HK1118528A1 - Method for manufacturing micromechanical components - Google Patents

Method for manufacturing micromechanical components

Info

Publication number
HK1118528A1
HK1118528A1 HK08109828.1A HK08109828A HK1118528A1 HK 1118528 A1 HK1118528 A1 HK 1118528A1 HK 08109828 A HK08109828 A HK 08109828A HK 1118528 A1 HK1118528 A1 HK 1118528A1
Authority
HK
Hong Kong
Prior art keywords
micromechanical components
manufacturing micromechanical
manufacturing
components
micromechanical
Prior art date
Application number
HK08109828.1A
Other languages
English (en)
Inventor
Jyrki Kiihamaeki
Hannu Kattelus
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Publication of HK1118528A1 publication Critical patent/HK1118528A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00611—Processes for the planarisation of structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0118—Processes for the planarization of structures
    • B81C2201/0125—Blanket removal, e.g. polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
HK08109828.1A 2005-06-03 2008-09-04 Method for manufacturing micromechanical components HK1118528A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20050592A FI121539B (fi) 2005-06-03 2005-06-03 Menetelmä mikromekaanisten komponenttien valmistamiseksi sekä tällaisella menetelmällä valmistettu piimikromekaaninen rakenne ja sen käyttö
PCT/FI2006/000174 WO2006128958A2 (en) 2005-06-03 2006-06-02 Method for manufacturing micromechanical components

Publications (1)

Publication Number Publication Date
HK1118528A1 true HK1118528A1 (en) 2009-02-13

Family

ID=34778315

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08109828.1A HK1118528A1 (en) 2005-06-03 2008-09-04 Method for manufacturing micromechanical components

Country Status (6)

Country Link
US (2) US7882741B2 (fi)
CN (1) CN101351400B (fi)
FI (1) FI121539B (fi)
GB (1) GB2441465B (fi)
HK (1) HK1118528A1 (fi)
WO (1) WO2006128958A2 (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737140B2 (ja) * 2006-10-20 2011-07-27 セイコーエプソン株式会社 Ｍｅｍｓデバイスおよびその製造方法
US8828772B2 (en) * 2012-03-05 2014-09-09 Taiwan Semiconductor Manufacturing Co., Ltd. High aspect ratio MEMS devices and methods for forming the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563343A (en) * 1993-05-26 1996-10-08 Cornell Research Foundation, Inc. Microelectromechanical lateral accelerometer
FR2732467B1 (fr) * 1995-02-10 1999-09-17 Bosch Gmbh Robert Capteur d'acceleration et procede de fabrication d'un tel capteur
DE19537814B4 (de) 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
JP3430771B2 (ja) * 1996-02-05 2003-07-28 株式会社デンソー 半導体力学量センサの製造方法
EP0822415B1 (en) 1996-07-31 2003-03-26 STMicroelectronics S.r.l. Semiconductor integrated capacitive acceleration sensor and relative fabrication method
US5804084A (en) 1996-10-11 1998-09-08 Sandia Corporation Use of chemical mechanical polishing in micromachining
US5939633A (en) 1997-06-18 1999-08-17 Analog Devices, Inc. Apparatus and method for multi-axis capacitive sensing
US6393913B1 (en) 2000-02-08 2002-05-28 Sandia Corporation Microelectromechanical dual-mass resonator structure
JP2002131331A (ja) 2000-10-24 2002-05-09 Denso Corp 半導体力学量センサ
US6877374B2 (en) 2002-02-06 2005-04-12 Analog Devices, Inc. Micromachined gyroscope
US6770506B2 (en) * 2002-12-23 2004-08-03 Motorola, Inc. Release etch method for micromachined sensors
US6845670B1 (en) 2003-07-08 2005-01-25 Freescale Semiconductor, Inc. Single proof mass, 3 axis MEMS transducer

Also Published As

Publication number Publication date
US20110070675A1 (en) 2011-03-24
CN101351400A (zh) 2009-01-21
US7882741B2 (en) 2011-02-08
US20090206423A1 (en) 2009-08-20
GB0724114D0 (en) 2008-01-30
FI20050592A0 (fi) 2005-06-03
WO2006128958A3 (en) 2007-04-05
GB2441465A (en) 2008-03-05
CN101351400B (zh) 2013-04-24
WO2006128958A2 (en) 2006-12-07
US8236694B2 (en) 2012-08-07
GB2441465B (en) 2011-03-09
FI20050592A (fi) 2006-12-04
FI121539B (fi) 2010-12-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170602

ARF Application filed for restoration

Effective date: 20171208

ARG Restoration of standard patent granted

Effective date: 20180319

PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180602