HK1037203A1 - Lapping oil composition for finish-grinding. - Google Patents
Lapping oil composition for finish-grinding.Info
- Publication number
- HK1037203A1 HK1037203A1 HK01108048A HK01108048A HK1037203A1 HK 1037203 A1 HK1037203 A1 HK 1037203A1 HK 01108048 A HK01108048 A HK 01108048A HK 01108048 A HK01108048 A HK 01108048A HK 1037203 A1 HK1037203 A1 HK 1037203A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- finish
- grinding
- oil composition
- lapping oil
- lapping
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000008715A JP3971075B2 (ja) | 2000-01-18 | 2000-01-18 | 仕上げ研磨用ラッピングオイル組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1037203A1 true HK1037203A1 (en) | 2002-02-01 |
Family
ID=18536938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK01108048A HK1037203A1 (en) | 2000-01-18 | 2001-11-15 | Lapping oil composition for finish-grinding. |
Country Status (5)
Country | Link |
---|---|
US (1) | US6500049B2 (ja) |
JP (1) | JP3971075B2 (ja) |
CN (1) | CN1207374C (ja) |
HK (1) | HK1037203A1 (ja) |
SG (1) | SG98015A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030203731A1 (en) * | 2002-04-29 | 2003-10-30 | Lavaflow, Llp | Cellular telephone and method of displaying account information |
TWI256971B (en) * | 2002-08-09 | 2006-06-21 | Hitachi Chemical Co Ltd | CMP abrasive and method for polishing substrate |
US7306748B2 (en) * | 2003-04-25 | 2007-12-11 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machining ceramics |
US8025808B2 (en) * | 2003-04-25 | 2011-09-27 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machine ceramics |
US7419421B2 (en) * | 2004-05-04 | 2008-09-02 | Seagate Technology Llc | Slider having rounded corners and edges, and method for producing the same |
MX2007010898A (es) | 2005-03-08 | 2007-12-05 | Tokuyama Corp | Composicion lubricante para pulimentado de cabeza magnetica con abrasivo aglutinado. |
US20070066716A1 (en) * | 2005-09-19 | 2007-03-22 | Craig Daniel H | Nonpolar thermoplastic compositions including inorganic particulates |
US20070066715A1 (en) * | 2005-09-19 | 2007-03-22 | Craig Daniel H | Process for manufacturing nonpolar thermoplastic materials containing inorganic particulates |
US7455332B2 (en) * | 2005-11-16 | 2008-11-25 | Sae Magnetics (Hk) Ltd. | Method for controlling overcoat recession in a magnetic thin film head |
JP2007268658A (ja) | 2006-03-31 | 2007-10-18 | Tmp Co Ltd | 研磨シート及び研磨方法 |
JP2008124377A (ja) * | 2006-11-15 | 2008-05-29 | Jsr Corp | 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット |
KR101131796B1 (ko) * | 2006-12-20 | 2012-03-30 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 무기 비-금속성 피가공물 기계 가공방법 |
JP4898498B2 (ja) * | 2007-03-09 | 2012-03-14 | キヤノン株式会社 | 置換ポリアセチレン、複合体およびデバイス構造 |
US20100007976A1 (en) * | 2008-07-09 | 2010-01-14 | Baumgart Peter M | Protecting magnetic head elements |
TWI407462B (zh) * | 2009-05-15 | 2013-09-01 | Cyntec Co Ltd | 電感器及其製作方法 |
JP5464055B2 (ja) * | 2009-06-02 | 2014-04-09 | 日信化学工業株式会社 | 水性切削液及び水性切削剤 |
JP2011110637A (ja) * | 2009-11-25 | 2011-06-09 | Asahi Glass Co Ltd | 磁気ディスク用ガラス基板の製造方法 |
CN102376310A (zh) * | 2010-08-13 | 2012-03-14 | 新科实业有限公司 | 用于形成磁头的磁条以及制造磁头的方法 |
CN105580078B (zh) * | 2013-09-28 | 2019-11-05 | Hoya株式会社 | 玻璃基板的制造方法和磁盘的制造方法 |
CN106929858A (zh) * | 2015-12-31 | 2017-07-07 | 安集微电子科技(上海)有限公司 | 金属化学机械抛光浆料 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5698294A (en) * | 1980-01-09 | 1981-08-07 | Honda Motor Co Ltd | Water-soluble cutting oil |
JPS572367A (en) * | 1980-06-07 | 1982-01-07 | Kansai Paint Co Ltd | Water-dispersed thermosetting resin slurry paint composition |
JPS61152369A (ja) * | 1984-12-27 | 1986-07-11 | Mitsui Toatsu Chem Inc | 湿式ブラスト方法 |
US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
US5942015A (en) * | 1997-09-16 | 1999-08-24 | 3M Innovative Properties Company | Abrasive slurries and abrasive articles comprising multiple abrasive particle grades |
US5968238A (en) * | 1998-02-18 | 1999-10-19 | Turtle Wax, Inc. | Polishing composition including water soluble polishing agent |
SG108221A1 (en) * | 1999-03-15 | 2005-01-28 | Tokyo Magnetic Printing | Free abrasive slurry compositions and a grinding method using the same |
-
2000
- 2000-01-18 JP JP2000008715A patent/JP3971075B2/ja not_active Expired - Fee Related
- 2000-12-26 US US09/747,684 patent/US6500049B2/en not_active Expired - Fee Related
- 2000-12-29 SG SG200007705A patent/SG98015A1/en unknown
-
2001
- 2001-01-18 CN CN01103041.0A patent/CN1207374C/zh not_active Expired - Lifetime
- 2001-11-15 HK HK01108048A patent/HK1037203A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2001200244A (ja) | 2001-07-24 |
US20010009840A1 (en) | 2001-07-26 |
JP3971075B2 (ja) | 2007-09-05 |
US6500049B2 (en) | 2002-12-31 |
SG98015A1 (en) | 2003-08-20 |
CN1309167A (zh) | 2001-08-22 |
CN1207374C (zh) | 2005-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20140118 |