HK1142992A1 - Method for manufacturing gas supply structure in electrostatic chuck apparatus, gas supply structure in electrostatic chuck apparatus, and electrostatic chuck apparatus - Google Patents
Method for manufacturing gas supply structure in electrostatic chuck apparatus, gas supply structure in electrostatic chuck apparatus, and electrostatic chuck apparatusInfo
- Publication number
- HK1142992A1 HK1142992A1 HK10108654A HK10108654A HK1142992A1 HK 1142992 A1 HK1142992 A1 HK 1142992A1 HK 10108654 A HK10108654 A HK 10108654A HK 10108654 A HK10108654 A HK 10108654A HK 1142992 A1 HK1142992 A1 HK 1142992A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electrostatic chuck
- chuck apparatus
- gas supply
- supply structure
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007262714 | 2007-09-06 | ||
PCT/JP2008/065836 WO2009031566A1 (ja) | 2007-09-06 | 2008-09-03 | 静電チャック装置におけるガス供給構造の製造方法及び静電チャック装置ガス供給構造並びに静電チャック装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1142992A1 true HK1142992A1 (en) | 2010-12-17 |
Family
ID=40428880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK10108654A HK1142992A1 (en) | 2007-09-06 | 2010-09-13 | Method for manufacturing gas supply structure in electrostatic chuck apparatus, gas supply structure in electrostatic chuck apparatus, and electrostatic chuck apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US8051548B2 (ja) |
JP (1) | JP5186504B2 (ja) |
KR (1) | KR101384585B1 (ja) |
CN (1) | CN101796626B (ja) |
HK (1) | HK1142992A1 (ja) |
TW (1) | TWI389246B (ja) |
WO (1) | WO2009031566A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9558980B2 (en) * | 2008-04-30 | 2017-01-31 | Axcelis Technologies, Inc. | Vapor compression refrigeration chuck for ion implanters |
KR101134736B1 (ko) * | 2010-04-26 | 2012-04-13 | 가부시키가이샤 크리에이티브 테크놀러지 | 스페이서를 구비하는 정전 척 및 그 제조방법 |
CA2704683A1 (en) * | 2010-05-28 | 2010-08-12 | Ibm Canada Limited - Ibm Canada Limitee | Grounded lid for micro-electronic assemblies |
CN103222043B (zh) * | 2010-09-08 | 2016-10-12 | 恩特格林斯公司 | 一种高传导静电夹盘 |
US10276410B2 (en) * | 2011-11-25 | 2019-04-30 | Nhk Spring Co., Ltd. | Substrate support device |
US8980767B2 (en) * | 2012-01-13 | 2015-03-17 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
CN103915309B (zh) * | 2013-01-05 | 2016-04-13 | 中微半导体设备(上海)有限公司 | 等离子体处理腔室及其静电夹盘以及基片温度控制方法 |
US9314854B2 (en) | 2013-01-30 | 2016-04-19 | Lam Research Corporation | Ductile mode drilling methods for brittle components of plasma processing apparatuses |
US8893702B2 (en) | 2013-02-20 | 2014-11-25 | Lam Research Corporation | Ductile mode machining methods for hard and brittle components of plasma processing apparatuses |
US11664262B2 (en) * | 2018-04-05 | 2023-05-30 | Lam Research Corporation | Electrostatic chucks with coolant gas zones and corresponding groove and monopolar electrostatic clamping electrode patterns |
KR102516885B1 (ko) | 2018-05-10 | 2023-03-30 | 삼성전자주식회사 | 증착 장비 및 이를 이용한 반도체 장치 제조 방법 |
CN110861113A (zh) * | 2018-08-28 | 2020-03-06 | 吸力奇迹(北京)科技有限公司 | 静电吸附装置及其制备方法 |
KR102188779B1 (ko) * | 2018-10-15 | 2020-12-08 | 세메스 주식회사 | 기판 지지 장치 및 그 제조방법 |
JP7153574B2 (ja) * | 2019-01-17 | 2022-10-14 | 東京エレクトロン株式会社 | 上部電極構造、プラズマ処理装置、及び上部電極構造を組み立てる方法 |
US20210197236A1 (en) * | 2019-12-25 | 2021-07-01 | Temple Technology Ltd. | Air curtain apparatus and an airflow accelerator for an air curtain apparatus |
CN111128844A (zh) * | 2019-12-31 | 2020-05-08 | 苏州芯慧联半导体科技有限公司 | 一种高冷却性能的静电卡盘 |
US11594401B2 (en) * | 2020-02-25 | 2023-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure |
KR102527183B1 (ko) * | 2021-03-29 | 2023-04-28 | 주식회사 톱텍 | 밀착력이 향상된 정전척 |
KR102485430B1 (ko) * | 2021-09-07 | 2023-01-06 | 주식회사 동탄이엔지 | 코팅 취약부 개선을 위한 정전척 및 정전척의 제조 방법 |
WO2023172434A1 (en) * | 2022-03-08 | 2023-09-14 | Lam Research Corporation | Encapsulated compression washer for bonding ceramic plate and metal baseplate of electrostatic chucks |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155652A (en) * | 1991-05-02 | 1992-10-13 | International Business Machines Corporation | Temperature cycling ceramic electrostatic chuck |
US5350479A (en) * | 1992-12-02 | 1994-09-27 | Applied Materials, Inc. | Electrostatic chuck for high power plasma processing |
US5644467A (en) * | 1995-09-28 | 1997-07-01 | Applied Materials, Inc. | Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck |
JP4095842B2 (ja) | 2002-06-26 | 2008-06-04 | 日本特殊陶業株式会社 | 静電チャック |
JP2004349664A (ja) * | 2003-05-23 | 2004-12-09 | Creative Technology:Kk | 静電チャック |
JP4942364B2 (ja) * | 2005-02-24 | 2012-05-30 | 京セラ株式会社 | 静電チャックおよびウェハ保持部材並びにウェハ処理方法 |
-
2008
- 2008-09-03 CN CN2008801059611A patent/CN101796626B/zh active Active
- 2008-09-03 US US12/676,834 patent/US8051548B2/en active Active
- 2008-09-03 KR KR1020107007261A patent/KR101384585B1/ko active IP Right Grant
- 2008-09-03 JP JP2009531252A patent/JP5186504B2/ja active Active
- 2008-09-03 WO PCT/JP2008/065836 patent/WO2009031566A1/ja active Application Filing
- 2008-09-04 TW TW97133910A patent/TWI389246B/zh active
-
2010
- 2010-09-13 HK HK10108654A patent/HK1142992A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI389246B (zh) | 2013-03-11 |
JP5186504B2 (ja) | 2013-04-17 |
US20100254064A1 (en) | 2010-10-07 |
TW200919624A (en) | 2009-05-01 |
CN101796626B (zh) | 2012-02-01 |
KR20100085907A (ko) | 2010-07-29 |
US8051548B2 (en) | 2011-11-08 |
JPWO2009031566A1 (ja) | 2010-12-16 |
CN101796626A (zh) | 2010-08-04 |
KR101384585B1 (ko) | 2014-04-11 |
WO2009031566A1 (ja) | 2009-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150903 |