HK1041105B - 具有陶瓷基板及晶粒結構的元件封裝方法 - Google Patents
具有陶瓷基板及晶粒結構的元件封裝方法Info
- Publication number
- HK1041105B HK1041105B HK02102598.0A HK02102598A HK1041105B HK 1041105 B HK1041105 B HK 1041105B HK 02102598 A HK02102598 A HK 02102598A HK 1041105 B HK1041105 B HK 1041105B
- Authority
- HK
- Hong Kong
- Prior art keywords
- grain structure
- encapsulation method
- ceramic baseplate
- baseplate
- ceramic
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00109203 CN1133205C (zh) | 2000-06-13 | 2000-06-13 | 具有陶瓷基板及晶粒结构的元件封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
HK1041105A1 HK1041105A1 (en) | 2002-06-28 |
HK1041105B true HK1041105B (zh) | 2004-04-30 |
Family
ID=4579496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02102598.0A HK1041105B (zh) | 2000-06-13 | 2002-04-08 | 具有陶瓷基板及晶粒結構的元件封裝方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1133205C (zh) |
HK (1) | HK1041105B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100438078C (zh) * | 2004-07-05 | 2008-11-26 | 广东风华高新科技股份有限公司 | 一种厚膜片式二极管及其制造方法 |
WO2007056890A1 (en) * | 2005-11-16 | 2007-05-24 | Tak Cheong Electronics (Shanwei) Co., Ltd. | Surface mounting plastic packaging diode and manufacture method of the same |
CN105632946B (zh) * | 2015-12-25 | 2018-09-28 | 通富微电子股份有限公司 | 用于封装结构的治具及封装结构的制备方法 |
DE102019113308A1 (de) * | 2019-05-20 | 2020-11-26 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Metall-Keramik-Substrats und Metall-Keramik- Substrat, hergestellt mit einem solchen Verfahren |
-
2000
- 2000-06-13 CN CN 00109203 patent/CN1133205C/zh not_active Expired - Lifetime
-
2002
- 2002-04-08 HK HK02102598.0A patent/HK1041105B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1133205C (zh) | 2003-12-31 |
CN1328342A (zh) | 2001-12-26 |
HK1041105A1 (en) | 2002-06-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20130613 |