HK1054790A1 - Chemically etched microcontact - Google Patents

Chemically etched microcontact

Info

Publication number
HK1054790A1
HK1054790A1 HK03107024.2A HK03107024A HK1054790A1 HK 1054790 A1 HK1054790 A1 HK 1054790A1 HK 03107024 A HK03107024 A HK 03107024A HK 1054790 A1 HK1054790 A1 HK 1054790A1
Authority
HK
Hong Kong
Prior art keywords
photoresist
probes
metal foil
mask
chemically etched
Prior art date
Application number
HK03107024.2A
Other languages
English (en)
Inventor
Fran Mcquade
Charles L Barto
Original Assignee
Wentworth Lab Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wentworth Lab Inc filed Critical Wentworth Lab Inc
Publication of HK1054790A1 publication Critical patent/HK1054790A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
HK03107024.2A 2001-09-20 2003-09-29 Chemically etched microcontact HK1054790A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32365101P 2001-09-20 2001-09-20
US10/027,146 US6906540B2 (en) 2001-09-20 2001-12-20 Method for chemically etching photo-defined micro electrical contacts

Publications (1)

Publication Number Publication Date
HK1054790A1 true HK1054790A1 (en) 2003-12-12

Family

ID=26702127

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03107024.2A HK1054790A1 (en) 2001-09-20 2003-09-29 Chemically etched microcontact

Country Status (7)

Country Link
US (1) US6906540B2 (fr)
EP (1) EP1300685B1 (fr)
JP (1) JP3696849B2 (fr)
KR (1) KR100690235B1 (fr)
AT (1) ATE510220T1 (fr)
HK (1) HK1054790A1 (fr)
TW (1) TW567553B (fr)

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KR101073829B1 (ko) * 2009-05-14 2011-10-14 주식회사 프로이천 프로브핀 제조방법
JP6106350B2 (ja) 2010-12-09 2017-03-29 ウェントワース ラボラトリーズ、インク． カーボンナノチューブを備えたプローブ・カード・アセンブリおよびプローブピン
TWI525326B (zh) * 2013-06-03 2016-03-11 Probe and probe module using the probe
CN103983933B (zh) * 2014-05-08 2017-09-19 工业和信息化部电子第五研究所 板级射频电流探头频率标定方法及系统和装置
JP7130247B2 (ja) * 2019-05-31 2022-09-05 共進電機株式会社 プローブ及び太陽電池セル用測定装置

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Also Published As

Publication number Publication date
ATE510220T1 (de) 2011-06-15
JP3696849B2 (ja) 2005-09-21
TW567553B (en) 2003-12-21
EP1300685A2 (fr) 2003-04-09
KR20030025827A (ko) 2003-03-29
US6906540B2 (en) 2005-06-14
EP1300685B1 (fr) 2011-05-18
US20030057957A1 (en) 2003-03-27
EP1300685A3 (fr) 2003-05-21
KR100690235B1 (ko) 2007-03-12
JP2003185678A (ja) 2003-07-03

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150919