HK1066094A1 - Magnetron atomisation source and its usage - Google Patents

Magnetron atomisation source and its usage

Info

Publication number
HK1066094A1
HK1066094A1 HK04108796A HK04108796A HK1066094A1 HK 1066094 A1 HK1066094 A1 HK 1066094A1 HK 04108796 A HK04108796 A HK 04108796A HK 04108796 A HK04108796 A HK 04108796A HK 1066094 A1 HK1066094 A1 HK 1066094A1
Authority
HK
Hong Kong
Prior art keywords
magnetron
workpiece
usage
source
target
Prior art date
Application number
HK04108796A
Other languages
English (en)
Inventor
Bernd Heinz
Martin Dubs
Thomas Eisenhammer
Pius Grunenfelder
Walter Haag
Stanislav Kadlec
Siegfried Krassnitzer
Original Assignee
Oc Oerlikon Balzers Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oc Oerlikon Balzers Ag filed Critical Oc Oerlikon Balzers Ag
Publication of HK1066094A1 publication Critical patent/HK1066094A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Generation Of Surge Voltage And Current (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Magnetic Heads (AREA)
  • Thin Magnetic Films (AREA)
HK04108796A 2001-06-12 2004-11-09 Magnetron atomisation source and its usage HK1066094A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH10522001 2001-06-12
PCT/CH2002/000285 WO2002101785A1 (de) 2001-06-12 2002-05-30 Magnetronzerstäubungsquelle

Publications (1)

Publication Number Publication Date
HK1066094A1 true HK1066094A1 (en) 2005-03-11

Family

ID=4554892

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04108796A HK1066094A1 (en) 2001-06-12 2004-11-09 Magnetron atomisation source and its usage

Country Status (10)

