HK1109292A1 - Apparatus and method for levitation of an amount of conductive material - Google Patents

Apparatus and method for levitation of an amount of conductive material

Info

Publication number
HK1109292A1
HK1109292A1 HK07114323.2A HK07114323A HK1109292A1 HK 1109292 A1 HK1109292 A1 HK 1109292A1 HK 07114323 A HK07114323 A HK 07114323A HK 1109292 A1 HK1109292 A1 HK 1109292A1
Authority
HK
Hong Kong
Prior art keywords
coil
levitation
conductive material
amount
coils
Prior art date
Application number
HK07114323.2A
Other languages
English (en)
Inventor
Janis Priede
Chrisptophe Bernard Baptiste C B Laurent
Gerardus Gleijm
Johannes Alphonsus Franciscus Maria Schade Van We
M.
Original Assignee
Tata Steel Nederland Technology Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/923,505 external-priority patent/US7323229B2/en
Application filed by Tata Steel Nederland Technology Bv filed Critical Tata Steel Nederland Technology Bv
Publication of HK1109292A1 publication Critical patent/HK1109292A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/22—Furnaces without an endless core
    • H05B6/32—Arrangements for simultaneous levitation and heating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Induction Heating (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Furnace Details (AREA)
  • Lubricants (AREA)
HK07114323.2A 2004-08-23 2007-12-31 Apparatus and method for levitation of an amount of conductive material HK1109292A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/923,505 US7323229B2 (en) 2002-02-21 2004-08-23 Method and device for coating a substrate
PCT/EP2005/005905 WO2006021245A1 (en) 2004-08-23 2005-05-31 Apparatus and method for levitation of an amount of conductive material

Publications (1)

Publication Number Publication Date
HK1109292A1 true HK1109292A1 (en) 2008-05-30

Family

ID=34971215

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07114323.2A HK1109292A1 (en) 2004-08-23 2007-12-31 Apparatus and method for levitation of an amount of conductive material

Country Status (16)

