HK1170780A1 - 製造金屬微觀結構的方法以及根據該方法獲得的微觀結構 - Google Patents

製造金屬微觀結構的方法以及根據該方法獲得的微觀結構

Info

Publication number
HK1170780A1
HK1170780A1 HK12111481.9A HK12111481A HK1170780A1 HK 1170780 A1 HK1170780 A1 HK 1170780A1 HK 12111481 A HK12111481 A HK 12111481A HK 1170780 A1 HK1170780 A1 HK 1170780A1
Authority
HK
Hong Kong
Prior art keywords
microstructure
manufacturing
obtained according
metal
metal microstructure
Prior art date
Application number
HK12111481.9A
Other languages
English (en)
Inventor
Alexandre Fussinger
Original Assignee
Nivarox Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nivarox Sa filed Critical Nivarox Sa
Publication of HK1170780A1 publication Critical patent/HK1170780A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/032—LIGA process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
HK12111481.9A 2009-06-12 2012-11-13 製造金屬微觀結構的方法以及根據該方法獲得的微觀結構 HK1170780A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09162638A EP2263972A1 (fr) 2009-06-12 2009-06-12 Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé
PCT/EP2010/057255 WO2010142529A1 (fr) 2009-06-12 2010-05-26 Procede de fabrication d'une microstructure metallique et microstructure obtenue selon ce procede

Publications (1)

Publication Number Publication Date
HK1170780A1 true HK1170780A1 (zh) 2013-03-08

Family

ID=41328705

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12111481.9A HK1170780A1 (zh) 2009-06-12 2012-11-13 製造金屬微觀結構的方法以及根據該方法獲得的微觀結構

Country Status (7)

Country Link
US (1) US9194052B2 (zh)
EP (2) EP2263972A1 (zh)
JP (1) JP5678043B2 (zh)
CN (1) CN102459713B (zh)
HK (1) HK1170780A1 (zh)
RU (1) RU2528522C2 (zh)
WO (1) WO2010142529A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014003843A1 (en) * 2012-06-29 2014-01-03 Regents Of The University Of Minnesota Method of forming individual metallic microstructures
EP2767869A1 (fr) * 2013-02-13 2014-08-20 Nivarox-FAR S.A. Procédé de fabrication d'une pièce de micromécanique monobloc comportant au moins deux niveaux distincts
US10370769B2 (en) * 2014-12-12 2019-08-06 Citizen Watch Co., Ltd. Method of manufacturing electroformed components
EP3220208A1 (fr) * 2016-03-14 2017-09-20 Nivarox-FAR S.A. Composant d'affichage d'horlogerie economique
EP3454122B1 (fr) * 2017-09-11 2020-02-19 Patek Philippe SA Genève Procede de fabrication par technologie liga d'une microstructure metallique comportant au moins deux niveaux
EP3467151B1 (fr) * 2017-10-06 2020-06-17 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
CH714739A2 (fr) * 2018-03-09 2019-09-13 Swatch Group Res & Dev Ltd Procédé de fabrication d’un décor métallique sur un cadran et cadran obtenu selon ce procédé.
EP3670441A1 (fr) * 2018-12-21 2020-06-24 Rolex Sa Procédé de fabrication d'un composant horloger
EP3789825B1 (fr) * 2019-09-05 2022-04-06 Mimotec S.A. Procédé pour fabriquer une pluralité de micropièces
EP3839624B1 (fr) * 2019-12-18 2023-09-13 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger
EP3839625A1 (fr) * 2019-12-18 2021-06-23 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger et composant obtenu selon ce procede

