HK1000564A1 - Integrated circuit contacts with secured stringers - Google Patents
Integrated circuit contacts with secured stringersInfo
- Publication number
- HK1000564A1 HK1000564A1 HK97102069A HK97102069A HK1000564A1 HK 1000564 A1 HK1000564 A1 HK 1000564A1 HK 97102069 A HK97102069 A HK 97102069A HK 97102069 A HK97102069 A HK 97102069A HK 1000564 A1 HK1000564 A1 HK 1000564A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- integrated circuit
- circuit contacts
- stringers
- secured
- secured stringers
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
- H01L21/76844—Bottomless liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/501,503 US5583380A (en) | 1995-07-11 | 1995-07-11 | Integrated circuit contacts with secured stringers |
PCT/US1996/007940 WO1997003464A1 (fr) | 1995-07-11 | 1996-05-29 | Contacts de circuit integre dotes de lisses |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1000564A1 true HK1000564A1 (en) | 2004-05-14 |
Family
ID=23993829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK97102069A HK1000564A1 (en) | 1995-07-11 | 1997-10-31 | Integrated circuit contacts with secured stringers |
Country Status (8)
Country | Link |
---|---|
US (1) | US5583380A (fr) |
EP (1) | EP0781455A4 (fr) |
JP (1) | JPH10505957A (fr) |
KR (1) | KR100389607B1 (fr) |
CN (1) | CN1118869C (fr) |
HK (1) | HK1000564A1 (fr) |
TW (1) | TW299491B (fr) |
WO (1) | WO1997003464A1 (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5851923A (en) * | 1996-01-18 | 1998-12-22 | Micron Technology, Inc. | Integrated circuit and method for forming and integrated circuit |
US5874356A (en) * | 1997-02-28 | 1999-02-23 | Taiwan Semiconductor Manufacturing Co. Ltd. | Method for forming zig-zag bordered openings in semiconductor structures |
US6943063B2 (en) * | 2001-11-20 | 2005-09-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | RF seal ring structure |
US9412123B2 (en) | 2003-07-01 | 2016-08-09 | The 41St Parameter, Inc. | Keystroke analysis |
US6888238B1 (en) * | 2003-07-09 | 2005-05-03 | Altera Corporation | Low warpage flip chip package solution-channel heat spreader |
US10999298B2 (en) | 2004-03-02 | 2021-05-04 | The 41St Parameter, Inc. | Method and system for identifying users and detecting fraud by use of the internet |
US8346593B2 (en) | 2004-06-30 | 2013-01-01 | Experian Marketing Solutions, Inc. | System, method, and software for prediction of attitudinal and message responsiveness |
US11301585B2 (en) | 2005-12-16 | 2022-04-12 | The 41St Parameter, Inc. | Methods and apparatus for securely displaying digital images |
US8151327B2 (en) | 2006-03-31 | 2012-04-03 | The 41St Parameter, Inc. | Systems and methods for detection of session tampering and fraud prevention |
US9112850B1 (en) | 2009-03-25 | 2015-08-18 | The 41St Parameter, Inc. | Systems and methods of sharing information through a tag-based consortium |
US10754913B2 (en) | 2011-11-15 | 2020-08-25 | Tapad, Inc. | System and method for analyzing user device information |
CN102446961B (zh) * | 2011-12-09 | 2014-05-28 | 无锡中星微电子有限公司 | 包含功率器件的半导体装置及其制备方法 |
US9633201B1 (en) | 2012-03-01 | 2017-04-25 | The 41St Parameter, Inc. | Methods and systems for fraud containment |
US9521551B2 (en) | 2012-03-22 | 2016-12-13 | The 41St Parameter, Inc. | Methods and systems for persistent cross-application mobile device identification |
EP2880619A1 (fr) | 2012-08-02 | 2015-06-10 | The 41st Parameter, Inc. | Systèmes et procédés d'accès à des enregistrements via des localisateurs de dérivé |
WO2014078569A1 (fr) | 2012-11-14 | 2014-05-22 | The 41St Parameter, Inc. | Systèmes et procédés d'identification globale |
US10902327B1 (en) | 2013-08-30 | 2021-01-26 | The 41St Parameter, Inc. | System and method for device identification and uniqueness |
US11257117B1 (en) | 2014-06-25 | 2022-02-22 | Experian Information Solutions, Inc. | Mobile device sighting location analytics and profiling system |
US10091312B1 (en) | 2014-10-14 | 2018-10-02 | The 41St Parameter, Inc. | Data structures for intelligently resolving deterministic and probabilistic device identifiers to device profiles and/or groups |
US9767309B1 (en) | 2015-11-23 | 2017-09-19 | Experian Information Solutions, Inc. | Access control system for implementing access restrictions of regulated database records while identifying and providing indicators of regulated database records matching validation criteria |
US20180060954A1 (en) | 2016-08-24 | 2018-03-01 | Experian Information Solutions, Inc. | Sensors and system for detection of device movement and authentication of device user based on messaging service data from service provider |
US11682041B1 (en) | 2020-01-13 | 2023-06-20 | Experian Marketing Solutions, Llc | Systems and methods of a tracking analytics platform |
JP7259063B2 (ja) * | 2020-04-17 | 2023-04-17 | 寧徳時代新能源科技股▲分▼有限公司 | 端部カバーアセンブリ、電池セル、電池モジュール及び装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57112027A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH03142934A (ja) * | 1989-10-30 | 1991-06-18 | Mitsubishi Electric Corp | 半導体集積回路装置の配線接続構造 |
US5480820A (en) * | 1993-03-29 | 1996-01-02 | Motorola, Inc. | Method of making a vertically formed neuron transistor having a floating gate and a control gate and a method of formation |
-
1995
- 1995-07-11 US US08/501,503 patent/US5583380A/en not_active Expired - Lifetime
-
1996
- 1996-05-29 CN CN96190055A patent/CN1118869C/zh not_active Expired - Fee Related
- 1996-05-29 KR KR1019960705777A patent/KR100389607B1/ko not_active IP Right Cessation
- 1996-05-29 WO PCT/US1996/007940 patent/WO1997003464A1/fr not_active Application Discontinuation
- 1996-05-29 EP EP96916739A patent/EP0781455A4/fr not_active Withdrawn
- 1996-05-29 JP JP8527874A patent/JPH10505957A/ja not_active Ceased
- 1996-07-06 TW TW085108197A patent/TW299491B/zh active
-
1997
- 1997-10-31 HK HK97102069A patent/HK1000564A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1118869C (zh) | 2003-08-20 |
EP0781455A4 (fr) | 2000-03-01 |
US5583380A (en) | 1996-12-10 |
TW299491B (fr) | 1997-03-01 |
CN1159250A (zh) | 1997-09-10 |
WO1997003464A1 (fr) | 1997-01-30 |
KR100389607B1 (ko) | 2003-09-26 |
EP0781455A1 (fr) | 1997-07-02 |
JPH10505957A (ja) | 1998-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20100529 |