Country Link
EP (1) EP1785010B1 (ru)
JP (1) JP5064222B2 (ru)
KR (1) KR101143067B1 (ru)
CN (1) CN101006751B (ru)
AT (1) ATE428290T1 (ru)
AU (1) AU2005276729B2 (ru)
BR (1) BRPI0514545A (ru)
CA (1) CA2576541C (ru)
DE (1) DE602005013791D1 (ru)
ES (1) ES2324921T3 (ru)
HK (1) HK1109292A1 (ru)
MX (1) MX2007002191A (ru)
PL (1) PL1785010T3 (ru)
RU (1) RU2370921C2 (ru)
UA (1) UA89792C2 (ru)
WO (1) WO2006021245A1 (ru)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100961371B1 (ko) 2007-12-28 2010-06-07 주식회사 포스코 실러 접착성 및 내식성이 우수한 아연계 합금도금강판과 그제조방법
DE102009042972A1 (de) 2009-09-16 2011-03-24 Technische Universität Ilmenau Vorrichtung und Verfahren zum Manipulieren einer levitierten elektrisch leitfähigen Substanz
KR101639812B1 (ko) * 2009-09-29 2016-07-15 주식회사 포스코 소재의 부양 가열 장치
KR101639813B1 (ko) * 2009-10-08 2016-07-15 주식회사 포스코 연속 코팅 장치
US9267203B2 (en) 2010-12-13 2016-02-23 Posco Continuous coating apparatus
DE102011018675A1 (de) 2011-04-18 2012-10-18 Technische Universität Ilmenau Vorrichtung und Verfahren zum aktiven Manipulieren einer elektrisch leitfähigen Substanz
KR101359218B1 (ko) * 2011-12-27 2014-02-06 주식회사 포스코 부양 가열장치
KR101365467B1 (ko) * 2012-04-24 2014-02-24 한국표준과학연구원 박막 증착 장치
RU2522666C2 (ru) * 2012-06-27 2014-07-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Юго-Западный государственный университет" (ЮЗГУ) Устройство для левитации некоторого количества материала
EP3124648B1 (de) * 2015-07-31 2018-03-28 Hilberg & Partner GmbH Verdampfersystem sowie verdampfungsverfahren für die beschichtung eines bandförmigen substrats
RU2693852C2 (ru) * 2017-11-07 2019-07-05 Федеральное государственное бюджетное образовательное учреждение высшего образования " Юго-Западный государственный университет" (ЮЗГУ) Устройство для левитации некоторого количества материала
PL233811B1 (pl) * 2017-12-11 2019-11-29 Politechnika Slaska Im Wincent Urzadzenie do wieloskalowego topienia lewitacyjnego
DE102018117302A1 (de) * 2018-07-17 2020-01-23 Ald Vacuum Technologies Gmbh Schwebeschmelzverfahren mit einem ringförmigen Element
KR20200076389A (ko) 2018-12-19 2020-06-29 주식회사 포스코 Pvd 도금 공정에서의 도금층 제어 장치 및 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2686864A (en) * 1951-01-17 1954-08-17 Westinghouse Electric Corp Magnetic levitation and heating of conductive materials
US2957064A (en) * 1958-09-30 1960-10-18 Westinghouse Electric Corp Stabilizing of levitation melting
BE655473A (ru) * 1963-11-21 1900-01-01
JPS621863A (ja) * 1985-06-28 1987-01-07 Ishikawajima Harima Heavy Ind Co Ltd 金属蒸発装置
JPH0781181B2 (ja) * 1986-07-10 1995-08-30 石川島播磨重工業株式会社 成膜装置
DE3833255A1 (de) * 1988-09-30 1990-04-05 Deutsche Forsch Luft Raumfahrt Vorrichtung zum behaelterlosen positionieren und schmelzen von elektrisch leitenden materialien
DE3836239A1 (de) * 1988-10-25 1990-04-26 Deutsche Forsch Luft Raumfahrt Vorrichtung zum behaelterlosen positionieren und schmelzen von elektrisch leitenden materialien
JPH0797680A (ja) * 1993-09-30 1995-04-11 Kao Corp 薄膜形成装置
JP3129076B2 (ja) * 1994-03-02 2001-01-29 富士電機株式会社 浮揚溶解装置とその出湯方法
JPH07252639A (ja) * 1994-03-15 1995-10-03 Kao Corp 金属薄膜体の製造方法
JPH08104981A (ja) * 1994-10-05 1996-04-23 Sumitomo Electric Ind Ltd Ｐｖｄ装置
JPH08199345A (ja) * 1995-01-30 1996-08-06 Mitsubishi Electric Corp 成膜装置及び成膜方法
NL1020059C2 (nl) * 2002-02-21 2003-08-25 Corus Technology B V Werkwijze en inrichting voor het bekleden van een substraat.
JP4156885B2 (ja) * 2002-09-11 2008-09-24 株式会社アルバック 薄膜形成装置

Also Published As

Publication number Publication date
EP1785010A1 (en) 2007-05-16
KR101143067B1 (ko) 2012-05-08
WO2006021245A1 (en) 2006-03-02
KR20070067097A (ko) 2007-06-27
CA2576541A1 (en) 2006-03-02
ES2324921T3 (es) 2009-08-19
MX2007002191A (es) 2007-05-08
EP1785010B1 (en) 2009-04-08
CA2576541C (en) 2012-01-10
AU2005276729B2 (en) 2010-08-26
RU2370921C2 (ru) 2009-10-20
BRPI0514545A (pt) 2008-06-17
DE602005013791D1 (de) 2009-05-20
CN101006751A (zh) 2007-07-25
RU2007110642A (ru) 2008-09-27
UA89792C2 (ru) 2010-03-10
JP5064222B2 (ja) 2012-10-31
PL1785010T3 (pl) 2009-08-31
AU2005276729A1 (en) 2006-03-02
JP2008515133A (ja) 2008-05-08
ATE428290T1 (de) 2009-04-15
CN101006751B (zh) 2011-04-27

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150531