HK1142682A1 - Integrated circuit probe card analyzer - Google Patents
Integrated circuit probe card analyzerInfo
- Publication number
- HK1142682A1 HK1142682A1 HK10109053.3A HK10109053A HK1142682A1 HK 1142682 A1 HK1142682 A1 HK 1142682A1 HK 10109053 A HK10109053 A HK 10109053A HK 1142682 A1 HK1142682 A1 HK 1142682A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- integrated circuit
- probe card
- circuit probe
- card analyzer
- analyzer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74611706P | 2006-05-01 | 2006-05-01 | |
US88912507P | 2007-02-09 | 2007-02-09 | |
PCT/IB2007/003561 WO2008068567A2 (en) | 2006-05-01 | 2007-05-01 | Integrated circuit probe card analyzer |
US11/743,020 US20070257686A1 (en) | 2006-05-01 | 2007-05-01 | Integrated circuit probe card analyzer |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1142682A1 true HK1142682A1 (en) | 2010-12-10 |
Family
ID=38660639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK10109053.3A HK1142682A1 (en) | 2006-05-01 | 2010-09-22 | Integrated circuit probe card analyzer |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070257686A1 (xx) |
KR (1) | KR101477683B1 (xx) |
CN (1) | CN101680929B (xx) |
HK (1) | HK1142682A1 (xx) |
WO (1) | WO2008068567A2 (xx) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8531202B2 (en) * | 2007-10-11 | 2013-09-10 | Veraconnex, Llc | Probe card test apparatus and method |
WO2013182895A1 (en) * | 2012-06-08 | 2013-12-12 | Oscar Beijert | Probe apparatus |
US20140084956A1 (en) * | 2012-09-21 | 2014-03-27 | Dennis Glenn L. Surell | Probe head test fixture and method of using the same |
WO2015001417A1 (en) * | 2013-07-03 | 2015-01-08 | Stichting Continuïteit Beijert Engineering | Apparatus and method for inspecting pins on a probe card |
US10732202B2 (en) * | 2016-03-29 | 2020-08-04 | Globalfoundries Inc. | Repairable rigid test probe card assembly |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3205043A (en) * | 1962-04-04 | 1965-09-07 | Carborundum Co | Cold molded dense silicon carbide articles and method of making the same |
US4692418A (en) * | 1984-08-29 | 1987-09-08 | Stemcor Corporation | Sintered silicon carbide/carbon composite ceramic body having fine microstructure |
US4757255A (en) * | 1986-03-03 | 1988-07-12 | National Semiconductor Corporation | Environmental box for automated wafer probing |
US4733553A (en) * | 1986-08-25 | 1988-03-29 | Motorola Inc. | Method and apparatus for low pressure testing of a solid state pressure sensor |
US4918383A (en) * | 1987-01-20 | 1990-04-17 | Huff Richard E | Membrane probe with automatic contact scrub action |
US5266889A (en) * | 1992-05-29 | 1993-11-30 | Cascade Microtech, Inc. | Wafer probe station with integrated environment control enclosure |
US5345170A (en) * | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
JP2938679B2 (ja) * | 1992-06-26 | 1999-08-23 | 信越化学工業株式会社 | セラミックス製静電チャック |
JP3485390B2 (ja) * | 1995-07-28 | 2004-01-13 | 京セラ株式会社 | 静電チャック |
US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
JPH11312729A (ja) * | 1998-04-28 | 1999-11-09 | Kyocera Corp | 静電チャック |
WO2002037541A2 (en) * | 2000-11-01 | 2002-05-10 | Applied Materials, Inc. | Etch chamber for etching dielectric layer with expanded process window |
-
2007
- 2007-05-01 CN CN2007800252566A patent/CN101680929B/zh not_active Expired - Fee Related
- 2007-05-01 US US11/743,020 patent/US20070257686A1/en not_active Abandoned
- 2007-05-01 WO PCT/IB2007/003561 patent/WO2008068567A2/en active Application Filing
-
2008
- 2008-12-01 KR KR1020087029354A patent/KR101477683B1/ko not_active IP Right Cessation
-
2010
- 2010-09-22 HK HK10109053.3A patent/HK1142682A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101680929B (zh) | 2012-10-10 |
WO2008068567A3 (en) | 2008-11-20 |
US20070257686A1 (en) | 2007-11-08 |
KR20090033836A (ko) | 2009-04-06 |
KR101477683B1 (ko) | 2014-12-30 |
CN101680929A (zh) | 2010-03-24 |
WO2008068567A2 (en) | 2008-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20180501 |