HK1046252B - 組合式可控工作台預制系統和方法 - Google Patents

組合式可控工作台預制系統和方法

Info

Publication number
HK1046252B
HK1046252B HK02107476.6A HK02107476A HK1046252B HK 1046252 B HK1046252 B HK 1046252B HK 02107476 A HK02107476 A HK 02107476A HK 1046252 B HK1046252 B HK 1046252B
Authority
HK
Hong Kong
Prior art keywords
preparation system
controlled platen
platen preparation
modular controlled
modular
Prior art date
Application number
HK02107476.6A
Other languages
English (en)
Other versions
HK1046252A1 (en
Inventor
斯蒂芬‧格里芬
戴維‧迪亞斯
道格拉斯‧塞茨
羅伯特‧帕瑟里
Original Assignee
Engis公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engis公司 filed Critical Engis公司
Publication of HK1046252A1 publication Critical patent/HK1046252A1/xx
Publication of HK1046252B publication Critical patent/HK1046252B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/08—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)
HK02107476.6A 1999-04-02 2002-10-15 組合式可控工作台預制系統和方法 HK1046252B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12747699P 1999-04-02 1999-04-02
PCT/US2000/008616 WO2000059644A1 (en) 1999-04-02 2000-03-31 Modular controlled platen preparation system and method

Publications (2)

Publication Number Publication Date
HK1046252A1 HK1046252A1 (en) 2003-01-03
HK1046252B true HK1046252B (zh) 2007-10-05

Family

ID=22430331

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02107476.6A HK1046252B (zh) 1999-04-02 2002-10-15 組合式可控工作台預制系統和方法

Country Status (6)

Country Link
JP (1) JP3706306B2 (zh)
KR (1) KR20020000158A (zh)
CN (1) CN1313216C (zh)
AU (1) AU4058400A (zh)
HK (1) HK1046252B (zh)
WO (1) WO2000059644A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008009507B4 (de) * 2008-02-15 2010-09-02 Günter Effgen GmbH Verfahren und Vorrichtung zur Oberflächenbearbeitung extrem harter Werkstoffe
US20120289131A1 (en) * 2011-05-13 2012-11-15 Li-Chung Liu Cmp apparatus and method
JP5764031B2 (ja) * 2011-10-06 2015-08-12 株式会社ディスコ 切削装置
CN103481174B (zh) * 2013-09-03 2015-09-23 宇环数控机床股份有限公司 一种多边形或曲面工件的抛光方法
JP6192525B2 (ja) * 2013-12-13 2017-09-06 株式会社ディスコ 砥材埋め込み方法
KR102260655B1 (ko) * 2019-09-27 2021-06-04 (주)에스티아이 연마율 제어 기능을 구비한 cmp 장치
KR102257002B1 (ko) * 2019-09-27 2021-05-27 (주)에스티아이 연마 압력 제어 기능을 구비한 cmp 장치
CN112658981B (zh) * 2020-12-28 2022-11-25 郑州铁路职业技术学院 一种零部件表面处理用化学抛光机
KR20230167856A (ko) 2022-06-03 2023-12-12 대한민국(기상청 국립기상과학원장) 트리 기반 기계학습 알고리즘과 기상 예측 자료를 이용한 시정 예측 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2046097A (en) * 1934-05-08 1936-06-30 Summers Kenneth Edward Wheel dressing device for abrasive lapping machines
US3683562A (en) * 1970-09-24 1972-08-15 Spitfire Tool & Machine Co Inc Means for applying a liquid abrasive over the surface of a rotatable lapping table of a lapping machine
US3921342A (en) * 1973-12-17 1975-11-25 Spitfire Tool & Machine Co Inc Lap plate
US4037367A (en) * 1975-12-22 1977-07-26 Kruse James A Grinding tool
US4361595A (en) * 1981-01-28 1982-11-30 Rca Corporation Method for preparing an abrasive lapping disc
US4821461A (en) * 1987-11-23 1989-04-18 Magnetic Peripherals Inc. Textured lapping plate and process for its manufacture
EP0719737B1 (en) * 1990-01-31 2002-04-17 Bando Kiko Co. Ltd. Machine for working a glass plate
US5207759A (en) * 1991-09-20 1993-05-04 Hmt Technology Corporation Texturing slurry and method
US5827111A (en) * 1997-12-15 1998-10-27 Micron Technology, Inc. Method and apparatus for grinding wafers
US6050879A (en) * 1998-06-30 2000-04-18 Ibm Process for lapping air bearing surfaces

Also Published As

Publication number Publication date
WO2000059644A1 (en) 2000-10-12
CN1346300A (zh) 2002-04-24
JP2002540955A (ja) 2002-12-03
AU4058400A (en) 2000-10-23
HK1046252A1 (en) 2003-01-03
CN1313216C (zh) 2007-05-02
KR20020000158A (ko) 2002-01-04
JP3706306B2 (ja) 2005-10-12

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120331