HK1008552B - 对非导电材料制造的基体表面进行选择性或部分电解涂敷金属的方法 - Google Patents

对非导电材料制造的基体表面进行选择性或部分电解涂敷金属的方法 Download PDF

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Publication number
HK1008552B
HK1008552B HK98108815.9A HK98108815A HK1008552B HK 1008552 B HK1008552 B HK 1008552B HK 98108815 A HK98108815 A HK 98108815A HK 1008552 B HK1008552 B HK 1008552B
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HK
Hong Kong
Prior art keywords
metal
plastics material
solution
treatment
moulded plastics
Prior art date
Application number
HK98108815.9A
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German (de)
English (en)
French (fr)
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HK1008552A1 (zh
Inventor
Middeke Hermann
Mc Caskie John
H. Joshi Nayan
Original Assignee
阿托技术德国有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from DE19510855A external-priority patent/DE19510855C2/de
Application filed by 阿托技术德国有限公司 filed Critical 阿托技术德国有限公司
Publication of HK1008552A1 publication Critical patent/HK1008552A1/zh
Publication of HK1008552B publication Critical patent/HK1008552B/zh

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Abstract

本发明涉及一种用于选择性或部分电解金属化由不导电材料制成的基底的表面的方法，所述基底为了涂覆过程而被固定到塑料涂覆的保持元件上。所提出的方法包括以下步骤：a)用含有氧化铬(VI)的蚀刻溶液对所述表面进行预处理；随后立即b)用钯/锌化合物的胶体酸性溶液处理表面，小心防止与吸附促进溶液的预先接触；c)用含有能被锌(II)化合物还原的可溶性金属化合物、碱金属或碱土金属氢氧化物和其量足以至少防止金属氢氧化物沉淀的金属络合剂的溶液处理表面；d)用电解金属化溶液处理表面。通过应用该工艺，可以确保仅工件的表面涂覆有金属，而不是保持元件，或者在可应用的情况下，涂覆有施加到工件的部分的非导电塑料层。此外，该方法甚至在大的塑料表面上也有利于直接电解金属化，而不需要先前的无电流金属化。
HK98108815.9A 1995-03-17 1996-03-15 对非导电材料制造的基体表面进行选择性或部分电解涂敷金属的方法 HK1008552B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19510855.8 1995-03-17
DE19510855A DE19510855C2 (de) 1995-03-17 1995-03-17 Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
PCT/EP1996/001190 WO1996029452A1 (de) 1995-03-17 1996-03-15 Verfahren zum selektiven oder partiellen elektrolytischen metallisieren von oberflächen von substraten aus nichtleitenden materialien

Publications (2)

Publication Number Publication Date
HK1008552A1 HK1008552A1 (zh) 1999-05-14
HK1008552B true HK1008552B (zh) 2000-07-14

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