HK10985A - Improved soldering composition - Google Patents

Improved soldering composition

Info

Publication number
HK10985A
HK10985A HK109/85A HK10985A HK10985A HK 10985 A HK10985 A HK 10985A HK 109/85 A HK109/85 A HK 109/85A HK 10985 A HK10985 A HK 10985A HK 10985 A HK10985 A HK 10985A
Authority
HK
Hong Kong
Prior art keywords
soldering composition
improved soldering
improved
composition
soldering
Prior art date
Application number
HK109/85A
Other languages
English (en)
Inventor
John Harold Frederick Notton
Original Assignee
Johnson Matthey Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Plc filed Critical Johnson Matthey Plc
Publication of HK10985A publication Critical patent/HK10985A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Nonmetallic Welding Materials (AREA)
HK109/85A 1979-04-06 1985-02-07 Improved soldering composition HK10985A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7912209 1979-04-06

Publications (1)

Publication Number Publication Date
HK10985A true HK10985A (en) 1985-02-15

Family

ID=10504404

Family Applications (1)

Application Number Title Priority Date Filing Date
HK109/85A HK10985A (en) 1979-04-06 1985-02-07 Improved soldering composition

Country Status (19)

Country Link
US (1) US4342606A (da)
JP (1) JPS55153693A (da)
AT (1) AT369686B (da)
AU (1) AU529398B2 (da)
BR (1) BR8002075A (da)
CH (1) CH635259A5 (da)
DE (1) DE3012925A1 (da)
DK (1) DK145780A (da)
ES (1) ES490073A0 (da)
FI (1) FI801018A (da)
FR (1) FR2452996B1 (da)
GB (1) GB2049523B (da)
HK (1) HK10985A (da)
IT (1) IT1130103B (da)
NL (1) NL8001970A (da)
NO (1) NO801001L (da)
NZ (1) NZ193333A (da)
SE (1) SE8002457L (da)
ZA (1) ZA801877B (da)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NZ188341A (en) * 1977-09-16 1980-05-08 Johnson Matthey Co Ltd Brazing composition:brazing alloy and thermoplastic materi
EP0034468A1 (en) * 1980-02-15 1981-08-26 JOHNSON, MATTHEY & Co., LIMITED Improvements in and relating to the joining of tubes
US4496098A (en) * 1982-03-25 1985-01-29 Ichiro Kawakatsu Process for producing a tin/lead alloy solder joint with less wetting agent residue
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
US4505420A (en) * 1983-02-15 1985-03-19 Phillips Petroleum Company Welding spacer
JPS60203386A (ja) * 1984-03-26 1985-10-14 Nippon Genma:Kk クリ−ムはんだおよびその製造法
DE3510000A1 (de) * 1985-03-20 1986-10-02 Ka We electronic GmbH & Co KG, 4796 Salzkotten Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung
US4645545A (en) * 1985-04-09 1987-02-24 Louis Middlestadt Shape retaining bodies of solder containing flux and their method of manufacture and use
DE3777995D1 (de) * 1986-12-22 1992-05-07 Siemens Ag Verfahren zur befestigung von elektronischen bauelementen auf einem substrat, folie zur durchfuehrung des verfahrens und verfahren zur herstellung der folie.
US4771159A (en) * 1987-05-27 1988-09-13 Gte Government Systems Corporation Method of soldering leadless component carriers or the like
US4941929A (en) * 1989-08-24 1990-07-17 E. I. Du Pont De Nemours And Company Solder paste formulation containing stannous fluoride
US5085365B1 (en) * 1990-05-15 1995-08-08 Hughes Aircraft Co Water soluble soldering flux
US5141568A (en) * 1990-05-15 1992-08-25 Hughes Aircraft Company Water-soluble soldering paste
US5452840A (en) * 1990-05-15 1995-09-26 Hughes Aircraft Company Water-soluble soldering flux
US5192360A (en) * 1990-05-15 1993-03-09 Hughes Aircraft Company Water-soluble flux for cored solder
US5190208A (en) * 1990-05-15 1993-03-02 Hughes Aircraft Company Foaming flux for automatic soldering process
US5198038A (en) * 1990-05-15 1993-03-30 Hughes Aircraft Company Foaming flux for automatic soldering process
US5217157A (en) * 1991-09-17 1993-06-08 U.S. Philips Corporation Method of securing a conductor to a ceramic ptc
US5641454A (en) * 1992-03-13 1997-06-24 Toyota Jidosha Kabushiki Kaisha Composite material having anti-wear property and process for producing the same
US5346558A (en) * 1993-06-28 1994-09-13 W. R. Grace & Co.-Conn. Solderable anisotropically conductive composition and method of using same
DE19731151C1 (de) * 1997-07-21 1999-01-21 Degussa Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen
DE19747041A1 (de) * 1997-10-24 1999-04-29 Degussa Flußmittelfreie Hartlotpaste
GB2380964B (en) * 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
EP1490438B1 (en) * 2002-03-28 2009-06-24 Arizona Chemical Company Resinates from monomer fatty acids
WO2004108345A1 (ja) * 2003-06-09 2004-12-16 Senju Metal Industry Co., Ltd. ソルダペースト
US20050077502A1 (en) * 2003-10-09 2005-04-14 Munie Gregory C. Surface reactive preservative for use with solder preforms
US9073153B2 (en) * 2010-02-09 2015-07-07 Nordson Corporation Flux and solder material and method of making same
EP2556916A1 (en) * 2011-08-10 2013-02-13 Nordson Corporation Flux and solder material and method of making same
EP3029105B1 (en) * 2013-07-31 2020-03-25 Minebea Co., Ltd. Thermosetting resin composition, sliding member and method for producing sliding member
DE102019125474A1 (de) * 2019-09-23 2021-03-25 Hans-Jürgen Köhler Verfahren zur Herstellung eines Hochtemperaturlötmittels zum Ofenlöten von Körpern aus Stahl und/oder Edelstahl, Hochtemperaturlötmittel und Verwendung eines Hochtemperaturlötmittels

