HK1051340A1 - 研磨表面和产品以及制造方法 - Google Patents

研磨表面和产品以及制造方法 Download PDF

Info

Publication number
HK1051340A1
HK1051340A1 HK03101768.5A HK03101768A HK1051340A1 HK 1051340 A1 HK1051340 A1 HK 1051340A1 HK 03101768 A HK03101768 A HK 03101768A HK 1051340 A1 HK1051340 A1 HK 1051340A1
Authority
HK
Hong Kong
Prior art keywords
particles
mask
carrier
retaining matrix
openings
Prior art date
Application number
HK03101768.5A
Other languages
English (en)
Chinese (zh)
Inventor
N. Tselesin Naum
Original Assignee
Ultimate Abrasive Systems, L.L.C.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultimate Abrasive Systems, L.L.C. filed Critical Ultimate Abrasive Systems, L.L.C.
Publication of HK1051340A1 publication Critical patent/HK1051340A1/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Laminated Bodies (AREA)
HK03101768.5A 1999-12-17 2000-12-18 研磨表面和产品以及制造方法 HK1051340A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17215199P 1999-12-17 1999-12-17
US172151P 1999-12-17
PCT/US2000/034245 WO2001043918A2 (en) 1999-12-17 2000-12-18 Abrasive surface and article and methods for making them

Publications (1)

Publication Number Publication Date
HK1051340A1 true HK1051340A1 (zh) 2003-08-01

Family

ID=22626579

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03101768.5A HK1051340A1 (zh) 1999-12-17 2000-12-18 研磨表面和产品以及制造方法

Country Status (10)

Country Link
EP (1) EP1237679B1 (enExample)
JP (1) JP4426148B2 (enExample)
KR (1) KR100537474B1 (enExample)
CN (1) CN1188253C (enExample)
AU (1) AU2273001A (enExample)
BR (1) BR0016466B1 (enExample)
DE (1) DE60041926D1 (enExample)
HK (1) HK1051340A1 (enExample)
TW (1) TW467809B (enExample)
WO (1) WO2001043918A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754282B1 (ko) * 2006-02-08 2007-09-03 엠.씨.케이 (주) 다공성 연마지 및 그 제조방법
EP2076360A4 (en) * 2006-08-30 2012-12-19 3M Innovative Properties Co ABRASIVE ARTICLE OF EXTENDED LIFETIME AND ITS METHOD
CN101376234B (zh) * 2007-08-28 2013-05-29 侯家祥 一种研磨工具磨料颗粒有序排列的方法
KR101548147B1 (ko) 2009-08-14 2015-08-28 생-고뱅 어브레이시브즈, 인코포레이티드 연신체에 연마입자가 결합된 연마제품
JP6033233B2 (ja) * 2010-12-17 2016-11-30 スリーエム イノベイティブ プロパティズ カンパニー マルチサイズ粒子を有する転写物品及び方法
CN102242336B (zh) * 2011-06-24 2013-02-13 清华大学 一种降低硬质薄膜应力的薄膜制备方法
TW201404527A (zh) 2012-06-29 2014-02-01 聖高拜磨料有限公司 研磨物品及形成方法
TW201402274A (zh) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc 研磨物品及形成方法
FR3014718A1 (fr) * 2013-12-18 2015-06-19 Saint Gobain Diamantwerkzeuge Gmbh & Co Kg Procede de fabrication d'un superabrasif et produit obtenu
TWI664057B (zh) * 2015-06-29 2019-07-01 美商聖高拜磨料有限公司 研磨物品及形成方法
EP3319758B1 (en) * 2015-07-08 2021-01-06 3M Innovative Properties Company Systems and methods for making abrasive articles
JP6900523B2 (ja) * 2015-09-07 2021-07-07 日鉄ケミカル&マテリアル株式会社 研磨布用ドレッサー
KR101698989B1 (ko) * 2016-01-22 2017-01-24 주식회사 썬텍인더스트리 요철을 갖는 연마물품 및 이의 제조방법
CA3117099A1 (en) 2018-11-16 2020-06-18 Magna Imperio Systems Corp. Spacers for ion-exchange device
US11478752B2 (en) 2019-04-09 2022-10-25 Magna Imperio Systems Corp. Electrodialysis systems with decreased concentration gradients at high recovery rates
DE102019205745A1 (de) 2019-04-18 2020-10-22 Ecocoat Gmbh Beschichtetes abrasives Werkzeug und Verfahren zum Herstellen desselben
MX2021015644A (es) 2019-06-25 2022-02-03 Magna Imperio Systems Corp Proceso de electrodialisis y dispositivos de electrodialisis de membrana bipolar de remocion de silice.
DE102019217388A1 (de) * 2019-11-11 2021-05-12 Aktiebolaget Skf Reibungsfolie
CN114248209B (zh) * 2021-12-24 2023-01-03 江苏韦尔博新材料科技有限公司 一种金刚石-焊料复合带及基于其的钎焊金刚石工具的制备工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2876086A (en) * 1954-06-21 1959-03-03 Minnesota Mining & Mfg Abrasive structures and method of making
JP2593829B2 (ja) * 1990-08-17 1997-03-26 鐘紡株式会社 合成砥石
US5380390B1 (en) * 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
JPH0569334A (ja) * 1991-09-12 1993-03-23 Brother Ind Ltd メタルボンド砥石の製造方法
US6537140B1 (en) * 1997-05-14 2003-03-25 Saint-Gobain Abrasives Technology Company Patterned abrasive tools
US5832360A (en) * 1997-08-28 1998-11-03 Norton Company Bond for abrasive tool

