EP1986950A4 - Mems components and method for manufacturing same - Google Patents

Mems components and method for manufacturing same

Info

Publication number
EP1986950A4
EP1986950A4 EP07709443.1A EP07709443A EP1986950A4 EP 1986950 A4 EP1986950 A4 EP 1986950A4 EP 07709443 A EP07709443 A EP 07709443A EP 1986950 A4 EP1986950 A4 EP 1986950A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing same
mems components
mems
components
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07709443.1A
Other languages
German (de)
French (fr)
Other versions
EP1986950A1 (en
Inventor
Frank Niklaus
Göran Stemme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP1986950A1 publication Critical patent/EP1986950A1/en
Publication of EP1986950A4 publication Critical patent/EP1986950A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/00714—Treatment for improving the physical properties not provided for in groups B81C1/0065 - B81C1/00706
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0278—Temperature sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
EP07709443.1A 2006-01-31 2007-01-31 Mems components and method for manufacturing same Withdrawn EP1986950A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0600210 2006-01-31
PCT/SE2007/050050 WO2007089204A1 (en) 2006-01-31 2007-01-31 Mems components and method for manufacturing same

Publications (2)

Publication Number Publication Date
EP1986950A1 EP1986950A1 (en) 2008-11-05
EP1986950A4 true EP1986950A4 (en) 2014-06-04

Family

ID=38327687

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07709443.1A Withdrawn EP1986950A4 (en) 2006-01-31 2007-01-31 Mems components and method for manufacturing same

Country Status (2)

Country Link
EP (1) EP1986950A4 (en)
WO (1) WO2007089204A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230497A1 (en) * 2008-06-09 2010-09-22 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Diode bolometer and a method for producing a diode bolometer
WO2010147532A1 (en) * 2009-06-17 2010-12-23 Gunnar Malm Microbolometer semiconductor material
DE102013107947A1 (en) * 2013-07-25 2015-02-19 Acquandas GmbH A method of manufacturing a medical device, a method of modifying the surface of a medical device, a medical device, and a laminate with a substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5627106A (en) * 1994-05-06 1997-05-06 United Microelectronics Corporation Trench method for three dimensional chip connecting during IC fabrication
US6287940B1 (en) * 1999-08-02 2001-09-11 Honeywell International Inc. Dual wafer attachment process
US7054052B2 (en) * 2003-09-04 2006-05-30 Frank Niklaus Adhesive sacrificial bonding of spatial light modulators

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2007089204A1 *

Also Published As

Publication number Publication date
WO2007089204A1 (en) 2007-08-09
EP1986950A1 (en) 2008-11-05

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20080828

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20140502

RIC1 Information provided on ipc code assigned before grant

Ipc: B81C 1/00 20060101AFI20140425BHEP

Ipc: H01L 21/98 20060101ALI20140425BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20141202