HK1039173A1 - 測量薄膜，特別是半導體襯底上的感光樹脂薄膜的厚度的方法與裝置 - Google Patents

測量薄膜，特別是半導體襯底上的感光樹脂薄膜的厚度的方法與裝置

Info

Publication number
HK1039173A1
HK1039173A1 HK02100576.0A HK02100576A HK1039173A1 HK 1039173 A1 HK1039173 A1 HK 1039173A1 HK 02100576 A HK02100576 A HK 02100576A HK 1039173 A1 HK1039173 A1 HK 1039173A1
Authority
HK
Hong Kong
Prior art keywords
thickness
film
measuring
semiconductor substrate
light
Prior art date
Application number
HK02100576.0A
Other languages
English (en)
Inventor
奧夫‧杜-努爾
Original Assignee
特維特過程控制技術有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 特維特過程控制技術有限公司 filed Critical 特維特過程控制技術有限公司
Publication of HK1039173A1 publication Critical patent/HK1039173A1/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
HK02100576.0A 1998-08-27 2002-01-25 測量薄膜，特別是半導體襯底上的感光樹脂薄膜的厚度的方法與裝置 HK1039173A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL12596498A IL125964A (en) 1998-08-27 1998-08-27 Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate
PCT/IL1999/000466 WO2000012958A1 (en) 1998-08-27 1999-08-26 Methods and apparatus for measuring the thickness of a film, particularly of a photoresist film on a semiconductor substrate

Publications (1)

Publication Number Publication Date
HK1039173A1 true HK1039173A1 (zh) 2002-04-12

Family

ID=11071900

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02100576.0A HK1039173A1 (zh) 1998-08-27 2002-01-25 測量薄膜，特別是半導體襯底上的感光樹脂薄膜的厚度的方法與裝置

Country Status (13)

Country Link
US (1) US6801321B1 (zh)
EP (1) EP1110054B1 (zh)
JP (1) JP2002523763A (zh)
KR (1) KR100694772B1 (zh)
CN (1) CN1151358C (zh)
AT (1) ATE280941T1 (zh)
AU (1) AU5385599A (zh)
CA (1) CA2341403A1 (zh)
DE (1) DE69921493T2 (zh)
HK (1) HK1039173A1 (zh)
IL (1) IL125964A (zh)
NO (1) NO20010910L (zh)
WO (1) WO2000012958A1 (zh)

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CN111279147A (zh) * 2017-11-01 2020-06-12 柯尼卡美能达株式会社 膜厚测定方法、膜厚测定系统、光反射膜的制造方法及光反射膜的制造系统
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CN112747681A (zh) * 2019-10-31 2021-05-04 佳陞科技有限公司 一种非破坏性光学检测系统
CN110986801A (zh) * 2019-11-15 2020-04-10 富泰华精密电子（郑州）有限公司 检测装置、检测设备及检测方法
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Also Published As

Publication number Publication date
IL125964A0 (en) 1999-04-11
WO2000012958A1 (en) 2000-03-09
NO20010910D0 (no) 2001-02-23
EP1110054A1 (en) 2001-06-27
AU5385599A (en) 2000-03-21
DE69921493D1 (de) 2004-12-02
CN1314991A (zh) 2001-09-26
ATE280941T1 (de) 2004-11-15
NO20010910L (no) 2001-04-27
CN1151358C (zh) 2004-05-26
EP1110054A4 (en) 2001-10-31
JP2002523763A (ja) 2002-07-30
KR20010072848A (ko) 2001-07-31
IL125964A (en) 2003-10-31
EP1110054B1 (en) 2004-10-27
US6801321B1 (en) 2004-10-05
CA2341403A1 (en) 2000-03-09
KR100694772B1 (ko) 2007-03-13
DE69921493T2 (de) 2006-02-02

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