HK108693A - Method for fabricating a field-effect transistor with a self-aligned gate - Google Patents

Method for fabricating a field-effect transistor with a self-aligned gate

Info

Publication number
HK108693A
HK108693A HK1086/93A HK108693A HK108693A HK 108693 A HK108693 A HK 108693A HK 1086/93 A HK1086/93 A HK 1086/93A HK 108693 A HK108693 A HK 108693A HK 108693 A HK108693 A HK 108693A
Authority
HK
Hong Kong
Prior art keywords
fabricating
self
field
effect transistor
aligned gate
Prior art date
Application number
HK1086/93A
Other languages
English (en)
Inventor
John Edward Cunningham
Erdmann F Schubert
Won-Tien Tsang
Original Assignee
American Telephone & Telegraph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone & Telegraph filed Critical American Telephone & Telegraph
Publication of HK108693A publication Critical patent/HK108693A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66848Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • H01L29/66863Lateral single gate transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H01L21/3081Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/142Semiconductor-metal-semiconductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/145Shaped junctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
HK1086/93A 1986-12-19 1993-10-14 Method for fabricating a field-effect transistor with a self-aligned gate HK108693A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/944,457 US4784967A (en) 1986-12-19 1986-12-19 Method for fabricating a field-effect transistor with a self-aligned gate

Publications (1)

Publication Number Publication Date
HK108693A true HK108693A (en) 1993-10-22

Family

ID=25481431

Family Applications (1)

Application Number Title Priority Date Filing Date
HK1086/93A HK108693A (en) 1986-12-19 1993-10-14 Method for fabricating a field-effect transistor with a self-aligned gate

Country Status (8)

Country Link
US (1) US4784967A (xx)
EP (1) EP0274866B1 (xx)
JP (1) JPS63164477A (xx)
CA (1) CA1271850A (xx)
DE (1) DE3778861D1 (xx)
ES (1) ES2030742T3 (xx)
HK (1) HK108693A (xx)
SG (1) SG123492G (xx)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920009718B1 (ko) * 1987-08-10 1992-10-22 스미도모덴기고오교오 가부시기가이샤 화합물반도체장치 및 그 제조방법
US5013685A (en) * 1989-11-02 1991-05-07 At&T Bell Laboratories Method of making a non-alloyed ohmic contact to III-V semiconductors-on-silicon
US6043143A (en) * 1998-05-04 2000-03-28 Motorola, Inc. Ohmic contact and method of manufacture
US6258616B1 (en) * 1998-05-22 2001-07-10 Lucent Technologies Inc. Method of making a semiconductor device having a non-alloyed ohmic contact to a buried doped layer
TW407309B (en) * 1999-01-29 2000-10-01 Nat Science Council MOSFET manufacturing process
US7483212B2 (en) * 2006-10-11 2009-01-27 Rensselaer Polytechnic Institute Optical thin film, semiconductor light emitting device having the same and methods of fabricating the same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL167277C (nl) * 1970-08-29 1981-11-16 Philips Nv Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting.
US3993515A (en) * 1975-03-31 1976-11-23 Rca Corporation Method of forming raised electrical contacts on a semiconductor device
JPS5850428B2 (ja) * 1975-04-16 1983-11-10 株式会社東芝 メサ型半導体装置
US4029542A (en) * 1975-09-19 1977-06-14 Rca Corporation Method for sloping the sidewalls of multilayer P+ PN+ junction mesa structures
JPS52128078A (en) * 1976-04-21 1977-10-27 Mitsubishi Electric Corp Manufacture of field effect transistor
US4029562A (en) * 1976-04-29 1977-06-14 Ibm Corporation Forming feedthrough connections for multi-level interconnections metallurgy systems
JPS5412573A (en) * 1977-06-29 1979-01-30 Matsushita Electric Ind Co Ltd Junction type field effect transistor and production of the same
US4197551A (en) * 1977-09-14 1980-04-08 Raytheon Company Semiconductor device having improved Schottky-barrier junction
GB1602498A (en) * 1978-05-31 1981-11-11 Secr Defence Fet devices and their fabrication
GB1601059A (en) * 1978-05-31 1981-10-21 Secr Defence Fet devices and their fabrication
US4325181A (en) * 1980-12-17 1982-04-20 The United States Of America As Represented By The Secretary Of The Navy Simplified fabrication method for high-performance FET
FR2496982A1 (fr) * 1980-12-24 1982-06-25 Labo Electronique Physique Procede de fabrication de transistors a effet de champ, a grille auto-alignee, et transistors ainsi obtenus
JPS6089979A (ja) * 1983-10-24 1985-05-20 Fujitsu Ltd 半導体装置
FR2558647B1 (fr) * 1984-01-23 1986-05-09 Labo Electronique Physique Transistor a effet de champ de type schottky pour applications hyperfrequences et procede de realisation permettant d'obtenir un tel transistor
GB8413170D0 (en) * 1984-05-23 1984-06-27 British Telecomm Production of semiconductor devices
US4780748A (en) * 1986-06-06 1988-10-25 American Telephone & Telegraph Company, At&T Bell Laboratories Field-effect transistor having a delta-doped ohmic contact

Also Published As

Publication number Publication date
CA1271850A (en) 1990-07-17
JPS63164477A (ja) 1988-07-07
SG123492G (en) 1993-02-19
DE3778861D1 (de) 1992-06-11
EP0274866A1 (en) 1988-07-20
US4784967A (en) 1988-11-15
EP0274866B1 (en) 1992-05-06
ES2030742T3 (es) 1992-11-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)