GB998210A - Improvements in fluid-operated presses - Google Patents

Improvements in fluid-operated presses

Info

Publication number
GB998210A
GB998210A GB4566161A GB4566161A GB998210A GB 998210 A GB998210 A GB 998210A GB 4566161 A GB4566161 A GB 4566161A GB 4566161 A GB4566161 A GB 4566161A GB 998210 A GB998210 A GB 998210A
Authority
GB
United Kingdom
Prior art keywords
workpiece
pad
tray
casing
liner member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4566161A
Inventor
Eugene Grankowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Verson Allsteel Press Co
Original Assignee
Verson Allsteel Press Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Verson Allsteel Press Co filed Critical Verson Allsteel Press Co
Publication of GB998210A publication Critical patent/GB998210A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/10—Stamping using yieldable or resilient pads
    • B21D22/12—Stamping using yieldable or resilient pads using enclosed flexible chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)

Abstract

998,210. Hydraulic presses. VERSON ALLSTEEL PRESS CO. Dec. 20, 1961, No. 45661/61. Heading B5F. A fluid-operated press comprises an expansible diaphragm means 22 lining the interior surface of a deformable work - engaging pad 94 which is adapted to be expanded and pressed against a workpiece 74 and has a relatively thick central body and peripheral flange bent inwardly to partially lap adjacent portions of the body and provide therewith a recess for receiving portions 124 of a mounting liner member 106, the marginal portion 132 of the flange being of thickness greater than the adjacent portion merging into the body for providing a wedging portion co-operative with the liner for restricting displacement of the flange from its assembled position. The liner member 106 is formed with the flanged portion 124 around which the diaphragm and workengaging pad 84 are disposed, the diaphragm being secured to the liner member by adhesive 130. The pad is disposed within a roof casting 86 to which the liner member is attached by a hollow stem 108 passing through the casting and a bush 112 in an outer casing 12, a nut 114 being threaded on the outer end of the stem. A tray 22 having rollers 23, 24 engaging guideways 42 is movable by a rack-and-pinion mechanism 46, 50 from a work-loading position outside the casing to an operative position within the casing to locate the workpiece 74 on a die 72 beneath the pad 94 so that when hydraulic pressure is supplied through the stem 108, the pad is deformed to press the workpiece against the die. Extrusion of the pad into the space 136 between the tray 22 and casting 86 is prevented by a sealing ring 138 which may be of extruded aluminium. When the tray is in its operative position, the rollers 23, 24 are disposed above portions 58, 64 of the guideways which move against springs 60, 68 to permit the load on the tray during the pressing operation to be taken by the casing 12. Two trays may be provided to permit loading of a workpiece on one tray whilst a workpiece is being formed on the other. Means for heating the workpiece may be provided in the tray 22.
GB4566161A 1962-01-10 1961-12-20 Improvements in fluid-operated presses Expired GB998210A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH30962A CH388232A (en) 1962-01-10 1962-01-10 Hydraulic press

Publications (1)

Publication Number Publication Date
GB998210A true GB998210A (en) 1965-07-14

Family

ID=4184055

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4566161A Expired GB998210A (en) 1962-01-10 1961-12-20 Improvements in fluid-operated presses

Country Status (2)

Country Link
CH (1) CH388232A (en)
GB (1) GB998210A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0310842A1 (en) * 1987-10-07 1989-04-12 BÖWE-PASSAT Reinigungs- und Wäschereitechnik GmbH Combined cylinder and piston pressing machine for pressing liquid out of a pressed material
EP0699516A1 (en) * 1994-07-15 1996-03-06 Verson Europa S.A. Diaphragm for pressure cell type forming press and method for its manufacture
US5967030A (en) * 1995-11-17 1999-10-19 Micron Technology, Inc. Global planarization method and apparatus
US6218316B1 (en) 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6316363B1 (en) 1999-09-02 2001-11-13 Micron Technology, Inc. Deadhesion method and mechanism for wafer processing
US6331488B1 (en) 1997-05-23 2001-12-18 Micron Technology, Inc. Planarization process for semiconductor substrates
US6518172B1 (en) 2000-08-29 2003-02-11 Micron Technology, Inc. Method for applying uniform pressurized film across wafer

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0310842A1 (en) * 1987-10-07 1989-04-12 BÖWE-PASSAT Reinigungs- und Wäschereitechnik GmbH Combined cylinder and piston pressing machine for pressing liquid out of a pressed material
EP0699516A1 (en) * 1994-07-15 1996-03-06 Verson Europa S.A. Diaphragm for pressure cell type forming press and method for its manufacture
US6683003B2 (en) 1995-11-17 2004-01-27 Micron Technology, Inc. Global planarization method and apparatus
US5967030A (en) * 1995-11-17 1999-10-19 Micron Technology, Inc. Global planarization method and apparatus
US6062133A (en) * 1995-11-17 2000-05-16 Micron Technology, Inc. Global planarization method and apparatus
US6237483B1 (en) 1995-11-17 2001-05-29 Micron Technology, Inc. Global planarization method and apparatus
US6743724B2 (en) 1997-05-23 2004-06-01 Micron Technology, Inc. Planarization process for semiconductor substrates
US6693034B2 (en) 1997-05-23 2004-02-17 Micron Technology, Inc. Deadhesion method and mechanism for wafer processing
US6331488B1 (en) 1997-05-23 2001-12-18 Micron Technology, Inc. Planarization process for semiconductor substrates
US6403499B2 (en) 1998-10-22 2002-06-11 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6677252B2 (en) 1998-10-22 2004-01-13 Micron Technology, Inc. Methods for planarization of non-planar surfaces in device fabrication
US6218316B1 (en) 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6506679B2 (en) 1999-09-02 2003-01-14 Micron Technology, Inc. Deadhesion method and mechanism for wafer processing
US6316363B1 (en) 1999-09-02 2001-11-13 Micron Technology, Inc. Deadhesion method and mechanism for wafer processing
US6518172B1 (en) 2000-08-29 2003-02-11 Micron Technology, Inc. Method for applying uniform pressurized film across wafer
US6653722B2 (en) 2000-08-29 2003-11-25 Micron Technology, Inc. Method for applying uniform pressurized film across wafer
US6828227B2 (en) 2000-08-29 2004-12-07 Micron Technology, Inc. Method for applying uniform pressurized film across wafer

Also Published As

Publication number Publication date
CH388232A (en) 1965-02-28

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