Country Link
US (2) US6682637B2 (xx)
EP (1) EP1399945B1 (xx)
JP (1) JP4371805B2 (xx)
CN (1) CN1309002C (xx)
AT (1) ATE293283T1 (xx)
DE (1) DE50202784D1 (xx)
ES (1) ES2237676T3 (xx)
HK (1) HK1066094A1 (xx)
TW (1) TWI229138B (xx)
WO (1) WO2002101785A1 (xx)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004514066A (ja) * 2000-11-27 2004-05-13 ユナキス・トレーディング・アクチェンゲゼルシャフト 厚さがならい削りされた、ｒｆマグネトロン用ターゲット
US7335521B2 (en) * 2004-07-02 2008-02-26 Oc Oerlikon Balzers Ag Method for the production of multilayer discs
US7267748B2 (en) * 2004-10-19 2007-09-11 Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique S.A. Method of making coated article having IR reflecting layer with predetermined target-substrate distance
WO2006070633A1 (ja) * 2004-12-28 2006-07-06 Ulvac, Inc. スパッタ源、スパッタ装置、薄膜の製造方法
US7186319B2 (en) * 2005-01-05 2007-03-06 Applied Materials, Inc. Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
DE102005019100B4 (de) * 2005-04-25 2009-02-12 Steag Hamatech Ag Magnetsystem für eine Zerstäubungskathode
US20060278519A1 (en) * 2005-06-10 2006-12-14 Leszek Malaszewski Adaptable fixation for cylindrical magnetrons
US8424192B1 (en) 2005-08-08 2013-04-23 Western Digital (Fremont), Llc Method for manufacturing a pole for a magnetic recording head
EP2466614A3 (de) * 2006-05-16 2013-05-22 Oerlikon Trading AG, Trübbach Arcquelle und Magnetanordnung
US8142479B2 (en) * 2007-05-01 2012-03-27 Spinal Simplicity Llc Interspinous process implants having deployable engagement arms
US8075593B2 (en) * 2007-05-01 2011-12-13 Spinal Simplicity Llc Interspinous implants and methods for implanting same
JPWO2009090994A1 (ja) * 2008-01-15 2011-05-26 株式会社アルバック 基板ステージ、これを備えたスパッタ装置及び成膜方法
US9757164B2 (en) 2013-01-07 2017-09-12 Spinal Simplicity Llc Interspinous process implant having deployable anchor blades
US8945184B2 (en) * 2009-03-13 2015-02-03 Spinal Simplicity Llc. Interspinous process implant and fusion cage spacer
US9861399B2 (en) 2009-03-13 2018-01-09 Spinal Simplicity, Llc Interspinous process implant having a body with a removable end portion
JP5343835B2 (ja) * 2009-12-10 2013-11-13 日新イオン機器株式会社 反射電極構造体及びイオン源
CN102315064B (zh) * 2010-07-02 2014-07-30 北京北方微电子基地设备工艺研究中心有限责任公司 一种磁控管及应用该磁控管的薄膜沉积处理设备
CN102789938B (zh) * 2011-05-18 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 一种磁控管、磁控管的制造方法及物理沉积室
CN103177916B (zh) * 2011-12-20 2015-09-02 北京北方微电子基地设备工艺研究中心有限责任公司 一种磁控管及磁控溅射设备
US10043670B2 (en) 2015-10-22 2018-08-07 Applied Materials, Inc. Systems and methods for low resistivity physical vapor deposition of a tungsten film
CN107785219B (zh) * 2016-08-30 2019-10-11 北京北方华创微电子装备有限公司 一种磁控元件和磁控溅射装置
JP7471236B2 (ja) * 2018-02-13 2024-04-19 エヴァテック・アーゲー マグネトロンスパッタリングのための方法および装置
CN110106487B (zh) * 2019-05-28 2020-07-14 上海交通大学 一种提高靶材使用率的磁控溅射圆形平面靶枪的磁靶
CN111304620A (zh) * 2020-04-24 2020-06-19 北京北方华创微电子装备有限公司 半导体加工设备及其磁控管机构
CN116426893B (zh) * 2023-06-13 2023-08-18 上海陛通半导体能源科技股份有限公司 磁控溅射设备及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
US5126028A (en) * 1989-04-17 1992-06-30 Materials Research Corporation Sputter coating process control method and apparatus
DE4125110C2 (de) * 1991-07-30 1999-09-09 Leybold Ag Magnetron-Zerstäubungskathode für Vakuumbeschichtungsanlagen
US5262028A (en) * 1992-06-01 1993-11-16 Sierra Applied Sciences, Inc. Planar magnetron sputtering magnet assembly
US5496455A (en) * 1993-09-16 1996-03-05 Applied Material Sputtering using a plasma-shaping magnet ring
DE59400046D1 (de) * 1994-04-07 1995-12-21 Balzers Hochvakuum Magnetronzerstäubungsquelle und deren Verwendung.
CN1067118C (zh) * 1994-07-08 2001-06-13 松下电器产业株式会社 磁控管溅射装置
US6497796B1 (en) * 1999-01-05 2002-12-24 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
US6352629B1 (en) * 2000-07-10 2002-03-05 Applied Materials, Inc. Coaxial electromagnet in a magnetron sputtering reactor

Also Published As

Publication number Publication date
JP4371805B2 (ja) 2009-11-25
US6860977B2 (en) 2005-03-01
EP1399945B1 (de) 2005-04-13
CN1309002C (zh) 2007-04-04
EP1399945A1 (de) 2004-03-24
US6682637B2 (en) 2004-01-27
US20030136671A1 (en) 2003-07-24
US20040149565A1 (en) 2004-08-05
DE50202784D1 (de) 2005-05-19
WO2002101785A1 (de) 2002-12-19
ES2237676T3 (es) 2005-08-01
ATE293283T1 (de) 2005-04-15
TWI229138B (en) 2005-03-11
JP2005505686A (ja) 2005-02-24
CN1516888A (zh) 2004-07-28

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190605