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1074804A (fr) * 1952-01-22 1954-10-08 Produit pour soudure, étamage et galvanisation
US2833030A (en) * 1952-09-19 1958-05-06 Wall Colmonoy Corp Method of joining metal parts with flexible composite joining material
FR1358800A (fr) * 1963-05-30 1964-04-17 Procédé de fabrication de soudures en poudre comprimée
CH569543A5 (da) * 1972-07-26 1975-11-28 Castolin Sa
DE2246827B2 (de) * 1972-09-23 1974-08-22 Fa. Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Lötpaste
US3915729A (en) * 1974-04-09 1975-10-28 Du Pont High temperature solder pastes
US4151016A (en) * 1976-09-17 1979-04-24 Fusion Incorporated Single component brazing paste
NZ188341A (en) * 1977-09-16 1980-05-08 Johnson Matthey Co Ltd Brazing composition:brazing alloy and thermoplastic materi

Also Published As

Publication number Publication date
NL8001970A (nl) 1980-10-08
AU5702380A (en) 1980-10-09
SE8002457L (sv) 1980-10-07
DE3012925A1 (de) 1980-10-23
FI801018A (fi) 1980-10-07
GB2049523A (en) 1980-12-31
ZA801877B (en) 1981-04-29
AU529398B2 (en) 1983-06-02
ATA187080A (de) 1982-06-15
AT369686B (de) 1983-01-25
IT8067503A0 (it) 1980-04-02
FR2452996A1 (fr) 1980-10-31
ES8104932A1 (es) 1981-05-16
ES490073A0 (es) 1981-05-16
CH635259A5 (fr) 1983-03-31
FR2452996B1 (fr) 1986-08-14
BR8002075A (pt) 1980-11-25
NZ193333A (en) 1982-02-23
NO801001L (no) 1980-10-07
GB2049523B (en) 1984-01-25
IT1130103B (it) 1986-06-11
DK145780A (da) 1980-10-07
US4342606A (en) 1982-08-03
JPS55153693A (en) 1980-11-29

Similar Documents

Publication Publication Date Title
GB2049523B (en) Soldering composition
GB2046283B (en) Soloxane composition
JPS565899A (en) Claning composition
GB2057263B (en) Compositions containing methylsulphonylmethane
DE3066573D1 (en) Air-fireable conductor composition
JPS5634751A (en) Polycarbonateepolyolefin composition
JPS55129447A (en) Composition
JPS5642229A (en) New photooresist composition
JPS5682839A (en) Waterrabsorbable composition
EG15103A (en) Oxytetrocycline compositions
JPS565406A (en) Tickicidal composition
DE3069095D1 (en) Electrode composition
JPS5691075A (en) Size composition
JPS55129229A (en) Indiumm1111oxine complex composition
YU42667B (en) Soldering attachment
JPS5622734A (en) Composition
JPS5649747A (en) Ureaaformaldehyde composition
JPS56135531A (en) Composition
JPS55118957A (en) Flameeproof composition
JPS5652805A (en) Conductive composition
GB2058034B (en) Fluocculant composition
PH16570A (en) Schistosomicidal compositions
ZA803634B (en) Water-settable compositions
GB2062462B (en) Compositions phthalazinol
JPS5655393A (en) Hydrocarbonnsoluble magnesiummaluminum composition