GB995527A - Alloy-diffused transistor - Google Patents

Alloy-diffused transistor

Info

Publication number
GB995527A
GB995527A GB10546/64A GB1054664A GB995527A GB 995527 A GB995527 A GB 995527A GB 10546/64 A GB10546/64 A GB 10546/64A GB 1054664 A GB1054664 A GB 1054664A GB 995527 A GB995527 A GB 995527A
Authority
GB
United Kingdom
Prior art keywords
alloyed
layer
region
antimony
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB10546/64A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB995527A publication Critical patent/GB995527A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/228Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a liquid phase, e.g. alloy diffusion processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/035Diffusion through a layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Bipolar Transistors (AREA)

Abstract

995,527. Semi-conductor devices. MOTOROLA Inc. March 12, 1964 [March 22, 1963], 10546/64. Heading H1K. In a transistor comprising a semi-conductor body of one conductivity type having an alloyed layer of opposite conductivity type on one face and having an emitter region of the first conductivity type alloyed through the layer, the base region of the opposite conductivity type is diffused out of the alloyed emitter region. As shown, Fig. 3, a wafer 30 of P-type germanium has a disc of lead doped with antimony alloyed to its surface to form an N+ type regrown layer 26. Any lead or antimony remaining on the surface is removed by etching the wafer in a mixture of acetic acid and hydrogen peroxide. A collector contact 22 of lead doped with gallium is alloyed to the lower face of the wafer. An emitter ring 23 of lead doped with 0À8% gallium and 1À2% antimony is alloyed to the upper surface of the wafer so that the molten alloyed region extends through the regrown layer 26. The temperature is then reduced to allow a small amount of regrowth and maintained at this level for a sufficient time to allow the antimony, which has a higher diffusion constant than gallium, to diffuse out of the alloyed emitter region to form a thin N-type base region 27 connected to alloyed region 26. During the diffusion gallium and antimony evaporate from the emitter and form a very thin P-type layer and a thicker N-type layer in the exposed surfaces of the wafer. This thin P-type layer is removed using a light chemical etch and circular base contact 24 and annular base contact 25, both of lead doped with antimony, are then alloyed to layer 26. The surface of the base region is masked with wax and the collector is subjected to an electrolytic or chemical etch. The wax is removed and the base region etched lightly to clean the emitter junction. The device is washed in deionized water and encapsulated in the hermetically sealed housing shown in Fig. 1. Contact 22 is joined to the mounting base 13, the conducting strap 15 is joined to emitter contact 23 at two plates, and conducting strap 16 is joined to base contact 25 and has an arch 17 which makes contact with the central base contact 24. The housing is filled with nitrogen before it is sealed. Typical characteristics of the transistor are given.
GB10546/64A 1963-03-22 1964-03-12 Alloy-diffused transistor Expired GB995527A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US267220A US3309244A (en) 1963-03-22 1963-03-22 Alloy-diffused method for producing semiconductor devices

Publications (1)

Publication Number Publication Date
GB995527A true GB995527A (en) 1965-06-16

Family

ID=23017838

Family Applications (1)

Application Number Title Priority Date Filing Date
GB10546/64A Expired GB995527A (en) 1963-03-22 1964-03-12 Alloy-diffused transistor

Country Status (9)

Country Link
US (1) US3309244A (en)
JP (1) JPS4911033B1 (en)
BE (1) BE645252A (en)
DE (1) DE1935088U (en)
DK (1) DK117363B (en)
FR (1) FR1397401A (en)
GB (1) GB995527A (en)
NL (1) NL6402683A (en)
NO (1) NO116431B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577045A (en) * 1968-09-18 1971-05-04 Gen Electric High emitter efficiency simiconductor device with low base resistance and by selective diffusion of base impurities
US3905844A (en) * 1971-06-15 1975-09-16 Matsushita Electric Ind Co Ltd Method of making a PN junction device by metal dot alloying and recrystallization

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB807995A (en) * 1955-09-02 1959-01-28 Gen Electric Co Ltd Improvements in or relating to the production of semiconductor bodies
US2943006A (en) * 1957-05-06 1960-06-28 Westinghouse Electric Corp Diffused transistors and processes for making the same
NL257150A (en) * 1960-10-22 1900-01-01
US3211594A (en) * 1961-12-19 1965-10-12 Hughes Aircraft Co Semiconductor device manufacture

Also Published As

Publication number Publication date
DK117363B (en) 1970-04-20
US3309244A (en) 1967-03-14
DE1935088U (en) 1966-03-24
NO116431B (en) 1969-03-24
FR1397401A (en) 1965-04-30
NL6402683A (en) 1964-09-23
BE645252A (en) 1964-07-16
JPS4911033B1 (en) 1974-03-14

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