HK1021347A1 - Sealing ejector pin - Google Patents

Sealing ejector pin

Info

Publication number
HK1021347A1
HK1021347A1 HK99106012A HK99106012A HK1021347A1 HK 1021347 A1 HK1021347 A1 HK 1021347A1 HK 99106012 A HK99106012 A HK 99106012A HK 99106012 A HK99106012 A HK 99106012A HK 1021347 A1 HK1021347 A1 HK 1021347A1
Authority
HK
Hong Kong
Prior art keywords
ejector pin
sealing ejector
sealing
pin
ejector
Prior art date
Application number
HK99106012A
Other languages
English (en)
Inventor
Johannes Lambertus Ge Venrooij
Marcel Gerardus Anton Tomassen
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of HK1021347A1 publication Critical patent/HK1021347A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C45/401—Ejector pin constructions or mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C45/401—Ejector pin constructions or mountings
    • B29C2045/4015—Ejector pins provided with sealing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C2045/4094—Ejectors located on the fixed mould half
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/047—Seal ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
HK99106012A 1996-11-06 1999-12-21 Sealing ejector pin HK1021347A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1004460A NL1004460C2 (nl) 1996-11-06 1996-11-06 Ejectorpen, vormdeel en mal voor het omhullen van electronische componenten alsmede een werkwijze voor het afdichten van een tussenruimte.
PCT/NL1997/000603 WO1998019845A2 (en) 1996-11-06 1997-11-04 Sealing ejectorpin

Publications (1)

Publication Number Publication Date
HK1021347A1 true HK1021347A1 (en) 2000-06-09

Family

ID=19763817

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99106012A HK1021347A1 (en) 1996-11-06 1999-12-21 Sealing ejector pin

Country Status (8)

Country Link
US (1) US6179599B1 (xx)
EP (1) EP0923444B1 (xx)
AU (1) AU5883898A (xx)
DE (1) DE69727685T2 (xx)
HK (1) HK1021347A1 (xx)
NL (1) NL1004460C2 (xx)
TW (1) TW407120B (xx)
WO (1) WO1998019845A2 (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2791596B1 (fr) * 1999-04-02 2001-04-27 Renault Dispositif d'ejection pour moule avec injection de resine
GB2351930B (en) * 1999-07-15 2003-09-24 Sternford Ltd A method and a mould for moulding an article
JP3784597B2 (ja) * 1999-12-27 2006-06-14 沖電気工業株式会社 封止樹脂及び樹脂封止型半導体装置
JP3394516B2 (ja) * 2000-10-06 2003-04-07 エヌイーシーセミコンダクターズ九州株式会社 樹脂封止金型
US6837700B2 (en) * 2002-10-11 2005-01-04 Tung-Jung Chen Mold article ejecting device used for an injection molding apparatus
US7300268B2 (en) * 2005-12-15 2007-11-27 Lear Corporation Low-density part injection molding system
US20080057528A1 (en) * 2006-08-30 2008-03-06 Kimberly-Clark Worldwide, Inc. Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte
JP2016013675A (ja) * 2014-07-03 2016-01-28 株式会社小糸製作所 光学部品の製造方法、製造装置および光学部品

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3897929A (en) * 1974-08-12 1975-08-05 Nat Tool And Manufacturing Co Recessed sprue bushing for a three-plate mold set
JPH074837B2 (ja) * 1988-07-19 1995-01-25 株式会社富士通宮城エレクトロニクス モールド金型
JPH03258519A (ja) * 1990-03-08 1991-11-18 Toshiba Corp 成形金型
JPH0596583A (ja) * 1991-10-11 1993-04-20 Inoac Corp ゴム用射出成形金型の成形品突き出し機構
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
NL9400768A (nl) * 1994-05-09 1995-12-01 Fico Bv Inrichting voor het met kunststof omhullen van een leadframe met chips.
JP2943637B2 (ja) * 1994-11-25 1999-08-30 住友電装株式会社 管状弾性品の離型装置

Also Published As

Publication number Publication date
NL1004460C2 (nl) 1998-05-08
EP0923444B1 (en) 2004-02-18
TW407120B (en) 2000-10-01
US6179599B1 (en) 2001-01-30
DE69727685D1 (de) 2004-03-25
EP0923444A2 (en) 1999-06-23
AU5883898A (en) 1998-05-29
DE69727685T2 (de) 2005-01-13
WO1998019845A2 (en) 1998-05-14
WO1998019845A3 (en) 2002-10-03
EP0923444A3 (en) 2002-11-20

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20071104