FI20050592A - Menetelmä mikromekaanisten komponenttien valmistamiseksi - Google Patents

Menetelmä mikromekaanisten komponenttien valmistamiseksi Download PDF

Info

Publication number
FI20050592A
FI20050592A FI20050592A FI20050592A FI20050592A FI 20050592 A FI20050592 A FI 20050592A FI 20050592 A FI20050592 A FI 20050592A FI 20050592 A FI20050592 A FI 20050592A FI 20050592 A FI20050592 A FI 20050592A
Authority
FI
Finland
Prior art keywords
micromechanical components
making micromechanical
making
components
micromechanical
Prior art date
Application number
FI20050592A
Other languages
English (en)
Swedish (sv)
Other versions
FI121539B (fi
FI20050592A0 (fi
Inventor
Jyrki Kiihamaeki
Hannu Kattelus
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20050592A priority Critical patent/FI121539B/fi
Publication of FI20050592A0 publication Critical patent/FI20050592A0/fi
Priority to CN2006800194918A priority patent/CN101351400B/zh
Priority to PCT/FI2006/000174 priority patent/WO2006128958A2/en
Priority to GB0724114A priority patent/GB2441465B/en
Priority to US11/920,687 priority patent/US7882741B2/en
Publication of FI20050592A publication Critical patent/FI20050592A/fi
Priority to HK08109828.1A priority patent/HK1118528A1/xx
Priority to US12/884,823 priority patent/US8236694B2/en
Application granted granted Critical
Publication of FI121539B publication Critical patent/FI121539B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00611—Processes for the planarisation of structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0118—Processes for the planarization of structures
    • B81C2201/0125—Blanket removal, e.g. polishing
FI20050592A 2005-06-03 2005-06-03 Menetelmä mikromekaanisten komponenttien valmistamiseksi sekä tällaisella menetelmällä valmistettu piimikromekaaninen rakenne ja sen käyttö FI121539B (fi)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20050592A FI121539B (fi) 2005-06-03 2005-06-03 Menetelmä mikromekaanisten komponenttien valmistamiseksi sekä tällaisella menetelmällä valmistettu piimikromekaaninen rakenne ja sen käyttö
CN2006800194918A CN101351400B (zh) 2005-06-03 2006-06-02 制造微机械部件的方法
PCT/FI2006/000174 WO2006128958A2 (en) 2005-06-03 2006-06-02 Method for manufacturing micromechanical components
GB0724114A GB2441465B (en) 2005-06-03 2006-06-02 Method for manufacturing micromechanical components
US11/920,687 US7882741B2 (en) 2005-06-03 2006-06-02 Method for manufacturing micromechanical components
HK08109828.1A HK1118528A1 (en) 2005-06-03 2008-09-04 Method for manufacturing micromechanical components
US12/884,823 US8236694B2 (en) 2005-06-03 2010-09-17 Method for manufacturing micromechanical components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20050592 2005-06-03
FI20050592A FI121539B (fi) 2005-06-03 2005-06-03 Menetelmä mikromekaanisten komponenttien valmistamiseksi sekä tällaisella menetelmällä valmistettu piimikromekaaninen rakenne ja sen käyttö

Publications (3)

Publication Number Publication Date
FI20050592A0 FI20050592A0 (fi) 2005-06-03
FI20050592A true FI20050592A (fi) 2006-12-04
FI121539B FI121539B (fi) 2010-12-31

Family

ID=34778315

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050592A FI121539B (fi) 2005-06-03 2005-06-03 Menetelmä mikromekaanisten komponenttien valmistamiseksi sekä tällaisella menetelmällä valmistettu piimikromekaaninen rakenne ja sen käyttö

Country Status (6)

