EP1986950A4 - Mems components and method for manufacturing same - Google Patents

Mems components and method for manufacturing same

Info

Publication number
EP1986950A4
EP1986950A4 EP20070709443 EP07709443A EP1986950A4 EP 1986950 A4 EP1986950 A4 EP 1986950A4 EP 20070709443 EP20070709443 EP 20070709443 EP 07709443 A EP07709443 A EP 07709443A EP 1986950 A4 EP1986950 A4 EP 1986950A4
Authority
EP
Grant status
Application
Patent type
Prior art keywords
method
manufacturing same
mems components
mems
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20070709443
Other languages
German (de)
French (fr)
Other versions
EP1986950A1 (en )
Inventor
Frank Niklaus
Göran Stemme
Original Assignee
Frank Niklaus
Göran Stemme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/00714Treatment for improving the physical properties not provided for in groups B81C1/0065 - B81C1/00706
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0278Temperature sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/042Micromirrors, not used as optical switches
EP20070709443 2006-01-31 2007-01-31 Mems components and method for manufacturing same Withdrawn EP1986950A4 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SE0600210 2006-01-31
PCT/SE2007/050050 WO2007089204A1 (en) 2006-01-31 2007-01-31 Mems components and method for manufacturing same

Publications (2)

Publication Number Publication Date
EP1986950A1 true EP1986950A1 (en) 2008-11-05
EP1986950A4 true true EP1986950A4 (en) 2014-06-04

Family

ID=38327687

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20070709443 Withdrawn EP1986950A4 (en) 2006-01-31 2007-01-31 Mems components and method for manufacturing same

Country Status (2)

Country Link
EP (1) EP1986950A4 (en)
WO (1) WO2007089204A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230497A1 (en) * 2008-06-09 2010-09-22 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Diode bolometer and a method for producing a diode bolometer
US8587083B2 (en) 2009-06-17 2013-11-19 Gunnar Malm Microbolometer semiconductor material
DE102013107947A1 (en) * 2013-07-25 2015-02-19 Acquandas GmbH A process for producing a medical device, method for modifying the surface of a medical device, medical device and coating composite comprising a substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5627106A (en) * 1994-05-06 1997-05-06 United Microelectronics Corporation Trench method for three dimensional chip connecting during IC fabrication
US6287940B1 (en) * 1999-08-02 2001-09-11 Honeywell International Inc. Dual wafer attachment process
US7054052B2 (en) * 2003-09-04 2006-05-30 Frank Niklaus Adhesive sacrificial bonding of spatial light modulators

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2007089204A1 *

Also Published As

Publication number Publication date Type
EP1986950A1 (en) 2008-11-05 application
WO2007089204A1 (en) 2007-08-09 application

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Legal Events

Date Code Title Description
17P Request for examination filed

Effective date: 20080828

AK Designated contracting states:

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (to any country) deleted
A4 Despatch of supplementary search report

Effective date: 20140502

RIC1 Classification (correction)

Ipc: B81C 1/00 20060101AFI20140425BHEP

Ipc: H01L 21/98 20060101ALI20140425BHEP

18D Deemed to be withdrawn

Effective date: 20141202