19 西铁城时计株式会社 钟表部件以及钟表部件的制造方法
EP3035125B1 (fr) * 2014-12-19 2018-01-10 Rolex Sa Procédé de fabrication d'un composant horloger multi-niveaux
EP3168057A1 (fr) * 2015-11-11 2017-05-17 Nivarox-FAR S.A. Procede de fabrication d'une piece metallique avec au moins un motif a illusion d'optique
EP3171230B1 (fr) * 2015-11-19 2019-02-27 Nivarox-FAR S.A. Composant d'horlogerie a tribologie amelioree
EP3171229A1 (fr) * 2015-11-19 2017-05-24 Nivarox-FAR S.A. Composant d' horlogerie
EP3602197B1 (fr) * 2017-03-24 2022-11-09 Richemont International SA Procédé de fabrication d'un composant horloger en métal-céramique
EP3453787B1 (fr) 2017-09-11 2020-02-19 Patek Philippe SA Genève Procede de fabrication d'un lot de pieces de micromecanique multi-niveau en metal
EP3614205A1 (fr) * 2018-08-22 2020-02-26 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger et composant obtenu selon ce procede
EP3912048B1 (en) 2019-01-15 2023-07-19 Heldeis, Christoph Method for implicit addressing of electronic units and corresponding units
JP2024527133A (ja) * 2021-08-02 2024-07-19 ロレックス・ソシエテ・アノニム 時計部品の製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6458263B1 (en) * 2000-09-29 2002-10-01 Sandia National Laboratories Cantilevered multilevel LIGA devices and methods
WO2005044364A1 (en) * 2003-11-10 2005-05-19 Agency For Science, Technology And Research Microneedles and microneedle fabrication
DE602004020982D1 (de) * 2004-07-02 2009-06-18 Nivarox Sa tion
JP4840756B2 (ja) * 2005-01-14 2011-12-21 セイコーインスツル株式会社 電鋳型とその製造方法及び電鋳部品の製造方法
JP4834426B2 (ja) * 2006-03-06 2011-12-14 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP2007240416A (ja) * 2006-03-10 2007-09-20 Citizen Holdings Co Ltd 足付指標及びその製造方法とその足付指標を用いた表示板
EP1835339B1 (fr) 2006-03-15 2012-05-16 Rolex S.A. Procédé de fabrication par technologie de type liga d'une structure métallique monocouche ou multicouche, et structure obtenue
CN100441388C (zh) * 2006-04-06 2008-12-10 上海交通大学 基于多层加工技术的微针制备方法
EP2157476A1 (fr) * 2008-08-20 2010-02-24 Nivarox-FAR S.A. Procédé de fabrication de pièces métalliques multi-niveaux par la technique LIGA-UV
CH699416A2 (fr) * 2008-08-20 2010-02-26 Nivarox Sa Procédé de fabrication de pièces métalliques multi-niveaux par la technique LIGA-UV
EP2182096A1 (fr) * 2008-10-28 2010-05-05 Nivarox-FAR S.A. Procédé LIGA hétérogène
EP2230206B1 (fr) * 2009-03-13 2013-07-17 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
EP2230207A1 (fr) * 2009-03-13 2010-09-22 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
EP2263971A1 (fr) * 2009-06-09 2010-12-22 Nivarox-FAR S.A. Pièce de micromécanique composite et son procédé de fabrication
EP2263972A1 (fr) * 2009-06-12 2010-12-22 Nivarox-FAR S.A. Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé
JP5366318B2 (ja) * 2009-09-14 2013-12-11 セイコーインスツル株式会社 デテント脱進機およびデテント脱進機の作動レバーの製造方法
JP5620083B2 (ja) * 2009-10-22 2014-11-05 セイコーインスツル株式会社 電鋳体、その製造方法、及び時計部品
EP2400351B1 (fr) 2010-06-22 2013-09-25 Omega SA Mobile monobloc pour une pièce d'horlogerie
US8562206B2 (en) 2010-07-12 2013-10-22 Rolex S.A. Hairspring for timepiece hairspring-balance oscillator, and method of manufacture thereof
JP2012198041A (ja) * 2011-03-18 2012-10-18 Seiko Instruments Inc 時計用車のスリップ構造及びこれを用いた時計

Also Published As

Publication number Publication date
CN103979483B (zh) 2017-01-18
EP2767870B1 (fr) 2019-06-05
EP2767870A2 (fr) 2014-08-20
JP5899252B2 (ja) 2016-04-06
CN103979483A (zh) 2014-08-13
US9197183B2 (en) 2015-11-24
EP2767870A3 (fr) 2015-07-08
JP2014152400A (ja) 2014-08-25
EP2767869A1 (fr) 2014-08-20
IN2014CH00562A (xx) 2015-04-10
US20140226449A1 (en) 2014-08-14

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