HK1008265A1 - Ballast monitoring for radio frequency power transistors - Google Patents

Ballast monitoring for radio frequency power transistors

Info

Publication number
HK1008265A1
HK1008265A1 HK98109244A HK98109244A HK1008265A1 HK 1008265 A1 HK1008265 A1 HK 1008265A1 HK 98109244 A HK98109244 A HK 98109244A HK 98109244 A HK98109244 A HK 98109244A HK 1008265 A1 HK1008265 A1 HK 1008265A1
Authority
HK
Hong Kong
Prior art keywords
radio frequency
frequency power
power transistors
ballast monitoring
ballast
Prior art date
Application number
HK98109244A
Other languages
English (en)
Inventor
Ted Johansson
Larry Leighton
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of HK1008265A1 publication Critical patent/HK1008265A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692—Surface layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41708—Emitter or collector electrodes for bipolar transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • H01L29/7302—Bipolar junction transistors structurally associated with other devices
    • H01L29/7304—Bipolar junction transistors structurally associated with other devices the device being a resistive element, e.g. ballasting resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
HK98109244A 1994-11-03 1998-07-17 Ballast monitoring for radio frequency power transistors HK1008265A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33541394A 1994-11-03 1994-11-03
PCT/SE1995/001294 WO1996014665A1 (en) 1994-11-03 1995-11-01 Ballast monitoring for radio frequency power transistors

Publications (1)

Publication Number Publication Date
HK1008265A1 true HK1008265A1 (en) 1999-05-07

Family

ID=23311672

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98109244A HK1008265A1 (en) 1994-11-03 1998-07-17 Ballast monitoring for radio frequency power transistors

Country Status (11)

Country Link
US (1) US5907180A (xx)
EP (1) EP0789934B1 (xx)
JP (1) JPH10508721A (xx)
KR (1) KR100301099B1 (xx)
CN (1) CN1087502C (xx)
AU (1) AU3885095A (xx)
CA (1) CA2204382A1 (xx)
DE (1) DE69528280T2 (xx)
FI (1) FI971890A (xx)
HK (1) HK1008265A1 (xx)
WO (1) WO1996014665A1 (xx)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804867A (en) * 1996-10-02 1998-09-08 Ericsson Inc. Thermally balanced radio frequency power transistor
US6483188B1 (en) * 2000-05-15 2002-11-19 Atheros Communications, Inc. Rf integrated circuit layout
JP2003045882A (ja) * 2001-07-27 2003-02-14 Nec Corp 半導体装置及びその設計方法
FR2832548B1 (fr) * 2001-11-16 2004-01-02 United Monolithic Semiconduct Transistor hyperfrequence de puissance
EP1517437A1 (de) * 2003-09-19 2005-03-23 Siemens Aktiengesellschaft HF-Leistungsverstärker mit Betriebsstrommesseinrichtung
US7079004B2 (en) * 2003-10-10 2006-07-18 Agilent Technologies, Inc. Precision thin film AC voltage divider
US7038327B2 (en) * 2003-11-11 2006-05-02 Au Optronics Corp. Anisotropic conductive film bonding pad
JP2005217997A (ja) * 2004-02-02 2005-08-11 Matsushita Electric Ind Co Ltd 高周波増幅器
TWI243386B (en) * 2004-02-26 2005-11-11 Au Optronics Corp Anisotropic conductive film pad
DE102004014731B4 (de) 2004-03-25 2007-05-03 Infineon Technologies Ag Mess-Schaltung für den Ausgang eines Leistungsverstärkers sowie ein die Mess-Schaltung umfassender Leistungsverstärker
JP5004654B2 (ja) * 2007-05-16 2012-08-22 パナソニック株式会社 配線基板の接続方法および配線基板構造
US8563336B2 (en) 2008-12-23 2013-10-22 International Business Machines Corporation Method for forming thin film resistor and terminal bond pad simultaneously
US9520742B2 (en) 2014-07-03 2016-12-13 Hubbell Incorporated Monitoring system and method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3896475A (en) * 1972-01-28 1975-07-22 Philips Corp Semiconductor device comprising resistance region having portions lateral to conductors
IT1038800B (it) * 1975-06-10 1979-11-30 Ates Componenti Elettron Tranistore planare di potenza
US4656496A (en) * 1985-02-04 1987-04-07 National Semiconductor Corporation Power transistor emitter ballasting
FR2615326B1 (fr) * 1987-05-15 1990-08-31 Fuji Electric Co Ltd Dispositif a semi-conducteurs du type multi-emetteur
US5298785A (en) * 1987-05-15 1994-03-29 Fuji Electric Co., Ltd. Semiconductor device
US5204735A (en) * 1988-04-21 1993-04-20 Kabushiki Kaisha Toshiba High-frequency semiconductor device having emitter stabilizing resistor and method of manufacturing the same
US5061863A (en) * 1989-05-16 1991-10-29 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Transistor provided with a current detecting function
US5023693A (en) * 1989-06-06 1991-06-11 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Transistor with current sensing function
JPH07109831B2 (ja) * 1990-01-25 1995-11-22 株式会社東芝 半導体装置
US5387813A (en) * 1992-09-25 1995-02-07 National Semiconductor Corporation Transistors with emitters having at least three sides

Also Published As

Publication number Publication date
US5907180A (en) 1999-05-25
EP0789934A1 (en) 1997-08-20
AU3885095A (en) 1996-05-31
WO1996014665A1 (en) 1996-05-17
FI971890A (fi) 1997-07-02
CN1171168A (zh) 1998-01-21
EP0789934B1 (en) 2002-09-18
KR100301099B1 (ko) 2001-11-22
DE69528280T2 (de) 2003-05-22
DE69528280D1 (de) 2002-10-24
CN1087502C (zh) 2002-07-10
FI971890A0 (fi) 1997-05-02
CA2204382A1 (en) 1996-05-17
JPH10508721A (ja) 1998-08-25

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20061101