Country Link
US (2) US7882741B2 (fi)
CN (1) CN101351400B (fi)
FI (1) FI121539B (fi)
GB (1) GB2441465B (fi)
HK (1) HK1118528A1 (fi)
WO (1) WO2006128958A2 (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737140B2 (ja) * 2006-10-20 2011-07-27 セイコーエプソン株式会社 Ｍｅｍｓデバイスおよびその製造方法
US8828772B2 (en) * 2012-03-05 2014-09-09 Taiwan Semiconductor Manufacturing Co., Ltd. High aspect ratio MEMS devices and methods for forming the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563343A (en) * 1993-05-26 1996-10-08 Cornell Research Foundation, Inc. Microelectromechanical lateral accelerometer
FR2732467B1 (fr) * 1995-02-10 1999-09-17 Bosch Gmbh Robert Capteur d'acceleration et procede de fabrication d'un tel capteur
DE19537814B4 (de) 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
JP3430771B2 (ja) * 1996-02-05 2003-07-28 株式会社デンソー 半導体力学量センサの製造方法
DE69626972T2 (de) 1996-07-31 2004-01-08 Stmicroelectronics S.R.L., Agrate Brianza Integrierter kapazitiver Halbleiter-Beschleunigungsmessaufnehmer sowie Verfahren zu seiner Herstellung
US5804084A (en) 1996-10-11 1998-09-08 Sandia Corporation Use of chemical mechanical polishing in micromachining
US5939633A (en) 1997-06-18 1999-08-17 Analog Devices, Inc. Apparatus and method for multi-axis capacitive sensing
US6393913B1 (en) 2000-02-08 2002-05-28 Sandia Corporation Microelectromechanical dual-mass resonator structure
JP2002131331A (ja) 2000-10-24 2002-05-09 Denso Corp 半導体力学量センサ
EP2325604B1 (en) 2002-02-06 2013-04-24 Analog Devices, Inc. Micromachined gyroscope
US6770506B2 (en) * 2002-12-23 2004-08-03 Motorola, Inc. Release etch method for micromachined sensors
US6845670B1 (en) 2003-07-08 2005-01-25 Freescale Semiconductor, Inc. Single proof mass, 3 axis MEMS transducer

Also Published As

Publication number Publication date
US8236694B2 (en) 2012-08-07
GB0724114D0 (en) 2008-01-30
CN101351400B (zh) 2013-04-24
GB2441465B (en) 2011-03-09
FI121539B (fi) 2010-12-31
WO2006128958A3 (en) 2007-04-05
US20090206423A1 (en) 2009-08-20
FI20050592A0 (fi) 2005-06-03
CN101351400A (zh) 2009-01-21
WO2006128958A2 (en) 2006-12-07
US20110070675A1 (en) 2011-03-24
GB2441465A (en) 2008-03-05
US7882741B2 (en) 2011-02-08
HK1118528A1 (en) 2009-02-13

Similar Documents

Publication Publication Date Title
ATE475473T1 (de) Trennverfahren
DE112006001685A5 (de) Trennverfahren
DK1893586T3 (da) Fremgangsmåde til fremstilling af 1-alkyl-3-phenyluraciler
FI20055581A (fi) Erotusmenetelmä
DK1795576T3 (da) Fremgangsmåde til fremstilling af carbonhydrider
ATE442898T1 (de) Filtrationsverfahren
FI20065089A0 (fi) Menetelmä yhdistelmäsuolen valmistamiseksi
NO20076030L (no) Fremgangsmåte for fremstilling av hydroklorsilaner
DK2029567T3 (da) Fremgangsmåde til frembringelse af benzopyran-2-ol-derivater
DE602006016683D1 (de) Tonerherstellungsverfahren
DE602006012689D1 (de) Überprüfungsverfahren
FI20055619A (fi) Menetelmä selluloosakarbamaattiliuoksen valmistamiseksi
DK1912961T3 (da) Fremgangsmåde til fremstilling af bepromolin
DE602006020309D1 (de) Filtriervorrichtung
DK1937662T3 (da) Fremgangsmåde til fremstilling af duloxetin
FI7459U1 (fi) Lasituote
DK1955066T3 (da) Membran-assay-fremgangsmåde
FI20040191A (fi) Menetelmä kolmiulotteisten optisten komponenttien valmistamiseksi
DE602006004709D1 (de) Beschichtungsverfahren
FI20050208A (fi) Menetelmä uusien tuotteiden valmistamiseksi
FI20050592A (fi) Menetelmä mikromekaanisten komponenttien valmistamiseksi
FI20050418A (fi) Menetelmä sterolien erottamiseksi mäntyöljypiestä
FR2890387B1 (fr) Composant micromecanique
DE102006001637A8 (de) Filtrationszentrifuge
DK1934388T3 (da) Fremgangsmåde til lægemiddeludvikling

Legal Events

Date Code Title Description
MM Patent lapsed