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4058401A (en) 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US4462873A (en) * 1982-07-16 1984-07-31 Eiji Watanabe Method of fixedly arranging an array of electroformed letters or the like on an article
US4869760A (en) * 1987-01-28 1989-09-26 Kayoh Technical Industry Co., Ltd. Method for production of metallic sticker
RU2050423C1 (ru) * 1989-05-23 1995-12-20 Геннадий Ильич Шпаков Гальванопластический способ изготовления деталей, преимущественно матриц пресс-форм
JPH05326395A (ja) * 1992-05-21 1993-12-10 Toshiba Corp 半導体装置の製造方法
US5378583A (en) * 1992-12-22 1995-01-03 Wisconsin Alumni Research Foundation Formation of microstructures using a preformed photoresist sheet
JPH09279365A (ja) * 1996-04-11 1997-10-28 Mitsubishi Materials Corp 微細構造部品を製造する方法
JPH09279366A (ja) * 1996-04-16 1997-10-28 Mitsubishi Materials Corp 微細構造部品の製造方法
US5989994A (en) * 1998-12-29 1999-11-23 Advantest Corp. Method for producing contact structures
JP4249827B2 (ja) * 1998-12-04 2009-04-08 株式会社ディスコ 半導体ウェーハの製造方法
US6841339B2 (en) * 2000-08-09 2005-01-11 Sandia National Laboratories Silicon micro-mold and method for fabrication
SE523309E (sv) * 2001-06-15 2009-10-26 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
JP2005153054A (ja) * 2003-11-25 2005-06-16 Sumitomo Electric Ind Ltd 微細金属部材の製造方法
JP2007070703A (ja) * 2005-09-08 2007-03-22 Ricoh Co Ltd 乳化用金属膜の形成方法
JP2007204809A (ja) * 2006-02-01 2007-08-16 Sumitomo Electric Ind Ltd ３次元微細構造体の製造方法
DE06405114T1 (de) * 2006-03-15 2008-04-24 Doniar S.A. LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur
EP1835050A1 (fr) * 2006-03-15 2007-09-19 Doniar S.A. Procédé de fabrication par LIGA-UV d'une structure métallique multicouche à couches adjacentes non entièrement superposées, et structure obtenue
RU2308552C1 (ru) * 2006-06-21 2007-10-20 "Общество с ограниченной ответственностью "НаноИмпринт" Способ изготовления нано-пресс-форм для контактной пресс-литографии (варианты)
JP2008126375A (ja) * 2006-11-22 2008-06-05 Sumitomo Electric Ind Ltd ３次元微細構造体の製造方法
JP2009127105A (ja) * 2007-11-27 2009-06-11 Seiko Instruments Inc 電鋳部品の製造方法

Also Published As

Publication number Publication date
EP2440690A1 (fr) 2012-04-18
CN102459713B (zh) 2014-11-19
US20120042510A1 (en) 2012-02-23
JP5678043B2 (ja) 2015-02-25
RU2012100707A (ru) 2013-07-20
RU2528522C2 (ru) 2014-09-20
WO2010142529A1 (fr) 2010-12-16
EP2440690B1 (fr) 2014-07-16
EP2263972A1 (fr) 2010-12-22
JP2012529377A (ja) 2012-11-22
CN102459713A (zh) 2012-05-16
US9194052B2 (en) 2015-11-24

Similar Documents

Publication Publication Date Title
HK1170780A1 (zh) 製造金屬微觀結構的方法以及根據該方法獲得的微觀結構
PL2398606T3 (pl) Sposób wytwarzania części metalowej hartowanej podczas tłoczenia
PL2236313T3 (pl) Sposób wytwarzania paneli i panel wytworzony tym sposobem
PL2631307T3 (pl) Blacha stalowa cienka i sposób wytwarzania blachy stalowej cienkiej
EP2461923A4 (en) METHOD FOR FORMING A MOLDED ARTICLE
EP2426237A4 (en) MOLDING AND MANUFACTURING METHOD THEREFOR
EP2426780A4 (en) COOLING DISTRIBUTOR AND METHOD FOR THE PRODUCTION THEREOF
IL216312A0 (en) Method for orthopoxvirus production and purification
PL2578711T3 (pl) Blacha stalowa i sposób jej wytwarzania
HRP20181637T1 (hr) Postrojenje za proizvodnju čelika
EP2376248A4 (en) METHOD FOR PRODUCING A METAL PART
PL2495345T3 (pl) Blacha cienka z metalu żelaznego i sposób jej wytwarzania
GB0903280D0 (en) Method of manufacturing a blade
PT2443053E (pt) Segmento de curva e método para fabrico de um segmento de curva
IL214202A0 (en) A method for producing metal powders
GB201016540D0 (en) Shaped pants-style articles and method for production
PL2479315T3 (pl) Blacha cienka ze stali elektrotechnicznej i sposób jej wytwarzania
EP2450182A4 (en) METALLIC LAMINATE STRUCTURE AND PROCESS FOR PRODUCING METALLIC LAMINATE STRUCTURE
GB0912259D0 (en) A method and assembly for forming a component by isostatic pressing
ZA201107474B (en) Method of manufacturing a metal vessel
EP2519655A4 (en) COLORED METALLIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME
GB0921896D0 (en) A method of manufacturing a component
EP2455170A4 (en) PROCESS FOR PRODUCING CAST METALLIC PRODUCTS AND MANUFACTURING PLANT
GB0903281D0 (en) Method of manufacturing a blade
PL2340901T3 (pl) Sposób wytwarzania odlewu