HK1130276A1 - Sealant composition containing inorganic-organic nanocomposite filler - Google Patents
Sealant composition containing inorganic-organic nanocomposite fillerInfo
- Publication number
- HK1130276A1 HK1130276A1 HK09109218.8A HK09109218A HK1130276A1 HK 1130276 A1 HK1130276 A1 HK 1130276A1 HK 09109218 A HK09109218 A HK 09109218A HK 1130276 A1 HK1130276 A1 HK 1130276A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- composition containing
- containing inorganic
- sealant composition
- organic nanocomposite
- nanocomposite filler
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/12—Materials for stopping leaks, e.g. in radiators, in tanks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/46—Block-or graft-polymers containing polysiloxane sequences containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/008—Additives improving gas barrier properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/336,760 US20070173597A1 (en) | 2006-01-20 | 2006-01-20 | Sealant composition containing inorganic-organic nanocomposite filler |
PCT/US2007/001237 WO2008051261A2 (en) | 2006-01-20 | 2007-01-17 | Sealant composition containing inorganic-organic nanocomposite filler |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1130276A1 true HK1130276A1 (en) | 2009-12-24 |
Family
ID=38286370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09109218.8A HK1130276A1 (en) | 2006-01-20 | 2009-10-06 | Sealant composition containing inorganic-organic nanocomposite filler |
Country Status (13)
Country | Link |
---|---|
US (1) | US20070173597A1 (xx) |
EP (1) | EP1994088B1 (xx) |
JP (1) | JP5306826B2 (xx) |
KR (1) | KR101371398B1 (xx) |
CN (1) | CN101405335B (xx) |
BR (1) | BRPI0706752A2 (xx) |
CA (1) | CA2637151C (xx) |
ES (1) | ES2398730T3 (xx) |
HK (1) | HK1130276A1 (xx) |
PL (1) | PL1994088T3 (xx) |
RU (1) | RU2434036C2 (xx) |
TW (1) | TWI421302B (xx) |
WO (1) | WO2008051261A2 (xx) |
Families Citing this family (38)
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US7687121B2 (en) * | 2006-01-20 | 2010-03-30 | Momentive Performance Materials Inc. | Insulated glass unit with sealant composition having reduced permeability to gas |
US7531613B2 (en) * | 2006-01-20 | 2009-05-12 | Momentive Performance Materials Inc. | Inorganic-organic nanocomposite |
KR20110056514A (ko) * | 2008-08-20 | 2011-05-30 | 헨켈 코포레이션 | 몰드 실러의 제조 방법, 몰드 실러 어셈블리 및 그의 조성물 |
US9200160B2 (en) * | 2010-03-29 | 2015-12-01 | Momentive Performance Materials Inc. | Silylated polyurethane/polyorganosiloxane blend and sealant composition and fumed silica composition containing same |
WO2012040910A1 (zh) * | 2010-09-28 | 2012-04-05 | 北京林业大学 | 木材改性剂、其制备方法和用该改性剂使木材改性的方法 |
CA2849423A1 (en) * | 2011-09-09 | 2013-03-14 | Axxia Pharmaceuticals, Llc | Silicone coated implants |
JP2013173879A (ja) * | 2012-02-27 | 2013-09-05 | Shinshu Univ | シリコーンゴム組成物およびその製造方法ならびにシリコーンゴム |
JP6338065B2 (ja) | 2012-12-20 | 2018-06-06 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 容器用シーリング材組成物 |
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CN105542654A (zh) * | 2015-12-18 | 2016-05-04 | 严飞华 | 一种高效水性纳米硅橡胶密封防水剂 |
US9994669B2 (en) | 2016-01-06 | 2018-06-12 | Fina Technology, Inc. | Polyols derived from farnesene for polyurethanes |
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CN106634882A (zh) * | 2016-09-19 | 2017-05-10 | 武汉华矿胶体化学有限公司 | 油基钻井液用有机累托石的组合物及其制备方法 |
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CN110091399A (zh) * | 2019-05-20 | 2019-08-06 | 王新惠 | 一种防水防腐防变形木质新材料板材 |
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US7371793B2 (en) * | 2004-03-15 | 2008-05-13 | Exxonmobil Chemical Patents Inc. | Nanocomposite comprising stabilization functionalized thermoplastic polyolefins |
US8257805B2 (en) * | 2006-01-09 | 2012-09-04 | Momentive Performance Materials Inc. | Insulated glass unit possessing room temperature-curable siloxane-containing composition of reduced gas permeability |
-
2006
- 2006-01-20 US US11/336,760 patent/US20070173597A1/en not_active Abandoned
-
2007
- 2007-01-17 CN CN2007800102215A patent/CN101405335B/zh not_active Expired - Fee Related
- 2007-01-17 EP EP07866984A patent/EP1994088B1/en not_active Not-in-force
- 2007-01-17 WO PCT/US2007/001237 patent/WO2008051261A2/en active Application Filing
- 2007-01-17 TW TW096101825A patent/TWI421302B/zh not_active IP Right Cessation
- 2007-01-17 KR KR1020087017821A patent/KR101371398B1/ko not_active IP Right Cessation
- 2007-01-17 BR BRPI0706752-6A patent/BRPI0706752A2/pt not_active Application Discontinuation
- 2007-01-17 ES ES07866984T patent/ES2398730T3/es active Active
- 2007-01-17 PL PL07866984T patent/PL1994088T3/pl unknown
- 2007-01-17 JP JP2008551360A patent/JP5306826B2/ja not_active Expired - Fee Related
- 2007-01-17 RU RU2008134119/05A patent/RU2434036C2/ru not_active IP Right Cessation
- 2007-01-17 CA CA2637151A patent/CA2637151C/en not_active Expired - Fee Related
-
2009
- 2009-10-06 HK HK09109218.8A patent/HK1130276A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2008051261A3 (en) | 2008-10-09 |
TWI421302B (zh) | 2014-01-01 |
CA2637151C (en) | 2015-10-20 |
RU2434036C2 (ru) | 2011-11-20 |
JP2009523892A (ja) | 2009-06-25 |
CA2637151A1 (en) | 2008-05-02 |
BRPI0706752A2 (pt) | 2011-04-05 |
CN101405335B (zh) | 2013-09-04 |
KR20080086513A (ko) | 2008-09-25 |
TW200738824A (en) | 2007-10-16 |
CN101405335A (zh) | 2009-04-08 |
EP1994088B1 (en) | 2013-01-09 |
KR101371398B1 (ko) | 2014-03-10 |
ES2398730T3 (es) | 2013-03-21 |
US20070173597A1 (en) | 2007-07-26 |
EP1994088A2 (en) | 2008-11-26 |
RU2008134119A (ru) | 2010-02-27 |
JP5306826B2 (ja) | 2013-10-02 |
PL1994088T3 (pl) | 2013-06-28 |
WO2008051261A2 (en) | 2008-05-02 |
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Legal Events
Date | Code | Title | Description |
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PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20180117 |