HK1160545A1 - Composite material containing carbon fiber - Google Patents

Composite material containing carbon fiber

Info

Publication number
HK1160545A1
HK1160545A1 HK12100825.7A HK12100825A HK1160545A1 HK 1160545 A1 HK1160545 A1 HK 1160545A1 HK 12100825 A HK12100825 A HK 12100825A HK 1160545 A1 HK1160545 A1 HK 1160545A1
Authority
HK
Hong Kong
Prior art keywords
composite material
carbon fiber
material containing
containing carbon
fiber
Prior art date
Application number
HK12100825.7A
Other languages
Chinese (zh)
Inventor
單佳義
鈴木淳
佐藤洋
川島昭二
Original Assignee
保土谷化學工業株式會社
阿基里斯株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 保土谷化學工業株式會社, 阿基里斯株式會社 filed Critical 保土谷化學工業株式會社
Publication of HK1160545A1 publication Critical patent/HK1160545A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
HK12100825.7A 2008-09-30 2012-01-29 Composite material containing carbon fiber HK1160545A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008252860 2008-09-30
PCT/JP2009/067045 WO2010038784A1 (en) 2008-09-30 2009-09-30 Composite material containing carbon fiber

Publications (1)

Publication Number Publication Date
HK1160545A1 true HK1160545A1 (en) 2012-08-17

Family

ID=42073543

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12100825.7A HK1160545A1 (en) 2008-09-30 2012-01-29 Composite material containing carbon fiber

Country Status (5)

Country Link
JP (1) JP5634870B2 (en)
CN (1) CN102227782B (en)
HK (1) HK1160545A1 (en)
TW (1) TW201027565A (en)
WO (1) WO2010038784A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103608404B (en) * 2011-06-17 2016-03-09 出光兴产株式会社 Polycarbonate resin composition and molded article using same
JP2013091783A (en) * 2011-10-06 2013-05-16 Showa Denko Kk Electroconductive resin composition, and electroconductive coating and electroconductive adhesive using the same
WO2013146262A1 (en) 2012-03-29 2013-10-03 東海ゴム工業株式会社 Conductive composition and conducting film
JP2014028900A (en) * 2012-07-31 2014-02-13 Showa Denko Kk Conductive resin composition, and conductive coating material and conductive adhesive using the same
EP3045497B1 (en) 2013-09-10 2020-03-25 Riken Technos Corporation Electrically conductive resin composition, and film produced from same
CN103551200B (en) * 2013-11-20 2015-06-03 河南城建学院 Porous graphite carbon composite material as well as preparation method and application thereof
JP2015189074A (en) * 2014-03-28 2015-11-02 横浜ゴム株式会社 Mold release agent for tire inner surface and method for producing pneumatic tire using the same
JP6453026B2 (en) 2014-10-09 2019-01-16 リケンテクノス株式会社 Method for producing thermoplastic resin composition film
JP7176947B2 (en) * 2018-01-19 2022-11-22 出光興産株式会社 Composition, electromagnetic wave shielding sheet and manufacturing method thereof, electromagnetic wave shielding material and manufacturing method thereof, electromagnetic wave radar and vehicle control device
JPWO2021251361A1 (en) * 2020-06-10 2021-12-16
CN116514113B (en) * 2023-05-06 2024-03-15 昆明理工大学 Carbon nano tube-graphene composite material with latticed shell structure and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0532819A (en) * 1990-11-06 1993-02-09 Osaka Gas Co Ltd Conductive composition
JP2772613B2 (en) * 1992-12-16 1998-07-02 龍 仁 李 Conductive adhesive tape
JP4883361B2 (en) * 2000-06-05 2012-02-22 昭和電工株式会社 Conductive curable resin composition, cured product thereof, and molded product thereof
US7026388B2 (en) * 2001-03-28 2006-04-11 Ube Industries, Ltd. Conductive resin composition and process for producing the same
US8999200B2 (en) * 2002-07-23 2015-04-07 Sabic Global Technologies B.V. Conductive thermoplastic composites and methods of making
JP2005200620A (en) * 2003-12-15 2005-07-28 Bridgestone Corp Thermoplastic resin composition and thermoplastic resin molded product
JP2007122927A (en) * 2005-10-25 2007-05-17 Bussan Nanotech Research Institute Inc Conductive sheet
JP2007092074A (en) * 2006-11-13 2007-04-12 Osaka Gas Co Ltd Electroconductive polymer

Also Published As

Publication number Publication date
JP5634870B2 (en) 2014-12-03
CN102227782B (en) 2014-03-12
WO2010038784A1 (en) 2010-04-08
TW201027565A (en) 2010-07-16
CN102227782A (en) 2011-10-26
JPWO2010038784A1 (en) 2012-03-01

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