Also Published As

Publication number Publication date
DE60041926D1 (de) 2009-05-14
EP1237679A2 (en) 2002-09-11
KR20030028449A (ko) 2003-04-08
AU2273001A (en) 2001-06-25
CN1420810A (zh) 2003-05-28
EP1237679B1 (en) 2009-04-01
JP2003516871A (ja) 2003-05-20
WO2001043918A2 (en) 2001-06-21
JP4426148B2 (ja) 2010-03-03
WO2001043918A9 (en) 2002-05-16
BR0016466B1 (pt) 2009-08-11
KR100537474B1 (ko) 2005-12-19
WO2001043918A3 (en) 2002-03-28
BR0016466A (pt) 2003-04-01
TW467809B (en) 2001-12-11
CN1188253C (zh) 2005-02-09

Similar Documents

Publication Publication Date Title
HK1051340A1 (zh) 研磨表面和产品以及制造方法
AU8686498A (en) Process chamber and method for depositing and/or removing material on a substrate
SG71182A1 (en) Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
AU2237599A (en) Apparatus and method for depositing a material on a substrate
GB2310606B (en) A liquid permeable surface material for an absorbent article, and a method for its manufacture
GB9914484D0 (en) Polishing apparatus and method for polishing a substrate
EP0806793A3 (en) Insulated wafer spacing mask for a substrate support chuck and method of fabricating same
GB2292254B (en) Method for polishing semiconductor substrate and apparatus for the same
SG75972A1 (en) Apparatus and process for delivering an abrasive suspension for the mechanical polishing of a substrate
GB2325467B (en) Process for producing material with hydrophilic surface
EP0999013A4 (en) POLISHING WHEEL AND SUBSTRATE POLISHING METHOD USING THIS GRINDING WHEEL
EP0999012A3 (en) Method and apparatus for polishing substrate
GB9718030D0 (en) Hydrophilic film and method for forming same on substrate
SG65092A1 (en) Substrate processing apparatus substrate support apparatus substrate processing method and substrate fabrication method
AU9687898A (en) Method and apparatus for coating diamond-like carbon onto particles
EP0863544A3 (en) Substrate for use in wafer attracting apparatus and manufacturing method thereof
AU6608698A (en) Method and device for printing on a carrier material using structured ice layer
AU5789596A (en) Method and apparatus for manufacturing abrasive articles
WO2000040784A3 (en) Methods for coating metallic articles
AU8585698A (en) Apparatus and method for treating a cathode material provided on a thin-film substrate
GB2332650B (en) Etching substrate material,etching process,and article obtained by etching
CA2321835A1 (en) Abrasive article and method for making the same
NZ500877A (en) Manufacturing catalysed hardware comprising adhering a porous structure, a ceramic carrier material and catalytic active material to a metallic surface
IL143257A0 (en) Coated diamond, method for preparing the same and composite material comprising the same
EP0739996A3 (en) Surface treating agent for plating and base material with the plating adhered thereto