HK1173557A1 - 使用配置為處理和傳輸組件板的多種組件板處理器的系統及方法 - Google Patents
使用配置為處理和傳輸組件板的多種組件板處理器的系統及方法Info
- Publication number
- HK1173557A1 HK1173557A1 HK13100547.3A HK13100547A HK1173557A1 HK 1173557 A1 HK1173557 A1 HK 1173557A1 HK 13100547 A HK13100547 A HK 13100547A HK 1173557 A1 HK1173557 A1 HK 1173557A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- handle
- panes
- component
- handlers configured
- transfer component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/80—Technologies aiming to reduce greenhouse gasses emissions common to all road transportation technologies
- Y02T10/88—Optimized components or subsystems, e.g. lighting, actively controlled glasses
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG2011034253A SG185839A1 (en) | 2011-05-12 | 2011-05-12 | System and method for handling and aligning component panes such as film frames and wafers |
SG2011034220A SG185838A1 (en) | 2011-05-12 | 2011-05-12 | A component pane handler configured to handle component panes of multiple sizes |
SG2011034188A SG185837A1 (en) | 2011-05-12 | 2011-05-12 | A system and method using multiple component pane handlers configured to handle and transfer component panes |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1173557A1 true HK1173557A1 (zh) | 2013-05-16 |
Family
ID=46317156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13100547.3A HK1173557A1 (zh) | 2011-05-12 | 2013-01-11 | 使用配置為處理和傳輸組件板的多種組件板處理器的系統及方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US8834091B2 (zh) |
EP (1) | EP2523213B1 (zh) |
KR (1) | KR101937949B1 (zh) |
CN (1) | CN102779775B (zh) |
HK (1) | HK1173557A1 (zh) |
IL (1) | IL218981A (zh) |
MY (1) | MY166192A (zh) |
PT (1) | PT2523213T (zh) |
TW (1) | TWI550759B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104183528B (zh) * | 2013-05-28 | 2017-07-25 | 北京中电科电子装备有限公司 | 具有位置对准功能的工件传输装置 |
CN113865178B (zh) * | 2015-03-30 | 2023-06-30 | 布鲁克斯自动化公司 | 低温冷冻机 |
US9640418B2 (en) * | 2015-05-15 | 2017-05-02 | Suss Microtec Lithography Gmbh | Apparatus, system, and method for handling aligned wafer pairs |
JP6710050B2 (ja) * | 2016-01-19 | 2020-06-17 | 株式会社ディスコ | 搬送装置 |
WO2019185132A1 (en) * | 2018-03-28 | 2019-10-03 | Transitions Optical, Ltd. | Article transport vehicle |
TWI724856B (zh) * | 2020-04-07 | 2021-04-11 | 陽程科技股份有限公司 | 紗管置料裝置及其方法 |
CN115303796A (zh) * | 2022-08-17 | 2022-11-08 | 深圳市鹏乐智能系统有限公司 | 一种提篮中晶圆承载铁原片的取放料机构 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2733674B2 (ja) * | 1988-12-29 | 1998-03-30 | 株式会社ディスコ | ウエーハ塔載フレームのプリアライメント方法 |
JPH07176590A (ja) * | 1993-12-13 | 1995-07-14 | Tokyo Electron Ltd | 処理装置 |
WO1999028220A1 (fr) * | 1997-12-03 | 1999-06-10 | Nikon Corporation | Dispositif et procede de transfert de substrats |
DE10259836A1 (de) * | 2002-12-19 | 2004-07-15 | Siemens Ag | Greifer und Betriebsverfahren |
JP4401217B2 (ja) * | 2003-06-13 | 2010-01-20 | 大日本スクリーン製造株式会社 | 基板処理装置 |
WO2007023501A2 (en) * | 2005-08-26 | 2007-03-01 | Camtek Ltd. | Wafer inspection system and a method for translating wafers |
JP2007210774A (ja) * | 2006-02-10 | 2007-08-23 | Tokyo Seimitsu Co Ltd | ワーク搬送装置 |
JP2007210079A (ja) * | 2006-02-10 | 2007-08-23 | Tokyo Seimitsu Co Ltd | ワーク搬送装置及びワーク搬送方法 |
KR100818044B1 (ko) * | 2006-05-04 | 2008-03-31 | 위순임 | 기판 지지대와 기판 반송 장치 및 이를 이용한 기판 처리시스템 |
US8419341B2 (en) * | 2006-09-19 | 2013-04-16 | Brooks Automation, Inc. | Linear vacuum robot with Z motion and articulated arm |
JP4956328B2 (ja) * | 2007-08-24 | 2012-06-20 | 東京エレクトロン株式会社 | 搬送アームの移動位置の調整方法及び位置検出用治具 |
TWI550705B (zh) * | 2008-06-04 | 2016-09-21 | 荏原製作所股份有限公司 | 硏磨裝置及硏磨方法 |
KR101004434B1 (ko) * | 2008-11-26 | 2010-12-28 | 세메스 주식회사 | 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법 |
-
2012
- 2012-04-02 IL IL218981A patent/IL218981A/en active IP Right Grant
- 2012-04-25 MY MYPI2012700222A patent/MY166192A/en unknown
- 2012-05-14 CN CN201210151546.8A patent/CN102779775B/zh active Active
- 2012-05-14 PT PT121679104T patent/PT2523213T/pt unknown
- 2012-05-14 US US13/470,369 patent/US8834091B2/en active Active
- 2012-05-14 EP EP12167910.4A patent/EP2523213B1/en active Active
- 2012-05-14 TW TW101117165A patent/TWI550759B/zh active
- 2012-05-14 KR KR1020120051182A patent/KR101937949B1/ko active IP Right Grant
-
2013
- 2013-01-11 HK HK13100547.3A patent/HK1173557A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN102779775A (zh) | 2012-11-14 |
US8834091B2 (en) | 2014-09-16 |
PT2523213T (pt) | 2020-02-19 |
TWI550759B (zh) | 2016-09-21 |
MY166192A (en) | 2018-06-07 |
EP2523213B1 (en) | 2019-12-18 |
CN102779775B (zh) | 2015-08-26 |
US20120288352A1 (en) | 2012-11-15 |
KR20120127343A (ko) | 2012-11-21 |
EP2523213A2 (en) | 2012-11-14 |
KR101937949B1 (ko) | 2019-01-11 |
EP2523213A3 (en) | 2017-04-19 |
IL218981A (en) | 2015-10-29 |
IL218981A0 (en) | 2012-06-28 |
TW201250912A (en) | 2012-12-16 |
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