HK1041105B - Encapsulation method for element having ceramic baseplate and grain structure - Google Patents

Encapsulation method for element having ceramic baseplate and grain structure

Info

Publication number
HK1041105B
HK1041105B HK02102598.0A HK02102598A HK1041105B HK 1041105 B HK1041105 B HK 1041105B HK 02102598 A HK02102598 A HK 02102598A HK 1041105 B HK1041105 B HK 1041105B
Authority
HK
Hong Kong
Prior art keywords
grain structure
encapsulation method
ceramic baseplate
baseplate
ceramic
Prior art date
Application number
HK02102598.0A
Other languages
Chinese (zh)
Other versions
HK1041105A1 (en
Inventor
許勝雄
Original Assignee
冠寶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 冠寶科技股份有限公司 filed Critical 冠寶科技股份有限公司
Publication of HK1041105A1 publication Critical patent/HK1041105A1/en
Publication of HK1041105B publication Critical patent/HK1041105B/en

Links

HK02102598.0A 2000-06-13 2002-04-08 Encapsulation method for element having ceramic baseplate and grain structure HK1041105B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 00109203 CN1133205C (en) 2000-06-13 2000-06-13 Process for preparing diode with ceramic substrate and crystal grain structure

Publications (2)

Publication Number Publication Date
HK1041105A1 HK1041105A1 (en) 2002-06-28
HK1041105B true HK1041105B (en) 2004-04-30

Family

ID=4579496

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102598.0A HK1041105B (en) 2000-06-13 2002-04-08 Encapsulation method for element having ceramic baseplate and grain structure

Country Status (2)

Country Link
CN (1) CN1133205C (en)
HK (1) HK1041105B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100438078C (en) * 2004-07-05 2008-11-26 广东风华高新科技股份有限公司 Thick film chip diode and its manufacturing method
WO2007056890A1 (en) * 2005-11-16 2007-05-24 Tak Cheong Electronics (Shanwei) Co., Ltd. Surface mounting plastic packaging diode and manufacture method of the same
CN105632946B (en) * 2015-12-25 2018-09-28 通富微电子股份有限公司 For the jig of encapsulating structure and the preparation method of encapsulating structure
DE102019113308A1 (en) * 2019-05-20 2020-11-26 Rogers Germany Gmbh A method for producing a metal-ceramic substrate and a metal-ceramic substrate produced by such a method

Also Published As

Publication number Publication date
HK1041105A1 (en) 2002-06-28
CN1133205C (en) 2003-12-31
CN1328342A (en) 2001-12-26

Similar Documents

Publication Publication Date Title
GB2354113B (en) Ceramic electronic component
AU2001267828A1 (en) Honeycomb ceramic structure and method for preparation thereof
HK1062867A1 (en) Method for securing digital information and systemtherefor
HK1041557B (en) An integrated circuit and method for preparation thereof
IL201751A (en) Il-17 like cytokine binding compound and antibodies
SG107570A1 (en) Substrate feeding device and method
HK1053012A1 (en) Semiconductor device and forming method thereof
GB0212073D0 (en) Digital binder and method therefor
GB0325008D0 (en) Semiconductor device and manufacturing method thereof
HK1029218A1 (en) Multi layer ceramic electronic parts and manufacturing method thereof.
EP1170801A4 (en) Bonded wafer producing method and bonded wafer
SG96218A1 (en) Sic-formed materials and method for manufacturing same
GB0014185D0 (en) Compound and method
GB0102646D0 (en) Recording material and method
GB0028142D0 (en) Semiconductor ceramic material and electronic part employing the same
HK1047655A1 (en) Semiconductor and manufacturing method for semiconductor
HK1041105A1 (en) Encapsulation method for element having ceramic baseplate and grain structure
IL148280A0 (en) Silicate-based sintering aid and method
EP1357099A4 (en) Porous material and method for preparation thereof
GB0022617D0 (en) Recording material and method
EP1553066A4 (en) Oriented silicon carbide sintered compact and method for preparation thereof
GB2353408B (en) Monolithic ceramic electronic component and method for manufacturing the same
GB0029149D0 (en) Monolithic semiconducting ceramic electronic component
IL128762A0 (en) Electronic dice
SG76596A1 (en) Semiconducting ceramic and semiconducting ceramic electronic element

Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130613